Patents Examined by Jacob R Crum
  • Patent number: 10818463
    Abstract: An overcurrent protection device for distributing power to a component. A cartridge may removeably receiving a TPA fuse. The cartridge may include a power input terminal and a power output terminal. When the cartridge is removeably received by a power distribution panel the power input terminal may directly couple to a power input connection of the power distribution panel and the power output terminal may directly couple to a power output connection of the power distribution panel. The directly coupled power input terminal and power output terminal being void of an intermediate busbar arranged between the cartridge and the power distribution panel.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: October 27, 2020
    Assignee: Telect, Inc.
    Inventor: Steven Kyle Witkoe
  • Patent number: 10813239
    Abstract: A cooling arrangement may include a fluid-tight housing in which a power electronics system and a dielectric fluid for cooling the power electronics system may be arranged. The dielectric fluid may be in heat-transferring contact with the power electronics system and may cool the power electronics system via a fluid movement. The fluid movement may be provided via acceleration forces acting on the cooling arrangement.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: October 20, 2020
    Assignee: MAHLE INTERNATIONAL GMBH
    Inventors: Matthias Ganz, Jessica Kansy, Thomas Kalmbach, Michael Trebbe
  • Patent number: 10802553
    Abstract: An electronic device comprises a housing, and a fan connection member. The housing comprises a bottom plate having a motherboard mounting area. The fan connection member is disposed on the bottom plate, and an orthogonal projection of the fan connection member onto the bottom plate partially overlaps with the motherboard mounting area. The fan connection member includes a fan base and a fan seat pivoted on the fan base. The orthogonal projection of the fan connection member has a first overlap area on the motherboard mounting area at a working state of the fan connection member. The orthogonal projection of the fan connection member has a second overlap area on the motherboard mounting area at a maintenance state of the fan connecting member. The first overlap area is larger than the second overlap area.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: October 13, 2020
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Kuo En Chang, Ming-Hung Shih, Hong-Jie Jian
  • Patent number: 10798849
    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: October 6, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Haejin Lee, Kyungha Koo, Chunghyo Jung, Se-Young Jang, Jungje Bang, Jaeheung Ye, Chi-Hyun Cho
  • Patent number: 10796873
    Abstract: Devices and systems are provided that incorporate fusible links within the electrical traces of a battery module voltage sensing circuit. The fusible links can be integrally formed in an electric trace and provide an overcurrent protection feature for the circuit without requiring fuse elements or components that are separate from the electrical trace. Each of these fusible links include a substantially flat controlled cross-sectional area disposed along a length of the material making up the electrical trace. In an overcurrent situation, the connection between a battery management system and a battery cell may be severed by the overcurrent melting the fusible link. The electrical traces may be spaced apart from one another in the circuit such that an overcurrent situation breaking the connection between one cell and the battery management system would not affect adjacent electrical traces not having an overcurrent situation.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: October 6, 2020
    Assignee: NIO USA, Inc.
    Inventors: Stephen C. Holland, Alexander J. Smith
  • Patent number: 10790108
    Abstract: Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: September 29, 2020
    Assignee: Littelfuse, Inc.
    Inventors: James Beckert, Gregory Stumpo
  • Patent number: 10787182
    Abstract: An open part that has an opening surface that is perpendicular to the horizontal direction is formed in a housing of a vehicle control device. An interior of the housing is divided into a first space including the open part and a second space by a partitioning member, a main surface thereof having a hole formed therein and opposing the opening surface. The semiconductor cooling unit is housed in the first space. The semiconductor cooling unit is detachably attached in a direction in which the opening surface and the partitioning member oppose each other. An engaging member arranged on the cover of the semiconductor cooling unit engages a guide arranged on the housing, and the guide supports weight of the semiconductor cooling unit. A heat sink is provided on a base plate and forms a vertically-directed flow passage.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: September 29, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Hirokazu Takabayashi
  • Patent number: 10791648
    Abstract: A pump includes an armature, a rotor assembly, a liquid path connector and a member. The armature includes a ferromagnetic core, a winding and a through passageway. The rotor assembly is disposed in the passageway and includes an impeller to rotate to pump liquid through the passageway. The liquid path connector is connected to the armature to communicate the liquid with the passageway. The member contacts an outer surface of the armature and contacts an outer surface of the liquid path connector to transfer thermal energy from the armature to the liquid path connector.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: September 29, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Franz, Tahir Cader
  • Patent number: 10791647
    Abstract: A liquid immersion cooling systems can include an immersion tank for housing cooling liquid, and a carrier tray. The carrier tray can include a mounting mechanism to attach one or more electronic components to the carrier tray, one or more handles, and one or more extendable sliders, each having a first connection to the carrier tray and a second connection to the immersion tank. The immersion tank can have an opening that faces upward. In a first position of the one or more extendable sliders, the carrier tray is within the immersion tank, and in a second position of the one or more extendable sliders, the carrier tray is vertically lifted out of the opening of the immersion tank.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: September 29, 2020
    Assignee: BAIDU USA LLC
    Inventors: Harold Miyamura, Tianyi Gao
  • Patent number: 10779436
    Abstract: A cooling apparatus includes a chamber and a pressure-relief element. The chamber includes a coolant in a liquid phase disposed near a heat-generation object. The coolant in the liquid phase dissipates heat from the heat-generation object and is converted from the liquid phase to a vapor phase upon the coolant in the liquid phase reaching a boiling temperature. The pressure-relief element has a conduit. A first end of the conduit is submerged in the coolant in the liquid phase internal to the chamber and a second end of the conduit is connected to atmosphere external to the chamber.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: September 15, 2020
    Assignee: International Business Machines Corporation
    Inventors: Shurong Tian, Todd E. Takken
  • Patent number: 10770871
    Abstract: The present disclosure relates to a switching device unit for a subsea switchgear. The switching device unit includes a fluid tight switching device housing and switching devices arranged within the switching device housing. A plurality of the switching devices are aligned with each other along two parallel lines.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: September 8, 2020
    Assignee: ABB Schweiz AG
    Inventor: Arne Trandal
  • Patent number: 10761577
    Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: September 1, 2020
    Assignee: Google LLC
    Inventors: Shawn Emory Bender, Jorge Padilla
  • Patent number: 10765033
    Abstract: Immersion cooling enclosures with insulating liners and associated computing facilities are disclosed herein. In one embodiment, an immersion cooling enclosure includes a well formed in a substrate material, a lid in contact with and fastened to the well to enclose an internal space configured to contain a dielectric coolant submerging one or more computing devices in the internal space, and an insulating liner on the internal surfaces of the well. The insulating liner has a first side in contact with the dielectric coolant and a second side in contact with the substrate material of the well. The insulating liner is non-permeable to the dielectric coolant, thereby preventing the dielectric coolant from passing through the insulating liner to the substrate material.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: September 1, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Nicholas Keehn, Eric Clarence Peterson, Winston Saunders, Husam Alissa
  • Patent number: 10751889
    Abstract: A robot includes a robot main body section including a base and a robot arm coupled to the base and including a sealed internal space, a driving section provided on the inside of the robot arm and configured to drive the robot arm, a control board provided on the inside of the base, a power supply board provided on the inside of the base and configured to supply electric power to the control board, a driving board provided on the inside of the robot arm and configured to drive the driving section based on a signal from the control board, a fan configured to stir gas on the inside of the robot main body section, and a heat sink provided on the inside of the base.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: August 25, 2020
    Assignee: Seiko Epson Corporation
    Inventor: Takema Yamazaki
  • Patent number: 10757841
    Abstract: The invention relates to a device (2) dedicated to heat treatment of an electric member (1) fitted to a motor vehicle, the device (2) comprising a Peltier-effect thermoelectric module (4) connected to one of the large faces (9, 10) of a casing (6) housing a circuit (5) for heat transfer fluid F, characterised in that, in the direction S of circulation of the heat transfer fluid F through the circuit (5), the circuit (5) comprises at least two successive fluid paths respectively arranged in distinct zones of the casing (6), including at least one upstream fluid path (5a) arranged inside a first zone Z1 and at least one downstream fluid path (5b) arranged inside a second zone, the casing (6) being delimited by a first large face (9) thermally connected to the thermoelectric module (4) and by a second large face (10) arranged to be thermally connected to the electric member (1).
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: August 25, 2020
    Assignee: Valeo Systemes Thermiques
    Inventors: Lionel Robillon, Mohamed Ibrahimi, Jean Damien Muller
  • Patent number: 10753345
    Abstract: The present invention is a combination of a shape-memory alloy (SMA) element and a fiber sleeve. The SMA connects at each end to a support element, the support elements being moveable relative to each other. The fiber sleeve comprises an electrically insulating sleeve made of flexible fiber material, and is sized so that the sleeve surrounds at least a portion of the SMA element. When the SMA element is deformed upon heating or cooling, causing the support elements to move relative to each other, the fiber sleeve also deforms and continues to surround the portion of the SMA element, inhibiting the flow of electric current from the SMA element to its surroundings.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: August 25, 2020
    Inventor: Dean Pick
  • Patent number: 10749018
    Abstract: Each of the first and second switching modules may include first through (n+1)th cooling plates stacked along a vertical direction with respect to the support module; first through nth switches respectively disposed between the first through (n+1)th cooling plates; a first electrode plate disposed on the (n+1)th cooling plate; a first supporting member disposed on the first electrode plate; a first pressing member disposed between the first electrode plate and the first supporting member; a second electrode plate disposed below the first cooling plate; a second supporting member disposed below the second electrode plate; and a second pressing member disposed between the second electrode plate and the second supporting member.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: August 18, 2020
    Assignee: LSIS CO., LTD.
    Inventor: Teagsun Jung
  • Patent number: 10741350
    Abstract: An electrical protection unit A including a main conductor and, for each main conductor, a current limiter device connected in series with the main conductor to limit the current when a current or temperature threshold is exceeded, the limiter device including an element made of a material having a positive temperature coefficient, called PTC, and being capable of controlling a device for tripping the mechanism M for opening the contacts of the protection unit D, to cause the opening of the contacts of the unit when the threshold is exceeded leading to a change of state of the element between a low resistance state and a high resistance state. The PTC element includes the trip device, in such a way that this element itself provides the functions of fault current limitation and of tripping the mechanism for opening the contacts.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: August 11, 2020
    Assignee: Schneider Electric Industries SAS
    Inventors: Michel Rapeaux, Eric Domejean
  • Patent number: 10736227
    Abstract: The solution of the present disclosure connects the power in parallel distribution chains. A horizontal pizza box in the middle of the equipment stack represents the power box (PB), which houses the power modules (PMs), such as the power input modules (PIMs) or the power supply units (PSUs). The PMs in the PB are connected to the office power source(s), and the PB supplies power to the parallel distribution chains (A? and B?). The parallel distribution chains are composed of jumper segments that are based on busbar-like technology, with each jumper segment being the length of the distance between coupled boxes. Any box can be removed without disrupting either distribution chain. Advantageously, the jumper segments are touch-proof, from a safety perspective. Thus, instead of a jumper created using a cable, PCB, etc., or a jumper composed of a custom molded back-to-back connector, the jumpers are based on busbar-like technology.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: August 4, 2020
    Assignee: Ciena Corporation
    Inventors: Daniel Rivaud, Andrew L. Jarabek, Anthony Mayenburg, Fabien Colton
  • Patent number: 10729033
    Abstract: An active heat-dissipation system for a base station of a communication system includes a measuring module, configured to detect a temperature sensing signal of the base station; a controller, configured to receive the temperature sensing signal detected by the measuring module to set a preset temperature signal, to generate a difference between the temperature sensing signal and the preset temperature signal and a time derivative of the difference, and to output a control signal according to the difference and the time derivative of the difference based on a control program; and a power module, configured to receive the control signal and output an electrical signal to a heat-dissipation module according to the control signal, such that the heat-dissipation module performs a heat-dissipation process for the base station according to the electrical signal.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: July 28, 2020
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Yen-Bin Chen, Sheng-Hsien Shih, Shou-Jen Hsu, Chien-Te Yu