Patents Examined by Jacob R Crum
  • Patent number: 12114452
    Abstract: A display panel can prevent a Greenish phenomenon by preventing a shift phenomenon of a transistor inside a display layer, by applying a permittivity reduction processing on a component disposed upon a panel layer. The display panel can include a cover window, an adhesive layer disposed below the cover window, a polarizer disposed below the adhesive layer, and the panel layer disposed below the polarizer. Further, at least one among the cover window, the adhesive layer and the polarizer can be applied with a permittivity reduction processing.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: October 8, 2024
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Myeongah Shin, Junjae Lee
  • Patent number: 12106922
    Abstract: An electrical fuse assembly includes a housing defining a hermetically sealed chamber, first and second terminal electrodes mounted on the housing, a gas contained in the hermetically sealed chamber, a fuse element electrically connecting the first and second terminal electrodes, and at least one spark gap between the first and second terminal electrodes. The fuse element and the at least one spark gap are disposed in the hermetically sealed chamber.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: October 1, 2024
    Assignee: RIPD IP DEVELOPMENT LTD.
    Inventors: Robert Rozman, Zumret Top{hacek over (c)}agić
  • Patent number: 12106920
    Abstract: A lightweight industrial fuse has a housing and a conductive fuse. The housing has a first plastic half-housing and a second half-housing combined with each other. The conductive fuse is integrally formed and clamped between the first and second half-housing. The conductive fuse has a fusible body and two intermediary portions disposed within the housing, and two electrode portions exposed from two opposite ends of the housing. Thus, an enclosed accommodation cavity of the housing is defined through the combination of the first and second half-housing. A manufacturing process is simplified, and a manufacturing cost is decreased, and further a weight of the industrial fuse is effectively reduced.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: October 1, 2024
    Assignee: CONQUER ELECTRONICS CO., LTD.
    Inventors: Hung-Chih Chiu, Po-Shuo Chiu
  • Patent number: 12100569
    Abstract: A fuse holder is disclosed. The fuse holder includes a housing having a fuse compartment and termination compartments, each termination compartment having a cable termination aperture for receiving a cable and a lock pin slot; a bus assembly disposed including current bars having a first end and a second end extending from the termination compartment to the termination compartment, the first end having fuse contacts extending from the first end, the second end including a barb extending from the second end; and, push-in clamps disposed within the termination compartment, the push-in clamps normally biased against the barbs; wherein insertion of an electrical cable into the cable termination aperture depresses and elastically deforms the push-in clamp such that a gap is formed between the barb and the push-in clamp, wherein the push-in clamp continuously applies a biasing force against the electrical cable non-removably clamping the cable into the termination aperture.
    Type: Grant
    Filed: August 1, 2022
    Date of Patent: September 24, 2024
    Assignee: Regal Beloit America, Inc.
    Inventors: Luke D. Schaffner, Joseph A. Brown, Paul S. Buskey, Robert Scheckelhoff
  • Patent number: 12101913
    Abstract: Methods, systems, and devices for providing computer-implemented services are disclosed. To provide the computer-implemented services, hardware components that generate heat may be used. To manage the heat generated by the hardware components, a heat sink assembly may be used. The heat sink assembly may include features for adjusting its shape and/or size to accommodate other nearby components. By accommodating other components, the heat sink assembly may be used in spaces that would otherwise be unusable for thermal dissipation purposes due to the risk of mechanical interference between the heat sink assembly and the other components.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: September 24, 2024
    Assignee: Dell Products L.P.
    Inventors: Timothy M. Lambert, Eric Michael Tunks, Daniel Alvarado
  • Patent number: 12094677
    Abstract: A fuse holder provides a safe device for connecting fuses to a three-phase busbar device. Each phase includes a corresponding load conductor and line conductor mounted within a housing. A mechanical lock is provided for each phase that locks a knife of the fuse to one of the conductors for the phase. In a further aspect, the fuse knives are frictionally locked within the housing. In both the mechanical lock and frictional lock, a release mechanism is provided that can be activated by a screwdriver to release the fuse knives from the fuse holder. In another aspect, certain conductors are provided with heat dissipation wings that contact the housing to dissipate heat generated by current flowing through the conductor.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: September 17, 2024
    Assignee: Wöhner Besitz GmbH
    Inventors: Philipp Steinberger, Joram Masel, Jonas Schwarz, Pushkar Bhalerao
  • Patent number: 12096580
    Abstract: A waterproof electronic device includes a shell, a first electronic module, a second electronic module, and a flexible printed circuit FPC. A first compartment and a second compartment which are in communication with each other through a through hole are formed in the shell. The through hole is used for the FPC to pass through. The first and second electronic module are arranged in the first and second compartment respectively. The first electronic module is coupled to the second electronic module by the FPC which passes through the through hole. An opening in communication with the through hole is provided on the shell. A magnetic colloidal structure is arranged in the through hole, where the magnetic colloidal structure seals the through hole.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: September 17, 2024
    Assignee: Honor Device Co., Ltd.
    Inventors: Xiujuan Yang, Wenhao Wang, Mingchuan Li
  • Patent number: 12085983
    Abstract: A display device includes: a display module; a plate positioned on a rear surface of the display module; and a digitizer positioned on a rear surface of the plate. The plate includes a first layer, a second layer, and a third layer each including carbon fiber reinforced plastic, and a fiber area weight (FAW) of the second layer is 100 g/m2 to 150 g/m2.
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: September 10, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hong Kwan Lee, Yong Hyuck Lee, Hyun Jun Cho, Sohra Han
  • Patent number: 12087536
    Abstract: The present invention provides a multi-link fuse capable of charging a battery with a configuration simpler than a conventional configuration, and a method for charging a battery by using the multi-link fuse. A multi-link fuse H includes a bus bar body that includes an input terminal, a plurality of external terminals, and a fusion portion provided between the input terminal and the external terminal, and a housing body that covers the bus bar body. The multi-link fuse H includes an extension bus bar for charging a battery by connecting a charging connection terminal. The extension bus bar includes an input extension terminal that overlaps the input terminal and an outer extension portion that extends outward from the bus bar body and connects the charging connection terminal. Both the extension bus bar and the bus bar body are fixed to the housing body in a state where the input extension terminal of the extension bus bar overlaps the input terminal.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: September 10, 2024
    Assignee: Pacific Engineering Corporation
    Inventors: Yoshinobu Miyata, Jyunhyoku Yang
  • Patent number: 12080503
    Abstract: The subsea fuse assembly includes an enclosure filled with a dielectric fluid and provided with an equalization opening, which is sealed with a flexible element. A first electric conductor extends into the enclosure through a first lead-through positioned in a wall of the enclosure. A second electric conductor is attached to an inner surface of a wall of the enclosure. A fuse is connected between the first electric conductor and the second electric conductor within the enclosure. A third electric conductor extends outside the enclosure and is attached to an outer surface of a wall of the enclosure. An electrically conductive path is thus provided between the second electric conductor and the third electric conductor through the electrically conductive enclosure.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: September 3, 2024
    Assignee: Hitachi Energy Ltd
    Inventor: Markku Launonen
  • Patent number: 12075604
    Abstract: A system and method for controlling an EMC protection apparatus in a removable component. The removable component is inserted into an end product. As a result of the insertion power is applied to the EMC protection apparatus. A determination is made as to whether a power good signal is detected within the removable component. In response to a power good signal, an EMC protection device is rotated from a retracted state to an engaged state such that the EMC protection device is placed over an enclosure opening in the removable component forming an EMC seal. Full functionality of the removable component can be delayed until such time as the rotation is completed.
    Type: Grant
    Filed: August 14, 2023
    Date of Patent: August 27, 2024
    Assignee: International Business Machines Corporation
    Inventors: John S. Werner, Noah Singer, Samuel R. Connor
  • Patent number: 12074005
    Abstract: This protective element includes a fuse element having a first end portion and a second end portion, in which current flows from the first end portion toward the second end portion, a protruding member and a recessed member that are positioned opposing one another so as to sandwich a cutoff portion, and a pressing device that imparts an elastic force that shortens the relative distance in a first direction that represents the direction in which the protruding member and the recessed member sandwich the cutoff portion, wherein at least one pair of opposing surfaces of a protruding portion of the protruding member and a recessed portion of the recessed member that intersect the direction of current flow through the fuse element are positioned close to one another when viewed in a plan view from the first direction, and the fuse element is cut at a temperature equal to or higher than the softening temperature of the material that constitutes the fuse element.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: August 27, 2024
    Assignee: DEXERIALS CORPORATION
    Inventors: Yoshihiro Yoneda, Koji Sato
  • Patent number: 12075598
    Abstract: A method for environmentally managing a computing device of an information handling system includes extracting, using a corrosive material filter, corrosive materials from an airflow that thermally manages a computing component of the computing device. The method further includes, while extracting the corrosive materials, monitoring a corrosion state of the corrosive material filter; making a determination that the corrosive material filter should be replaced based on the corrosion state; and scheduling replacement of the corrosive material filter based on the determination.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: August 27, 2024
    Assignee: DELL PRODUCTS L.P.
    Inventors: Steven Embleton, Jon Taylor Fitch, Sandor T. Farkas, Joseph Danny King
  • Patent number: 12057368
    Abstract: A cooling plate for cooling microchip having redundant cooling fluid circulation. A primary fluid cooling loop removes heat directly from the microchip. A secondary cooling loop acts as a condenser for two phase cells, thus removing heat indirectly from the microchip. The cold plate may be fabricated as two parts bottom plate and top plate, wherein the primary cooling loop is formed in the bottom plate and the secondary cooling loop is formed in the top plate. Two-phase, self-contained cells may be immersed in the primary cooling loop and act to transport heat from the microchip to the secondary cooling loop.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: August 6, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 12057283
    Abstract: The invention relates to an overvoltage protection arrangement comprising a horn spark gap located in a housing, with a chamber for arc quenching, wherein a trigger electrode is located in the ignition region of the horn spark gap, wherein a disconnecting element is provided that interrupts a connection between a trigger circuit and the trigger electrode, and thus disconnects the trigger electrode, wherein the disconnecting element is tripped or controlled by an evaluation unit that is subject to and reacts to the loading of a power follow-on current.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: August 6, 2024
    Assignee: DEHN SE
    Inventors: Arnd Ehrhardt, Ralph Brocke, Peter Zahlmann
  • Patent number: 12058835
    Abstract: An information processing apparatus comprises a first heat generation circuit, a second heat generation circuit, a blocking assembly, and a processor. The blocking assembly performs a first operation of blocking air flowing from the first heat generation circuit toward the second heat generation circuit or a second operation of passing the air, and the processor is configure to instruct the blocking assembly to perform the first operation in a case where a temperature of the air is higher than a predetermined value, and instruct the blocking assembly to perform the second operation in a case where the temperature of the air is lower than the predetermined value.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: August 6, 2024
    Assignee: FUJITSU LIMITED
    Inventors: Kiichi Koyama, Tatsuya Sudo, Kazuo Tanaka, Hirotaka Shikada, Hiroshi Nagaoka, Hirofumi Konno, Takatoshi Katou, Nobuyoshi Aida, Masafumi Asano, Kazuo Kubo
  • Patent number: 12058805
    Abstract: An electrical apparatus is provided with a power semiconductor module, at least one capacitor, a circuit carrier, and a first heat sink. The power semiconductor module and the circuit carrier are arranged on the first heat sink. The electrical apparatus comprises a second heat sink arranged on the power semiconductor module and connected to the first heat sink.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: August 6, 2024
    Assignee: Hella GmbH & Co. KGaA
    Inventors: Joël Afanou, Olivier Vilain
  • Patent number: 12051555
    Abstract: A HV HRC fuse, in particular a HH full-range fuse, for a drop-out fuse system with a drop-out release mechanism has an outer fuse housing, wherein at least one melting conductor, which is wound around at least one winding body, is provided in the fuse housing. The fuse housing is at least partially open on two end faces and a contact cap designed for electrical contacting is arranged on each end face of the fuse housing. The upper contact cap is detachably connectable in a contacting position with the drop-out release mechanism and the lower contact cap is pivotally mounted on the drop-out release mechanism. Tripping of the HV HRC fuse results in tripping of the drop-out release mechanism, whereby the upper contact cap is separated from the drop-out release mechanism and the HV HRC fuse swings out from the contacting position to a swing-out position.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: July 30, 2024
    Assignee: S1BA Fuses GmbH
    Inventor: Dirk Wilhelm
  • Patent number: 12048068
    Abstract: Provided is a heating element having a fuse function. The heating element having a fuse function according to an exemplary embodiment of the present invention includes a plurality of heat sources which generate heat when power is applied, a fuse member of which both end portions are physically connected to two heat sources disposed to be spaced apart from each other by a gap to connect the two heat sources in series and which is fused to electrically disconnect the two heat sources when a temperature is higher than or equal to a preset temperature, and an insulating member which surrounds the plurality of heat sources and the fuse member.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: July 23, 2024
    Assignee: AMOGREENTECH CO., LTD.
    Inventors: Jeong Hwan Kim, Won San Na, Jin Pyo Park, Jae Yeong Lee, Hyun Chul Lim
  • Patent number: 12048128
    Abstract: A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: July 23, 2024
    Assignee: Inertech IP LLC
    Inventors: Earl Keisling, John Costakis, Gerald McDonnell