Abstract: A fiber optic temperature sensor, a sensing head structure, and a manufacturing method are provided. The fiber optic temperature sensor includes a broad spectrum light source, a first fiber optic coupler, a spectrometer, a first sensing interferometer, and a second sensing interferometer. The first sensing interferometer and the second sensing interferometer have opposite temperature responses. A first free spectral range corresponding to the first sensing interferometer is close to but not equal to a second free spectral range corresponding to the second sensing interferometer. In the fiber optic temperature sensor, two sensing interferometers both sensitive to temperature are used, and the two sensing interferometers have opposite temperature responses, thereby achieving an enhanced vernier effect, and improving the sensitivity of temperature measurement.

Abstract: The present disclosure relates to a compact temperature sensor displaying a temperature-resistance relationship. The temperature sensor comprises cross-coupled CMOS technology exhibits negative resistance, resulting in resistance-sensitive temperature sensing and amplification. The temperature sensor can be tuned to operate across a wide range of temperatures via modulation of a biasing current. The present disclosure further relates to subthreshold operation of CMOS technology.

Abstract: In a device for controlling the temperature of a test sample in a measuring device for measuring material properties of the test sample, comprising a measuring cell for receiving the test sample, at least one temperature controlling element, and a thermal storage element coupled to the temperature controlling element to transfer heat, wherein means are provided for changing the thermal resistance between the thermal storage element and the measuring cell in order to selectively couple or decouple the thermal storage element and the measuring cell in terms of heat transfer, the ratio of the thermal capacity of the thermal storage element to the thermal capacity of the measuring cell is greater than 1:1, preferably at least 2:1, preferably at least 5:1.

Abstract: The present application relates to the technical field of thermodetector, and discloses a high stability Bluetooth temperature measuring probe, including a needle tube having a hollow mounting chamber, a handle configured to abut against a tail end of the needle tube, a first thermal sensor positioned in the mounting chamber of the needle tube close to the head end, an antenna mounted inside the needle tube and electrically connected to the first thermal sensor, and a locking assembly configured for connecting the handle to the needle tube. The locking assembly includes a locking member, a locking nut and a limiting nut, in which the limiting nut is connected to the antenna and is configured to limit the locking member; and an inner wall of the needle tube is defined with a locking slot.

Abstract: A system is disclosed, including an interface to a DUT and a testing apparatus. The DUT includes a first plurality of temperature sensing circuits. The testing apparatus may store a plurality of control values. Each control value may depend on at least two calibration values of corresponding temperature sensing circuits of a second plurality of temperature sensing circuits. The testing apparatus may generate a plurality of calibration values for the DUT. Each calibration value corresponds to one of the first plurality of temperature sensing circuits. The testing apparatus may determine a plurality of test values for the DUT. The testing apparatus may calculate a probability value, and repeat generation of the plurality of calibration values upon determining that the probability value is less than a predetermined threshold value. The probability value corresponds to a likelihood that the plurality of calibration values is accurate.

Abstract: A temperature sensor assembly having a support tube defining an interior, a temperature sensor having a distal end and a proximal end located within the interior, and, a concentric ring surrounding at least a portion of the temperature sensor and the concentric ring is positioned between the temperature sensor and the support tube for holding the temperature sensor in the support tube.

Abstract: A temperature monitor, a system, and a method monitor temperature on a roof. The temperature monitor includes a base for attaching to the roof, a temperature sensor for detecting changes in temperature, the temperature sensor is attached to the base and positioned periodically on the base, and a roof sensor device attached to the base for transmitting measurement data received from the temperature sensor.

Abstract: An ear tag module includes a rod member, a spike, a circuit component, and a temperature sensor. The spike is disposed on one side of the rod member, and the circuit component is disposed on another side of the rod member. The temperature sensor is electrically connected to the circuit component. When the spike penetrates an ear, the ear is in contact with a sensing area of the rod member, and the temperature sensor is located in the rod member to detect a temperature of the ear and transmit at least one temperature sensing information to the circuit component.

Abstract: A cable having a sensor for measuring variables comprises an insulation displacement contact (IDC) that is at least partially enclosed within a sensor housing having the sensor disposed therein. The IDC comprises one or more IDC sheath prongs that extend through an insulating sheath to the conducting wire of the cable. The IDC continuously extends from an IDC longitudinal first end to an IDC longitudinal second end. The sensor housing comprises a first housing side and a second housing side. When the IDC is at least partially enclosed by the sensor housing, a first housing side longitudinal first end and a second housing side longitudinal first end are proximate the IDC longitudinal first end, and a first housing side longitudinal second end and a second housing side longitudinal second end are proximate the IDC longitudinal second end.

Abstract: In an example, a thermal imaging test article comprises a block configured to be attached to a blackbody on a back side of the block, the block having a variable thickness to represent facial features of a human face, the block including a cutout to allow a thermal imaging device to see the blackbody behind the block through the cutout, and one or more heaters thermally coupled to the block to produce heat to heat the block. The variable thickness of the block and the heat produced by the one or more heaters are selected to simulate thermally the human face on a front side of the block.

Abstract: The present invention discloses a device for measuring gas temperature in plasma, including: a vacuum chamber, a fiber optic temperature sensor, a quartz tube, a circulator, a spectrometer, a broadband light source and a computer. One end of the quartz tube is inserted into the vacuum chamber. The fiber optic temperature sensor is located in the plasma in the vacuum chamber and fixed to the quartz tube. The fiber optic temperature sensor is connected to the circulator by means of an optical fiber passing through the quartz tube. The circulator is connected to the broadband light source and the spectrometer through optical fibers, respectively. The spectrometer is electrically connected to the computer which is configured to read and record spectra collected by the spectrometer.

Abstract: A sensor module includes a first contact, a second contact, and a sensing element made from an iono-conductive material having a conductivity that varies at least in response to variations in an environmental factor. The sensing element is electrically coupled to the first contact and to the second contact, and a first resistance of the sensing element, measured between the first contact and the second contact, varies in response to the variations in the environmental factor.

Abstract: The present disclosure provides a temperature detection circuit. The temperature detection circuit includes: a first comparator, the first comparator having a first negative input terminal, a first positive input terminal and a first output terminal, the first negative input terminal being connected with an output terminal of a temperature sensor, the first positive input terminal being connected with a first reference voltage terminal; a monostable trigger, an input terminal of the monostable trigger being connected with the first output terminal of the first comparator; a low pass filter, an input terminal of the low pass filter being connected with an output terminal of the monostable trigger. The present disclosure further provides a temperature sensor device and a display device.

Abstract: Thermal monitors comprising a substrate with at least one camera position on a bottom surface thereof, a wireless communication controller and a battery. The camera has a field of view sufficient to produce an image of at least a portion of a wafer support, the image representative of the temperature within the field of view. Methods of using the thermal monitors are also described.

Abstract: Disclosed herein is a method for measuring temperature via distributed temperature sensing comprising transmitting light through a fiber optic cable; detecting backscattered light in the fiber optic cable, wherein the backscattered light comprises an anti-Stokes band and a Stokes band; calculating a ratio between an intensity of the anti-Stokes band and an intensity of the Stokes band; and using the calculated ratio to determine a temperature being sensed in the fiber optic cable; wherein the fiber optic cable comprises, from the center to the periphery; a central core having a refractive index that decreases progressively from a center of the central core to an edge of the core, wherein the refractive index follows an alpha profile; wherein a bandwidth-length product of the multimode optical fiber has a value greater than 2000 MHz-km at 1550 nm.

Abstract: An over-the-air measurement system for investigating a device under test with respect to its temperature behavior is provided. The over-the air measurement system includes a positioning unit attached to the device under test for positioning the device under test, at least one antenna, and a temperature generating unit for generating heated or cooled air. The over-the-air measurement system includes a piping system comprising at least one pipe connected to the temperature generating unit for passing the heated or cooled air generated by the temperature generating unit into at least one opening of an enveloping material surrounding the device under test or for siphoning the heated or cooled air.

Abstract: The present invention provides a thermal sensor integrated IC having a resistor and a converting circuit. The resistor is implemented by at least one metal line, wherein a resistance of the resistor is varied with a temperature of the resistor, the resistor has a first terminal and a second terminal, and one of the first terminal and the second terminal is arranged to provide a voltage signal corresponding to the resistance. The converting circuit is coupled to the resistor, and is configured to convert the voltage signal to an output signal for determining the temperature. In one embodiment, the at least one metal line is made by copper.

Abstract: A cavity blackbody radiation source is provided. The cavity blackbody radiation source comprises a blackbody radiation cavity and a carbon nanotube composite material. The blackbody radiation cavity comprises an inner surface. The carbon nanotube composite material is located on the inner surface. The carbon nanotube composite material comprises a black lacquer and a plurality of carbon nanotubes, and the plurality of carbon nanotubes is dispersed in the black lacquer.

Abstract: A cavity blackbody radiation source is provide. The cavity blackbody radiation source comprises a blackbody radiation cavity and a carbon nanotube composite material. The blackbody radiation cavity comprises an inner surface. The carbon nanotube composite material is located on the inner surface. The carbon nanotube composite material comprises a black lacquer and a plurality of carbon nanotubes, and the plurality of carbon nanotubes is in an upright state in the black lacquer.

Abstract: A method for determining the junction temperature of at least one die of a semiconductor power module, the semiconductor power module being composed of plural dies connected in parallel and switching between conducting and non conductor states according to pattern cycles, the method comprises the steps of: disabling the conducting of the at least one die during at least a fraction of one switching cycle, applying a current limited voltage to the gate of the at least one die during a period of time of the cycle wherein the at least one die is not conducting, the resulting voltage excursion having a value that does not enable the die to be conducting, measuring the voltage at the gate of the die, deriving from the measured voltage a temperature variation of the junction of the at least one die or the temperature of the junction of the die.