Patents Examined by Jacob R Crum
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Patent number: 12114452Abstract: A display panel can prevent a Greenish phenomenon by preventing a shift phenomenon of a transistor inside a display layer, by applying a permittivity reduction processing on a component disposed upon a panel layer. The display panel can include a cover window, an adhesive layer disposed below the cover window, a polarizer disposed below the adhesive layer, and the panel layer disposed below the polarizer. Further, at least one among the cover window, the adhesive layer and the polarizer can be applied with a permittivity reduction processing.Type: GrantFiled: November 16, 2022Date of Patent: October 8, 2024Assignee: LG DISPLAY CO., LTD.Inventors: Myeongah Shin, Junjae Lee
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Patent number: 12106922Abstract: An electrical fuse assembly includes a housing defining a hermetically sealed chamber, first and second terminal electrodes mounted on the housing, a gas contained in the hermetically sealed chamber, a fuse element electrically connecting the first and second terminal electrodes, and at least one spark gap between the first and second terminal electrodes. The fuse element and the at least one spark gap are disposed in the hermetically sealed chamber.Type: GrantFiled: April 8, 2022Date of Patent: October 1, 2024Assignee: RIPD IP DEVELOPMENT LTD.Inventors: Robert Rozman, Zumret Top{hacek over (c)}agić
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Patent number: 12106920Abstract: A lightweight industrial fuse has a housing and a conductive fuse. The housing has a first plastic half-housing and a second half-housing combined with each other. The conductive fuse is integrally formed and clamped between the first and second half-housing. The conductive fuse has a fusible body and two intermediary portions disposed within the housing, and two electrode portions exposed from two opposite ends of the housing. Thus, an enclosed accommodation cavity of the housing is defined through the combination of the first and second half-housing. A manufacturing process is simplified, and a manufacturing cost is decreased, and further a weight of the industrial fuse is effectively reduced.Type: GrantFiled: November 23, 2022Date of Patent: October 1, 2024Assignee: CONQUER ELECTRONICS CO., LTD.Inventors: Hung-Chih Chiu, Po-Shuo Chiu
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Patent number: 12100569Abstract: A fuse holder is disclosed. The fuse holder includes a housing having a fuse compartment and termination compartments, each termination compartment having a cable termination aperture for receiving a cable and a lock pin slot; a bus assembly disposed including current bars having a first end and a second end extending from the termination compartment to the termination compartment, the first end having fuse contacts extending from the first end, the second end including a barb extending from the second end; and, push-in clamps disposed within the termination compartment, the push-in clamps normally biased against the barbs; wherein insertion of an electrical cable into the cable termination aperture depresses and elastically deforms the push-in clamp such that a gap is formed between the barb and the push-in clamp, wherein the push-in clamp continuously applies a biasing force against the electrical cable non-removably clamping the cable into the termination aperture.Type: GrantFiled: August 1, 2022Date of Patent: September 24, 2024Assignee: Regal Beloit America, Inc.Inventors: Luke D. Schaffner, Joseph A. Brown, Paul S. Buskey, Robert Scheckelhoff
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Patent number: 12101913Abstract: Methods, systems, and devices for providing computer-implemented services are disclosed. To provide the computer-implemented services, hardware components that generate heat may be used. To manage the heat generated by the hardware components, a heat sink assembly may be used. The heat sink assembly may include features for adjusting its shape and/or size to accommodate other nearby components. By accommodating other components, the heat sink assembly may be used in spaces that would otherwise be unusable for thermal dissipation purposes due to the risk of mechanical interference between the heat sink assembly and the other components.Type: GrantFiled: November 29, 2022Date of Patent: September 24, 2024Assignee: Dell Products L.P.Inventors: Timothy M. Lambert, Eric Michael Tunks, Daniel Alvarado
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Patent number: 12094677Abstract: A fuse holder provides a safe device for connecting fuses to a three-phase busbar device. Each phase includes a corresponding load conductor and line conductor mounted within a housing. A mechanical lock is provided for each phase that locks a knife of the fuse to one of the conductors for the phase. In a further aspect, the fuse knives are frictionally locked within the housing. In both the mechanical lock and frictional lock, a release mechanism is provided that can be activated by a screwdriver to release the fuse knives from the fuse holder. In another aspect, certain conductors are provided with heat dissipation wings that contact the housing to dissipate heat generated by current flowing through the conductor.Type: GrantFiled: November 19, 2021Date of Patent: September 17, 2024Assignee: Wöhner Besitz GmbHInventors: Philipp Steinberger, Joram Masel, Jonas Schwarz, Pushkar Bhalerao
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Patent number: 12096580Abstract: A waterproof electronic device includes a shell, a first electronic module, a second electronic module, and a flexible printed circuit FPC. A first compartment and a second compartment which are in communication with each other through a through hole are formed in the shell. The through hole is used for the FPC to pass through. The first and second electronic module are arranged in the first and second compartment respectively. The first electronic module is coupled to the second electronic module by the FPC which passes through the through hole. An opening in communication with the through hole is provided on the shell. A magnetic colloidal structure is arranged in the through hole, where the magnetic colloidal structure seals the through hole.Type: GrantFiled: January 5, 2022Date of Patent: September 17, 2024Assignee: Honor Device Co., Ltd.Inventors: Xiujuan Yang, Wenhao Wang, Mingchuan Li
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Patent number: 12085983Abstract: A display device includes: a display module; a plate positioned on a rear surface of the display module; and a digitizer positioned on a rear surface of the plate. The plate includes a first layer, a second layer, and a third layer each including carbon fiber reinforced plastic, and a fiber area weight (FAW) of the second layer is 100 g/m2 to 150 g/m2.Type: GrantFiled: June 3, 2022Date of Patent: September 10, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Hong Kwan Lee, Yong Hyuck Lee, Hyun Jun Cho, Sohra Han
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Patent number: 12087536Abstract: The present invention provides a multi-link fuse capable of charging a battery with a configuration simpler than a conventional configuration, and a method for charging a battery by using the multi-link fuse. A multi-link fuse H includes a bus bar body that includes an input terminal, a plurality of external terminals, and a fusion portion provided between the input terminal and the external terminal, and a housing body that covers the bus bar body. The multi-link fuse H includes an extension bus bar for charging a battery by connecting a charging connection terminal. The extension bus bar includes an input extension terminal that overlaps the input terminal and an outer extension portion that extends outward from the bus bar body and connects the charging connection terminal. Both the extension bus bar and the bus bar body are fixed to the housing body in a state where the input extension terminal of the extension bus bar overlaps the input terminal.Type: GrantFiled: February 18, 2021Date of Patent: September 10, 2024Assignee: Pacific Engineering CorporationInventors: Yoshinobu Miyata, Jyunhyoku Yang
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Patent number: 12080503Abstract: The subsea fuse assembly includes an enclosure filled with a dielectric fluid and provided with an equalization opening, which is sealed with a flexible element. A first electric conductor extends into the enclosure through a first lead-through positioned in a wall of the enclosure. A second electric conductor is attached to an inner surface of a wall of the enclosure. A fuse is connected between the first electric conductor and the second electric conductor within the enclosure. A third electric conductor extends outside the enclosure and is attached to an outer surface of a wall of the enclosure. An electrically conductive path is thus provided between the second electric conductor and the third electric conductor through the electrically conductive enclosure.Type: GrantFiled: November 25, 2019Date of Patent: September 3, 2024Assignee: Hitachi Energy LtdInventor: Markku Launonen
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Patent number: 12075604Abstract: A system and method for controlling an EMC protection apparatus in a removable component. The removable component is inserted into an end product. As a result of the insertion power is applied to the EMC protection apparatus. A determination is made as to whether a power good signal is detected within the removable component. In response to a power good signal, an EMC protection device is rotated from a retracted state to an engaged state such that the EMC protection device is placed over an enclosure opening in the removable component forming an EMC seal. Full functionality of the removable component can be delayed until such time as the rotation is completed.Type: GrantFiled: August 14, 2023Date of Patent: August 27, 2024Assignee: International Business Machines CorporationInventors: John S. Werner, Noah Singer, Samuel R. Connor
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Patent number: 12074005Abstract: This protective element includes a fuse element having a first end portion and a second end portion, in which current flows from the first end portion toward the second end portion, a protruding member and a recessed member that are positioned opposing one another so as to sandwich a cutoff portion, and a pressing device that imparts an elastic force that shortens the relative distance in a first direction that represents the direction in which the protruding member and the recessed member sandwich the cutoff portion, wherein at least one pair of opposing surfaces of a protruding portion of the protruding member and a recessed portion of the recessed member that intersect the direction of current flow through the fuse element are positioned close to one another when viewed in a plan view from the first direction, and the fuse element is cut at a temperature equal to or higher than the softening temperature of the material that constitutes the fuse element.Type: GrantFiled: March 2, 2020Date of Patent: August 27, 2024Assignee: DEXERIALS CORPORATIONInventors: Yoshihiro Yoneda, Koji Sato
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Patent number: 12075598Abstract: A method for environmentally managing a computing device of an information handling system includes extracting, using a corrosive material filter, corrosive materials from an airflow that thermally manages a computing component of the computing device. The method further includes, while extracting the corrosive materials, monitoring a corrosion state of the corrosive material filter; making a determination that the corrosive material filter should be replaced based on the corrosion state; and scheduling replacement of the corrosive material filter based on the determination.Type: GrantFiled: July 24, 2020Date of Patent: August 27, 2024Assignee: DELL PRODUCTS L.P.Inventors: Steven Embleton, Jon Taylor Fitch, Sandor T. Farkas, Joseph Danny King
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Patent number: 12057368Abstract: A cooling plate for cooling microchip having redundant cooling fluid circulation. A primary fluid cooling loop removes heat directly from the microchip. A secondary cooling loop acts as a condenser for two phase cells, thus removing heat indirectly from the microchip. The cold plate may be fabricated as two parts bottom plate and top plate, wherein the primary cooling loop is formed in the bottom plate and the secondary cooling loop is formed in the top plate. Two-phase, self-contained cells may be immersed in the primary cooling loop and act to transport heat from the microchip to the secondary cooling loop.Type: GrantFiled: June 8, 2021Date of Patent: August 6, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12057283Abstract: The invention relates to an overvoltage protection arrangement comprising a horn spark gap located in a housing, with a chamber for arc quenching, wherein a trigger electrode is located in the ignition region of the horn spark gap, wherein a disconnecting element is provided that interrupts a connection between a trigger circuit and the trigger electrode, and thus disconnects the trigger electrode, wherein the disconnecting element is tripped or controlled by an evaluation unit that is subject to and reacts to the loading of a power follow-on current.Type: GrantFiled: November 18, 2019Date of Patent: August 6, 2024Assignee: DEHN SEInventors: Arnd Ehrhardt, Ralph Brocke, Peter Zahlmann
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Patent number: 12058835Abstract: An information processing apparatus comprises a first heat generation circuit, a second heat generation circuit, a blocking assembly, and a processor. The blocking assembly performs a first operation of blocking air flowing from the first heat generation circuit toward the second heat generation circuit or a second operation of passing the air, and the processor is configure to instruct the blocking assembly to perform the first operation in a case where a temperature of the air is higher than a predetermined value, and instruct the blocking assembly to perform the second operation in a case where the temperature of the air is lower than the predetermined value.Type: GrantFiled: April 27, 2022Date of Patent: August 6, 2024Assignee: FUJITSU LIMITEDInventors: Kiichi Koyama, Tatsuya Sudo, Kazuo Tanaka, Hirotaka Shikada, Hiroshi Nagaoka, Hirofumi Konno, Takatoshi Katou, Nobuyoshi Aida, Masafumi Asano, Kazuo Kubo
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Patent number: 12058805Abstract: An electrical apparatus is provided with a power semiconductor module, at least one capacitor, a circuit carrier, and a first heat sink. The power semiconductor module and the circuit carrier are arranged on the first heat sink. The electrical apparatus comprises a second heat sink arranged on the power semiconductor module and connected to the first heat sink.Type: GrantFiled: September 15, 2021Date of Patent: August 6, 2024Assignee: Hella GmbH & Co. KGaAInventors: Joël Afanou, Olivier Vilain
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Patent number: 12051555Abstract: A HV HRC fuse, in particular a HH full-range fuse, for a drop-out fuse system with a drop-out release mechanism has an outer fuse housing, wherein at least one melting conductor, which is wound around at least one winding body, is provided in the fuse housing. The fuse housing is at least partially open on two end faces and a contact cap designed for electrical contacting is arranged on each end face of the fuse housing. The upper contact cap is detachably connectable in a contacting position with the drop-out release mechanism and the lower contact cap is pivotally mounted on the drop-out release mechanism. Tripping of the HV HRC fuse results in tripping of the drop-out release mechanism, whereby the upper contact cap is separated from the drop-out release mechanism and the HV HRC fuse swings out from the contacting position to a swing-out position.Type: GrantFiled: September 20, 2022Date of Patent: July 30, 2024Assignee: S1BA Fuses GmbHInventor: Dirk Wilhelm
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Patent number: 12048068Abstract: Provided is a heating element having a fuse function. The heating element having a fuse function according to an exemplary embodiment of the present invention includes a plurality of heat sources which generate heat when power is applied, a fuse member of which both end portions are physically connected to two heat sources disposed to be spaced apart from each other by a gap to connect the two heat sources in series and which is fused to electrically disconnect the two heat sources when a temperature is higher than or equal to a preset temperature, and an insulating member which surrounds the plurality of heat sources and the fuse member.Type: GrantFiled: January 20, 2020Date of Patent: July 23, 2024Assignee: AMOGREENTECH CO., LTD.Inventors: Jeong Hwan Kim, Won San Na, Jin Pyo Park, Jae Yeong Lee, Hyun Chul Lim
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Patent number: 12048128Abstract: A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system.Type: GrantFiled: September 11, 2017Date of Patent: July 23, 2024Assignee: Inertech IP LLCInventors: Earl Keisling, John Costakis, Gerald McDonnell