Abstract: The technology relates to a heat sealing system (400). For instance, the heat sealing system may include a sealer assembly (800) including a pair of heat sealing bars (830, 840) configured to generate heat seals. The heat sealing system may also include a positioning (900) assembly including a platform (910) and a motor (952). The sealer assembly may be mounted to the positioning assembly, and the motor may be configured to move the sealer assembly towards and away from an edge of a table (1600).

Abstract: An ultrasonic welding system and method for making welds on a strip made of polymeric material. The system includes a supporting structure, N welding equipment mounted thereon, and a processor. Each N welding equipment includes a pair of welding heads made of a sonotrode, including a sonotrode welding surface, and an anvil, including an anvil welding surface. One of the two welding heads is movable with respect to the other between a non-operating position and a welding position. A control member is operatively associated with the sonotrode and configured to vibrate the sonotrode at a nominal ultrasonic vibration frequency and to detect a current value of the vibration frequency. A vibration sensor is mounted on the movable welding head. The processor monitors the alignment condition between the sonotrode welding surface and the anvil welding surface by cooperating with the control member and with the vibration sensor.

Abstract: Method of manufacturing a microfluidic device comprising an inflexible polymeric substrate, one or more flexible polymeric substrate(s) and one or more microfluidic channel(s) enclosed between the substrates comprising a) providing a master form including rim protrusions defining an enveloping shape for the microfluidic channel(s) to be produced and enclosed between the substrates, b) placing one or more flexible polymeric substrate(s) each having a layer thickness of less than 800 ?m onto the master form, wherein one flexible polymeric substrate is in contact with the rim protrusions of the master form, c) placing an inflexible polymeric substrate with a layer thickness of equal to or more than 800 ?m onto the flexible polymeric substrate(s), and d) ultrasonically welding the one or more flexible polymeric substrate(s) and the inflexible polymeric substrate at the rim protrusions. By the inventive method microfluidic devices via ultrasonic welding without using energy directors can be obtained.

Abstract: An apparatus for removing a bipolar element for a display module includes: a remover that removes the bipolar element; and a solvent storage that supplies solvent to the remover, wherein the remover includes: a partition wall defining a solvent channel which the solvent is injected into and discharged from; and a vibrator disposed inside the solvent channel.

Abstract: A maleimide-based copolymer containing: 40% to 65% by mass of an aromatic vinyl-based monomer unit; and 35% to 60% by mass of a maleimide-based monomer unit, in which a residual amount of an aromatic vinyl-based monomer is 200 to 2000 ppm by mass, and a residual amount of a maleimide-based monomer is 30 to 400 ppm by mass.

Abstract: A substrate processing apparatus is provided. The substrate processing apparatus comprise: a first chamber including a sidewall providing an opening, the first chamber further including a movable part movable upward and downward within the first chamber; a substrate support disposed within the first chamber; a second chamber disposed within the first chamber and defining, together with the substrate support, a processing space in which a substrate mounted on the substrate support is processed, the second chamber being separable from the first chamber and transportable between an inner space of the first chamber and the outside of the first chamber via the opening; a clamp releasably fixing the second chamber to the movable part extending above the second chamber; a release mechanism configured to release the fixing of the second chamber by the clamp; and a lift mechanism configured to move the movable part upward and downward.

Abstract: A green, safe and environmentally-friendly process and production equipment for industrialized continuous large-scale production of a formaldehyde-free water-based adhesive; the process includes: performing a polymerization reaction on a monomer having a carbon-carbon unsaturated double bond and an acid anhydride group and at least one other monomer containing a carbon-carbon unsaturated double bond that serve as raw materials in the presence of a solvent and an initiator; and performing solid-liquid separation on the polymerization reaction solution under the action of a high-temperature inert carrier gas, vaporizing, condensing, and recovering the solvent for indiscriminate use in polymerization reaction, and performing a gas-solid reaction on the solid material serving as a polymer intermediate and a mixed gas of ammonia gas and air to obtain a solid formaldehyde-free water-based adhesive product.

Abstract: The present invention relates to an adhesive composition containing (a) modified cellulose fibers having a cellulose I crystal structure, an average fiber length of 1000 nm or less, and an average fiber diameter of 1 nm or more and 300 nm or less; and (b) a resin. According to the present invention, an adhesive composition having excellent mechanical strength such as shearing adhesive strength can be provided. The adhesive composition of the present invention described above can be utilized in structural adhesion of vehicle assembly products and the like.

Abstract: A heating block assembly including one or more configurable insulator segments and a heater block having a first surface configured to removably receive the one or more configurable insulator segments, in which each of the one or more configurable insulator segments covers only a portion of the first surface. A method for sealing at least one portion of a package using such a heating block assembly is also disclosed.

Abstract: A system may include a folding apparatus configured to fold a card carrier for affixing a transaction card to the card carrier and a processor which can receive a first input from a user regarding a number of folds desired in the card carrier and a location of the folds on the card carrier, receive a second input regarding one or more directions of the folds to be made on the card carrier, and transmit a signal to a positioner motor configured to position the card carrier based on the first input and the second input such that the folding apparatus folds the card carrier according to the first input and the second input.

Abstract: A manufacturing method for an optical unit includes: molding a first wafer in which a plurality of the first optical elements are formed; molding a second wafer in which a plurality of the second optical elements are formed; forming a bonding portion in a first peripheral portion surrounding the first optical element or a second peripheral portion corresponding to the first peripheral portion and surrounding the second optical element; bonding the first wafer and the second wafer with the bonding portion to seal the first optical element and/or the second optical element; and cutting the first wafer and the second wafer at the first and second peripheral portions in a state where the first and second wafers are bonded to each other to dice an optical unit, in which the adhesive in the bonding portion formed in the forming the bonding portion is in a semi-cured state.

Abstract: A detachable structure comprises at least two interfaces including an assembly interface and a favored-detachment interface, a receiver substrate, and a donor substrate comprising a working layer that is to be transferred, arranged on an initial substrate. The favored-detachment interface is situated between the working layer and the initial substrate, and the assembly interface is situated between the working layer and the receiver substrate. The assembly interface has an assembly-interruption zone comprising at least one cavity present in the receiver substrate or in the working layer, and the assembly-interruption zone is located in a peripheral region of the detachable structure.

Abstract: A converter having a converter base part, a bolt connected to the converter base part, a tensioning element and at least one piezo element with a through-opening, the bolt penetrating the through-opening and the tensioning element tensioning the at least one piezo element in the direction of the converter base part, wherein that the bolt is connected to the converter base part in a material bond.

Abstract: A seam bonding system includes a drum rotatable about an axis. A seam bonder is mounted to the drum such that the seam bonder is rotatable with the drum about the axis. A horn of the seam bonder is movable along a transverse direction over an anvil of the seam bonder. The seam bonding system also includes features for positioning a lobe of a web material on the drum while the horn of the seam bonder moves along the transverse direction over the anvil of the seam bonder.

Abstract: A composite fibre cement cladding element, comprising a plurality of fibre cement component pieces is provided wherein the fibre cement component pieces are fused together to provide a single unit that gives the appearance of two or more courses of cladding elements in a series.

Abstract: An adhesive tape dispenser having a guide function includes a handle, a retaining frame, a tape cutting unit, a guide unit, and a tape holding unit. The retaining frame is disposed on the handle. The retaining frame has a pair of vertical plates. The tape cutting unit has a roller and a blade that are located between the vertical plates. The guide unit has a pair of guide plates located outside the respective vertical plates. The guide plates each have a fastener for securing the guide plates to the respective vertical plates. The tape holding unit is configured to install an adhesive tape roll. Guide members of the guide plates are able to be in close contact with both sides of wooden planks, so as to achieve the effect of sticking the adhesive tape centrally.

Abstract: A task to be achieved by the invention is to provide a foamed sheet having excellent retention of foam, hand feeling, and peel strength. The present invention provides a foamed sheet which is formed from a water dispersion of a urethane resin (X), wherein the water dispersion has a urethane resin (X) content of 50 to 80% by mass, and the water dispersion contains no organic solvent. Further, the present invention provides a synthetic leather having at least a substrate (i) and a polyurethane layer (ii), wherein the polyurethane layer (ii) is formed from the above-mentioned foamed sheet. The foamed sheet preferably has a density of 200 to 1,000 kg/m3.

Abstract: A construction board comprising (i) a foam body having a generally planar shape with first and second planar surfaces, where said foam body is a closed-cell foam body including pentane and a blowing agent additive that has a Hansen Solubility Parameter that is greater than 17 MPa?0.5 contained within the foam body; and (ii) first and second facers attached to said first and second planar surfaces, respectively.

Abstract: The semiconductor manufacturing apparatus of the embodiment includes a first roller performing a first release of a release tape, the release tape having a strip-like configuration and having a first end and a second end, the release tape pasted on a protective tape pasted on a second substrate surface of a substrate, the substrate having a first substrate surface and the second substrate surface facing the first substrate surface, the second substrate surface being provided above the first substrate surface, and the first roller performing a first movement in a direction parallel to the second substrate surface from on the first end toward above a center or its vicinity of the second substrate surface; and a second roller performing a second release of the release tape, the second roller performing a second movement in a direction parallel to the second substrate surface from on the second end toward above the center or its vicinity of the second substrate surface.

Abstract: An air-gap HCF connector termination method and connector assembly for factory and field connector assembly termination for patch cables and trunk cables made from HCF, where in multitude of mechanisms can facilitate air-gap between the first and second HCF fiber end-faces, comprising preparing the HCF end-faces using appropriate cleaving methods including mechanical, ultrasonic and laser cleaving, such that the air-gap separation between first and second HCF's can be anywhere between 0.5-100 microns, where reflection at the connector interface is low with RL>35 dB, due to HCF propagation mode effective index matching with index of air.