Patents Examined by Jacob R Crum
  • Patent number: 11882673
    Abstract: A heat spreader including a body having a first conduction value and a first electromagnetic interference shield value. The heat spreader further includes a conduction enhancement affixed to the body, the conduction enhancement having a second conduction value greater than the first conduction value and a second electromagnetic interference shield value less than the first electromagnetic interference shield value. At least a portion of the conduction enhancement is positioned relative to the body for increasing an effective electromagnetic interference shield value of the body associated with the at least a portion of the conduction enhancement.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: January 23, 2024
    Assignee: Advanced Cooling Technologies, Inc.
    Inventors: Jens Weyant, Conor Maghan, Matt Schultz, Ryan Spangler
  • Patent number: 11875962
    Abstract: Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a substrate and a fusible element coupled to the substrate, wherein the fusible element may include a first end opposite a second end, and wherein the first and second ends wrap around the substrate. The fusible element may further include a central section comprising a plurality of segments connected end-to-end in a continuous arrangement between the first and second ends, wherein a first set of segments of the plurality of segments extends along a first plane, and wherein a second set of segments of the plurality of segments extends along a second plane, different than the first plane.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: January 16, 2024
    Assignee: Littelfuse, Inc.
    Inventors: Albert Enriquez, Lily Espenilla Rosios, Arnel Ramos
  • Patent number: 11869739
    Abstract: An electrical device assembly and method to attach an isolated single stud fuse assembly to an electrical device are disclosed. The electrical device assembly consists of multiple studs, one or more of which is replaced with the isolated single stud fuse. A conductive copper landing zone receives an electrically isolated steel stud. When the landing pad assembly is orbital riveted into a plastic housing of the electrical device, the stud is locked into the housing permanently. Electrical devices such as disconnect switches and power distribution modules, both of which include multiple studs, are good candidates for being adapted with the single stud fuse assembly.
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: January 9, 2024
    Assignee: Littelfuse, Inc.
    Inventors: Geoffrey Schwartz, Tiziano Bianchin, Massimiliano Tinto
  • Patent number: 11871550
    Abstract: A system and method for controlling an EMC protection apparatus in a removable component. The removable component is inserted into an end product. As a result of the insertion power is applied to the EMC protection apparatus. A determination is made as to whether a power good signal is detected within the removable component. In response to a power good signal, an EMC protection device is rotated from a retracted state to an engaged state such that the EMC protection device is placed over an enclosure opening in the removable component forming an EMC seal. Full functionality of the removable component can be delayed until such time as the rotation is completed.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: January 9, 2024
    Assignee: International Business Machines Corporation
    Inventors: John S. Werner, Noah Singer, Samuel R. Connor
  • Patent number: 11864357
    Abstract: A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: January 2, 2024
    Assignees: Toyota Motor Engineering and Manufacturing North America, Inc., University of Colorado Boulder
    Inventors: Feng Zhou, Yuqing Zhou, Ercan Mehmet Dede, Robert Erickson, Dragan Maksimovic, Vivek Sankaranarayanan, Yucheng Gao
  • Patent number: 11862422
    Abstract: An electrical fuse that includes an electro-pyrotechnic igniter, a separating element, which can be moved by the electro-pyrotechnic igniter, and a busbar with a separating section. A separating element is arranged so that it can move after the electro-pyrotechnic igniter is triggered to separate the busbar. At least one inductive coupler is arranged on the busbar or a high-voltage line. The electrical fuse further includes a control circuit for controlling an ignition current for triggering the electro-pyrotechnic igniter. The control circuit includes at least one semiconductor switch for switching the ignition current provided, at least one capacitor, connected to a control input of the semiconductor switch, and a diode coupled on one side to the at least one inductive coupler and on the other side to the capacitor and a control input of the semiconductor switch.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: January 2, 2024
    Assignee: Volkswagen Aktiengesellschaft
    Inventor: Roland Kube
  • Patent number: 11862534
    Abstract: An adjustable heat exchanger includes a fan assembly, a heatsink assembly, a semiconductor chilling plate and a conduction cooling unit connected in sequence, the conduction cooling unit includes a main conduction cooling plate and a conduction cooling which includes at least one conduction cooling sub-fin. The main conduction cooling plate is connected to the semiconductor chilling plate, the conduction cooling fin is movably connected to an outer peripheral wall of the main conduction cooling plate, the conduction cooling fin extends outward along the center of the main conduction cooling plate, and the conduction cooling fin and the main conduction cooling plate jointly form a contact surface for adapting to a heat-dispersing surface. The present heat exchanger can adapt to hot surfaces with different curved surface radians and form a surrounded fixed structure with the hot surface to make the conduction cooling unit well-contact surfaces with different radians.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: January 2, 2024
    Inventor: Zonghu Zhu
  • Patent number: 11856729
    Abstract: Disclosed are designs to facilitate blind-mating of fluid connectors on servers and on racks that house the servers. The design includes two plates. A first plate has a connector channel to guide the connectors of the server through the first plate and spring structures to apply a force to push the connectors of the server toward the center of the connector channel. A second plate has positioning holes around its perimeter for mounting the connectors of the server using the force of the spring structures. The first plate is rotatable around a rotation axis to align the connectors of the server with the connectors of the rack. The second plate may have an elastic layer that is compressed to change a width of the second plate by inserting the second plate to the rack to automatically align the connectors of the server and of the rack in the horizontal direction.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: December 26, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11856724
    Abstract: A system comprises a rack, a support member, and a component configured for being supported in the rack by the support member. The support member is selectively insertable in the rack and comprises a plate at its rear end, the plate extending at an angle from a direction of insertion of the support member in the rack, the support member further comprising a first liquid connector mounted to the plate. The component comprises a second liquid connector mounted on a rear edge of the component, the second liquid connector being connectable to the first liquid connector when the support member and the component are inserted in the rack. A method comprises mounting the first and second liquid connectors to the support member and to the component, respectively, inserting the support member to the rack, and inserting the component in the rack until both liquid connectors are connected.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: December 26, 2023
    Assignee: OVH
    Inventors: Christophe Maurice Thibaut, Etienne Zahm, Henryk Klaba, Jules Hermann Bonenfant, Valentin Cartigny
  • Patent number: 11849569
    Abstract: A configurable, double sided, manifold micro-channel cold plate includes a one or more manifold micro-channel cold plate cells. Each cold plate cell includes a manifold body, a manifold insert, a plurality of heat sinks, and a plurality of longitudinal openings configured for fluidic communication with the fluid channels. The manifold body has fluid channels to permit flow of a fluid coolant. The manifold insert has a plurality of manifold insert fluid channels, and is configured for receipt in the one of the modular body recesses. The heat sinks are configured for receipt in the modular body recesses, and include an impingement surface configured for fluidic communication with the manifold insert fluid channels, and a heat transfer surface for thermal communication with one or more heat generating devices.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: December 19, 2023
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Feng Zhou, Ercan M. Dede, Hiroshi Ukegawa
  • Patent number: 11849564
    Abstract: An adopting core device including a main board, a server connector module, a leaking sensor, and an electromagnet device is proposed in the current application. In an embodiment, a main board including a fluid channel assembled by a manual mating connector through hoses and a blind mating connector fixed on the other side. In an embodiment, the manual mating connector is connected to a rack connector of a rack manifold of an electronic rack coupled to an external cooling fluid source to receive and to return cooling fluid from and to the external cooling fluid source. For example, the blind mating connector is capable of being engaged with or disengaged from a server fluid connector of a server chassis. In an embodiment, the server chassis comprises a leaking sensor configured to detect leakage of the cooling fluid within the server chassis.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: December 19, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11842876
    Abstract: A single bolt fuse assembly and method to connect a single bolt fuse to a circuit or device are disclosed. The single bolt fuse assembly enables the single bolt fuse to be used on any electrical device having a hole suitable for receiving a threaded shaft and connectable to a circuit or device that electrically connects to a female battery or power cable. The apparatus includes a separate high-conductive metal terminal that mates with the stud that mechanically attaches the fuse between the electrical devices. The stud is insulated to avoid becoming part of the electrical circuit and to ensure proper operation of the fuse. By mechanically attaching the stud to the metal terminal, the stud is unlikely to get separated from the fuse.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: December 12, 2023
    Assignee: Littelfuse, Inc.
    Inventors: Tiziano Bianchin, Massimiliano Tinto, Andrew J. Jozwiak, Geoffrey Schwartz
  • Patent number: 11837540
    Abstract: A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: December 5, 2023
    Assignee: KYOCERA AVX Components Corporation
    Inventors: Dan Rozbroj, Yehuda Seidman, Elinor O'Neill
  • Patent number: 11832423
    Abstract: A cooling unit to deliver liquid cooling to one or more peripheral devices is disclosed. The cooling unit includes one or more first mounting structures, the one or more first mounting structures are mounted onto the cooling unit, where the one or more first mounting structures are movable along a first direction. The cooling unit includes one or more cooling devices mounted to the one or more first mounting structures, where each of the one or more cooling devices is coupled to the one or more liquid distribution channels to receive cooling liquid to cool one or more peripheral devices of a server system. The cooling unit includes one or more liquid distribution channels to distribute cooling liquid within the server system, between the server system and other server systems, and/or between the server system and a liquid distribution system of an electronic rack.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: November 28, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11832417
    Abstract: A computing system includes a chassis, a circuit board including at least one electronic component, a mounting bracket secured to the chassis, a support bracket pivotably coupled to the mounting bracket, and a cold plate coupled to the support bracket. The support bracket is pivotable between a first configuration and a second configuration. The cold plate is in contact with the at least one electronic component in the first configuration, and the cold plate is removed from contact with the at least one electronic component in the second configuration.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: November 28, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Kun-Pei Liu
  • Patent number: 11825636
    Abstract: An electronic rack includes condensing, coolant distribution, and server regions. The condensing region includes a condensing container housing condensing coils and a coolant container to contain two phase coolant. The coolant distribution region includes a set of rack manifolds having at least a rack liquid supply line to receive coolant from the coolant distribution region, and a vapor line to return vapor to the coolant distribution region, a liquid return line. The server region is coupled to the condensing region and the coolant distribution region, the server region includes a number of server slots to receive a number of servers, where each of the servers is at least partially submerged within two phase liquid coolant, where, when the servers operate, the servers generate heat that is extracted by the two phase liquid coolant thereby causing at least some of the two phase liquid coolant to turn into a vapor.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: November 21, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11823857
    Abstract: A fuse module including a housing, a busbar disposed within the housing adjacent an interior surface of a rear wall of the housing, a terminal extending through a front wall of the housing and having a fuse coupling portion disposed within the housing adjacent an interior surface of a front wall of the housing and a conductor coupling portion protruding from an exterior surface of the front wall of the housing, and a movable pushrod extending through the rear wall of the housing and having a head portion disposed adjacent a rigid portion of the busbar for moving the rigid portion of the busbar between a retracted position, the rigid portion of the busbar located near the interior surface of the rear wall, and an extended position wherein the rigid portion of the busbar is located further from the interior surface of the rear wall relative to the retracted position.
    Type: Grant
    Filed: October 3, 2022
    Date of Patent: November 21, 2023
    Assignee: Suzhou Littelfuse OVS Co., Ltd.
    Inventors: Edward Jin, Vector Li, Zhibo Liu
  • Patent number: 11817284
    Abstract: A fuse holder includes a movable tab, a base, and a cover. A stud is affixed to the movable tab and secures a terminal of a bolt-down fuse. A second stud is affixed to the base and secures a second terminal of the bolt-down fuse. The base has a channel into which the movable tab is slidably inserted. The cover connects to the base and is located over the stud and the second stud.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: November 14, 2023
    Assignee: Littelfuse, Inc.
    Inventors: Andrew Jozwiak, Jesus Roberto Morales
  • Patent number: 11810742
    Abstract: [Problem] Provided is a method for manufacturing an assembly including an igniter, a projectile, and a cylinder that is easy to assemble.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: November 7, 2023
    Assignee: DAICEL CORPORATION
    Inventor: Katsuhiro Nakahashi
  • Patent number: 11811272
    Abstract: An electronic module for a power tool having an electric motor is provided including a printed circuit board (PCB), an inverter bridge circuit, a first conductive track disposed on the PCB and coupled to the power source, a second conductive track disposed on the PCB and coupled to the inverter bridge circuit, and a fuse strap provided between the first conductive track and the second conductive track. The fuse strap includes a main body spaced apart from the PCB, a first mounting portion mounted on the first conductive track via a first solder joint, and a second mounting portion mounted on the second conductive track via a second solder joint.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: November 7, 2023
    Assignee: BLACK & DECKER, INC.
    Inventors: Eric W. Wachter, Erik A. Ekstrom