Patents Examined by Jacob R Crum
  • Patent number: 12387898
    Abstract: A jump stud assembly including a housing, electrically conductive first and second studs extending through a floor of the housing into a compartment defined by the housing, and a fuse module including a mounting block having a through-hole extending therethrough, a fuse plate having an upper portion on a top of the mounting block and having a through-hole aligned with the through-hole of the mounting block, a lower portion on a bottom of the mounting block and having a through-hole aligned with the through-hole of the mounting block, and a fusible element adjacent a sidewall of the mounting block connecting the upper portion of the fuse plate to the lower portion of the fuse plate, wherein the fuse module is mounted on a portion of the first stud outside the compartment with the upper portion of the fuse plate in electrical communication with the first stud.
    Type: Grant
    Filed: December 8, 2023
    Date of Patent: August 12, 2025
    Assignee: Littelfuse, Inc.
    Inventors: Andrew Jozwiak, Jeremy Glessner
  • Patent number: 12381061
    Abstract: A fuse with an improved arc elimination performance is provided while an increase in the total length of the fuse element is prevented. A fuse 500 includes a fuse element 100 including at least one fusing portion 120 between terminal portions 110 on both sides. The fuse element 100 includes curved portions 130, which are hollowed, at positions adjacent to the fusing portion 120. An arc-eliminating material 140 is fastened in hollowed portions 131 of the curved portions 130.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: August 5, 2025
    Assignee: Pacific Engineering Corporation
    Inventors: Kengo Watanabe, Yutaka Tsuchiya
  • Patent number: 12376268
    Abstract: A cooling apparatus includes thermosyphon loops for cooling multiple electronic devices. Each of the thermosyphon loops includes at least one evaporator and at least one condenser. Sensors within the thermosyphon loop measure can measure various parameters such as vapour quality within an inlet and outlet of at least one of the evaporators, total heat load of at least one of the evaporators; and the liquid level in a downcomer of the thermosyphon loop.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: July 29, 2025
    Assignee: Accelsius, LLC
    Inventors: Raffaele Luca Amalfi, Ryan Enright, Vasileios Kafantaris
  • Patent number: 12368013
    Abstract: A temperature fuse assembly for a high-power DC circuit is provided. The temperature fuse assembly includes a case extending from a first case end to a second case end and an isolated lead projecting from the second case end. A bushing electrically isolates the isolated lead from the case. A high-gauge wire is electrically connected to the case at a first wire end and electrically connected to the isolated lead at a second wire end. A portion of the high-gauge wire is helically wound about an exterior of the bushing. When a temperature of the temperature fuse assembly exceeds a threshold temperature, the temperature fuse assembly is configured to conduct a DC current of the high-power DC circuit through the high-gauge wire. The high-gauge wire is configured to melt under a load of the DC current and interrupt the high-power DC circuit.
    Type: Grant
    Filed: September 15, 2023
    Date of Patent: July 22, 2025
    Assignee: Therm-O-Disc, Incorporated
    Inventors: Changcai Zhao, Lijuan Huang, Wei Shi, Kangsheng Lin, Guojun Xiao, Rong Guan, Xiang Gong, Qiang Zhao
  • Patent number: 12362120
    Abstract: A fuse includes a fuse body, two terminals, and a termination reinforcement. The fuse body surrounds a fusible element. The first terminal is located at one end of the fuse body and the second terminal is located at the other end of the fuse body. The fusible element is mechanically connected to the first and second terminals. The termination reinforcement is located at one end of the fuse body.
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: July 15, 2025
    Assignee: Littelfuse, Inc.
    Inventors: Marko Arciaga, Ralph Pechon Labonite, Lily Espenilla Rosios, Conrado Sagun De Leon, Albert Enriquez
  • Patent number: 12362121
    Abstract: A high voltage contact control system includes main contacts on positive and negative feeder lines and a short circuit protection system configured between the positive feeder line and the negative feeder line. The short circuit protection system is configured to be operably connected between the positive and negative feeder lines and configured to selectively provide a bypass path between the positive feeder line and the negative feeder line to divert current away from the first and second contacts. The short circuit protection system includes first and second state arc prevention elements that can operate in at least two modes. The bypass path is established by having one of the arc prevention elements in a fully on mode and another either fully on or in a linear mode.
    Type: Grant
    Filed: November 6, 2023
    Date of Patent: July 15, 2025
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Alex Gomes, Robert L. Seagren, Joshua C. Swenson
  • Patent number: 12354822
    Abstract: It is aimed to provide a fuse element capable of interrupting an electrical circuit while suppressing the formation of carbide when an abnormal current is generated. A fuse element 10 is provided with an insulating base material 3 and a conductor layer 1 provided on a surface of the base material 3. The conductor layer 1 is physically ruptured at a temperature lower than a temperature, at which the conductor layer 1 is fused and cut, when the conductor layer 1 is energized and generates heat.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: July 8, 2025
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Misato Ueki, Yutaka Takata
  • Patent number: 12347635
    Abstract: A high voltage, direct current circuit protection system includes a number n of weakened circuit conductors connected in series to one another and being fabricated in a manner to avoid metal fatigue in response to cyclic current loads. The system also includes a corresponding number n of cutting elements operable to sever the respective weakened circuit conductors, at least one energy storage element acting upon one of the cutting elements, a control element causing a release of stored energy in the at least one energy storage element and causing a displacement of at least one of the cutting elements to sever the respective weakened circuit conductor, and a corresponding number n of arc chambers arranged proximate each respective one of the weakened circuit conductors, wherein n is an integer greater than 1 and wherein no circuit protector coordination with the weakened circuit protectors is required.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: July 1, 2025
    Assignee: Eaton Intelligent Power Limited
    Inventor: Robert Stephen Douglass
  • Patent number: 12340962
    Abstract: The present disclosure refers to a switch for interrupting of a circuit in which two voltage sources and at least one load are connected, wherein the switch actuate quickly in an emergency. The switch includes a main conductor connecting both electric voltage sources and said load, bridged by a supplemental conductor which is in parallel with the two voltage sources and the load, and prior to activation of the switch, interrupted and electrically open. A branch with an integrated fuse is in parallel with the main conductor and linked at two connecting points between the two electric voltage sources while the connecting points includes a movable section which under pre-determined conditions moves from contact with the main conductor into an alternate position in contact with the supplemental conductor, resulting in an open circuit across the main conductor and a closed circuit across the supplemental conductor.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: June 24, 2025
    Assignee: ETI ELEKTROELEMENT, D.O.O.
    Inventors: Mitja Koprivsek, Brane Lebar
  • Patent number: 12342504
    Abstract: The present disclosure describes thermal management devices. In one example, a thermal management device can include a processing unit, a thermal grease layer directly contacting the processing unit, and a heat pipe. The heat pipe can include a heat pipe interior volume having a working fluid disposed therein, a first exterior surface directly contacting the thermal grease layer, a second exterior surface opposite from the first exterior surface, and side exterior surfaces connecting the first exterior surface and the second exterior surface. The thermal management device can also include a device cover spaced from the second exterior surface of the heat pipe by a distance from greater than 1 mm to about 5 mm, and a bracket having a clamping portion that holds the heat pipe by the side exterior surfaces of the heat pipe. The clamping portion does not extend past the first exterior surface of the heat pipe.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: June 24, 2025
    Assignee: Hewlett-Packard Deveopment Company, L.P.
    Inventors: Hendry Huang, Kuan-Ting Wu, Chi Hao Chang
  • Patent number: 12342518
    Abstract: The disclosure relates to a shielded electronic module which includes a module shielding structure and an electronic module with an interposer, a shielded electronic submodule over the interposer, and a module mold compound over the interposer and encapsulating sides of the shielded electronic submodule. Herein, the shielded electronic submodule includes an electronic submodule and a submodule side shielding structure, which covers sides of the electronic submodule to provide the sides of the shielded electronic submodule. A top surface of the electronic module is a combination of a top surface of the module mold compound and a top surface of the shielded electronic submodule, which is not covered by the module mold compound. The module shielding structure directly and continuously covers the top surface and sides of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the electronic submodule.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: June 24, 2025
    Assignee: Qorvo US, Inc.
    Inventors: Thomas Scott Morris, Howard Terry Glascock, Charles E. Carpenter, Mudar Al-Joumayly, Peter Cotterill
  • Patent number: 12334288
    Abstract: An embodiment of an electric heating element is disclosed, including an electrically resistive inner heating element, an electrically resistive outer heating element, and a thermostat positioned underneath a centrally-positioned medallion and along a cold leg of the inner heating element. The thermostat is configured to selectively allow electrical current to be delivered to the inner heating element while maximum electrical current, for example, continues to be provided to the outer heating element. The thermostat cycles the electrical current on and off when detecting maximum and minimum desired temperatures radiated from the electric heating element. The inner heating element has a pair of cold legs that extend parallel to a pair of cold legs of the outer heating element, some or all of which may be supported by a terminal bracket.
    Type: Grant
    Filed: March 8, 2024
    Date of Patent: June 17, 2025
    Assignees: Backer EHP Inc., Wako (USA) Inc.
    Inventors: Stacy Springer, Dan Maxwell, Zachary Newcomb, Shahid Ikram, Mitch Taylor
  • Patent number: 12334292
    Abstract: A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.
    Type: Grant
    Filed: August 14, 2023
    Date of Patent: June 17, 2025
    Assignee: Littelfuse, Inc.
    Inventors: Yuriy Borisovich Matus, Martin G. Pineda, Boris Golubovic, Deepak Nayar
  • Patent number: 12334291
    Abstract: A fuse includes: an element including a plurality of narrow portions each of which becomes a starting point of fusion cutting; a pair of terminals connected by the element; and a case housing the element, in which the element has a curved surface, and is disposed in a tube shape.
    Type: Grant
    Filed: July 10, 2023
    Date of Patent: June 17, 2025
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, PACIFIC ENGINEERING CORP.
    Inventors: Kiyokazu Akiyama, Katsumi Yuasa, Ryohei Ono, Kenji Osada, Syuya Kataoka
  • Patent number: 12336152
    Abstract: Systems, apparatuses and methods to provide a hybrid cooling for servers of a data center are described. A cooling plate comprises an inlet port to receive a coolant from a coolant source. The coolant is a two-phase coolant that transforms from a liquid state into vapor when being attached to an electronic device to extract heat from the electronic device. The cooling plate comprises an outlet port to output at least a portion of the coolant back to the coolant source. The cooling plate comprises a vapor port to output the vapor generated from the coolant to a condenser that is configured to condense the vapor back to the liquid state.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: June 17, 2025
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 12327701
    Abstract: An electrical circuit breaker assembly, and a method for its operation, including a conductive element of an electrical circuit and a cut-off device configured to be activated by a pyrotechnic element and that is configured to sever the conductive element in a cut-off zone delimited by a downstream point. The electrical circuit breaker assembly further includes a contactor element configured to be activated by a pyrotechnic element, the contactor element being configured to connect the downstream point of the cut-off zone to an earth conductor of the electrical circuit prior to a severing of the conductive element or simultaneously with the severing of the conductive element.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: June 10, 2025
    Assignee: AIRBUS OPERATIONS SAS
    Inventors: David Rousset, Jean-Marc Lacoste
  • Patent number: 12327702
    Abstract: This breaker device includes: a casing; an igniter disposed in the casing; a conductor including a separating portion disposed below the igniter; and a pusher located between the separating portion and the igniter and configured to move together with the separating portion from a first position to a second position located below the first position. The casing includes: a first casing made of a metal, including a first fixing portion, and configured to house the igniter and the pusher located at the first position; and a second casing made of a metal, including a second fixing portion, and configured to house the pusher that has moved to the second position and the separating portion that has moved downward together with the pusher. The first fixing portion and the second fixing portion overlap each other, come into contact with each other, and are fixed to each other.
    Type: Grant
    Filed: August 23, 2023
    Date of Patent: June 10, 2025
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shun Ito, Shinya Kimoto, Katsuya Uruma, Masato Nakamura
  • Patent number: 12324124
    Abstract: An electronic apparatus (1) includes a cooling fan (5) configured to generate an airflow that cools a part mounted on a circuit board (50), a flow passage wall (34) defining a flow passage of the airflow fed from the cooling fan (5), and a dust collecting chamber Ds configured to capture dust in the airflow and store the captured dust, the dust collecting chamber Ds being provided to the flow passage wall (34). According to this, the amount of the dust fed to air supply targets such as a heat sink and a power supply unit together with air can be reduced.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: June 3, 2025
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Satoshi Mito, Yasuhiro Ootori
  • Patent number: 12324129
    Abstract: In some implementations, a heatsink assembly may include a heatsink that transfers heat from a pluggable module plugged into a frame, a clip coupling the heatsink to the frame and biasing the heatsink toward the pluggable module when the pluggable module is plugged into the frame, and an actuator plate that engages with the pluggable module as the pluggable module is plugged into the frame and thereby translates between an activated position and a deactivated position. When the actuator plate is in the activated position, the actuator plate may lift the heatsink away from the pluggable module, and, when the actuator plate is in the deactivated position, the actuator plate may permit the heatsink to engage the pluggable module. The actuator plate may translate from the activated position to the deactivated position by contacting the pluggable module as the pluggable module is plugged into the frame.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: June 3, 2025
    Assignee: Juniper Networks, Inc.
    Inventors: Jimmy Chun-Chuen Leung, John Ferullo
  • Patent number: 12313943
    Abstract: A display device includes: a display panel; a chassis assembly accommodating the display panel; a rear cover surrounding at least a portion of the chassis assembly; and a control assembly provided between the chassis assembly and the rear cover and, wherein the control assembly includes: a single-side printed circuit board (PCB) including a circuit surface with a circuit pattern printed thereon, and an insulating surface, a circuit module provided on the circuit surface, and a jumper connector including a first protruding portion passing through a first hole of the single-side PCB, a second protruding portion passing through a second hole of the single-side PCB.
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: May 27, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Moonyoung Kim, Jeongil Kang, Wonmyung Woo