Abstract: A chip package structure, manufacturing method thereof, and module are described. In an embodiment, the chip package structure includes: a substrate, a wiring layer, a chip, and a second conductive bump, wherein, in an embodiment, the substrate includes a first region and a second region surrounding the first region, and the wiring layer is located on side of the substrate and includes metal wire, wherein at least part of a metal wire is in contact with the substrate in direction perpendicular to the substrate, and the metal wire overlaps with the second region, wherein the chip is located on side of the wiring layer facing away from the substrate, and the chip corresponds to the first region. In an embodiment, a first conductive bump is provided on side of the chip facing away from the substrate and is electrically connected to the metal wire.

Abstract: An obstacle detection system includes a light emitter that emits a light signal and a light detector configured to receive a portion of the light signal reflected back from an object. The system includes a processor operatively coupled to the light emitter and the light detector to determine a presence of an obstacle based on the portion of the light signal received by the light detector. The system includes a heater operatively coupled to a power source and at least one sensor configured to determine an ambient temperature and an ambient relative humidity. The processor is operatively coupled to the power source, the heater, and the at least one sensor. The processor is configured to calculate a dew point of the environment from the ambient relative humidity and the ambient temperature and to activate the heater in response to the ambient temperature being less than the dew point.

Abstract: The present invention relates to a master cylinder arrangement for a brake system, comprising a tandem master cylinder including a master cylinder housing, a first master piston movably arranged in the master cylinder housing, a second master piston movably arranged in the master cylinder housing, a balancing piston movably arranged in the second master piston, and an elastic pedal feel element. The invention further relates to a hydraulic system for a brake system as well as a brake system.

Abstract: A wheeled cart includes a collapsible basket assembly configured to transport a variety of objects placed within. A brake lever arm is pivotably attached to the basket assembly and pivotable about a brake lever arm axis. A brake lever arm distal end is engaged by a user's foot to move between a released position and a braked position. The brake lever arm includes a brake feature. An inside face of a wheel includes a plurality of stops radially disposed about its axis. In the braked position the brake feature is configured to be positioned between at least two of the plurality of stops of the respective rear wheel thereby preventing rotation of the wheel. In the released position the brake feature is configured to be positioned outside the plurality of stops thereby allowing rotation of the wheel.

Abstract: The optical module includes a housing, a lid that closes an opening of the housing, an optical component arranged inside the housing, and a printed circuit board arranged on a front surface of the lid outside the housing so as to be used as a board on which a control circuit that controls the optical component is mounted. The optical module further includes a side electrode that is provided on a side surface of the housing and configured to be electrically connected to an electrode of the optical component; and a flexible substrate that provides electrical connection between the side electrode and an electrode of the control circuit. The optical module can be miniaturized by integrating the optical component and the control circuit.

Abstract: A photonic integrated circuit and a method for its manufacture are provided. In an embodiment, an intermetal dielectric layer, for example, a silicon oxide layer, is contiguous between an upper metal layer and a lower metal layer on a substrate. One or more waveguides having top and bottom faces are formed in respective waveguide layers within the intermetal dielectric layer between the upper and lower metal layers. There is a distance of at least 600 nm from the upper metal layer to the top face of the uppermost of the several waveguides. There is a distance of at least 600 nm from the lower metal layer to the bottom face of the lowermost of the several waveguides. The waveguides are formed of silicon nitride for longer wavelengths and alumina for shorter wavelengths. These dimensions and materials are favorable for CMOS processing, among other things.

Abstract: A brake system with a wheel brake has a fluid reservoir and a valve assembly in fluid communication with the reservoir via a first conduit. The valve assembly is in fluid communication with the wheel brake via a second conduit. The valve assembly includes a bypass valve which only permits fluid flow from the first conduit to the second conduit when the fluid pressure within the first conduit is above a predetermined pressure level above atmospheric pressure. The valve assembly further includes a check valve in a parallel path arrangement relative to the bypass valve such that the check valve permits fluid flow from the second conduit to the first conduit, and prevents fluid flow from the first conduit to the second conduit. The brake system further includes a first source of pressurized fluid providing fluid pressure for actuating the wheel brake, wherein the first source of pressurized fluid is selectively in fluid communication with the second conduit.

Abstract: A hydraulic mount for a vehicle is configured to control and damp the behavior of a motor mounted on a vehicle body. The hydraulic mount includes: an inner pipe; a main rubber molded on an outer circumferential surface of the inner pipe and having an upper front liquid chamber and an upper rear liquid chamber, and a lower front liquid chamber and a lower rear liquid chamber; and an outer pipe fitted to an outer circumferential surface of the main rubber to seal the liquid chambers, wherein the main rubber includes a first flow path connecting the upper front liquid chamber and the lower rear liquid chamber filled with fluid such that the fluid is movable therebetween; and a second flow path connecting the upper rear liquid chamber and the lower front liquid chamber filled with fluid such that the fluid is movable therebetween.

Abstract: A vibration damping device for use with downhole electronics may comprise: a device housing mechanically coupled to the downhole electronics and defining a receptacle; and an inertia element movably supported in the receptacle; wherein the volume of the receptacle is greater than the volume of the inertia element so as to define an interstitial volume therebetween and wherein the interstitial volume is occupied by a fluid or an elastomer. A method for tuning a downhole torsional damping device to match a desired downhole electronics may comprise a) calculating a set of natural frequencies and mode shapes for the downhole electronics, b) selecting a desired frequency from the calculated natural frequencies, c) tuning the damping device characteristics to match the selected frequency, d) using the mode shapes to place the damping device. The mode shapes may include antinodes and step d) includes positioning a damping device at an antinode.