Patents Examined by Jason S Uhlenhake
  • Patent number: 11571894
    Abstract: A multi-chip module (MCM) assembly comprising: a graphite substrate comprising a plurality of silicon chips directly attached to the graphite substrate, and a Printed Wiring Board (PWB) attached to the graphite substrate by means of a solvent-resistant adhesive glue and provided with openings surrounding outer profiles of the silicon chips. A printing bar comprising a plurality of the MCM assemblies is also disclosed.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: February 7, 2023
    Assignee: SICPA HOLDING SA
    Inventors: Silvano Tori, Tazio Sandri, Marco Sarti, Lucia Giovanola
  • Patent number: 11565531
    Abstract: A physical quantity detection device including a container that accommodates a detection object formed of a dielectric, a first electrode provided at an outer side of the container, a second electrode that is provided separately from and to face the first electrode, and an electrostatic capacitance detector that detects an electrostatic capacitance between the first electrode and the second electrode. The electrostatic capacitance detector includes a waveform generation source coupled to the first electrode and a voltage detection circuit coupled to the second electrode. A relationship of |Zc|/|Z1|+|Zc|>|Zc|/|Z2|+|Zc| is satisfied in which |Zc| is an absolute value of an input impedance of the electrostatic capacitance detector, |Z1| is an absolute value of an impedance when the detection object is present between the first electrode and the second electrode, and |Z2| is an absolute value of an impedance when no detection object is present between the first electrode and the second electrode.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: January 31, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Takayuki Yonemura
  • Patent number: 11559982
    Abstract: A printing process is disclosed which comprises directing droplets of an ink onto an intermediate transfer member to form an ink image, the ink including an organic polymeric resin and a coloring agent in an aqueous carrier, and the transfer member having a hydrophobic outer surface so that each ink droplet in the ink image spreads on impinging upon the intermediate transfer member to form an ink film. The ink is dried while the ink image is being transported by the intermediate transfer member by evaporating the aqueous carrier from the ink image to leave a residue film of resin and coloring agent. The residue film is then transferred to a substrate.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: January 24, 2023
    Assignee: LANDA CORPORATION LTD.
    Inventors: Benzion Landa, Yehoshua Sheinman, Sagi Abramovich, Galia Golodetz, Gregory Nakhmanovich, Meir Soria
  • Patent number: 11554585
    Abstract: A liquid ejecting head includes wiring members including a first-wiring member having a first-output terminal portion extending in a first-direction and a first-input terminal portion extending in the first-direction, and a second-wiring member having a second-output terminal portion extending in the first-direction and a second-input terminal portion extending in the first-direction; and a first-wiring substrate coupled to the first and second input terminal portions, in which a center of the first-output terminal portion is located in the first-direction with respect to a center of the second-output terminal portion in plan view, a center of the first-input terminal portion is disposed in a second-direction opposite to the first-direction with respect to the center of the first-output terminal portion in the plan view, and a center of the second-input terminal portion is disposed in the first-direction with respect to the center of the second-output terminal portion in the plan view.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: January 17, 2023
    Assignee: Seiko Epson Corporation
    Inventor: Hiroaki Okui
  • Patent number: 11548281
    Abstract: A printing method for performing printing while complementing black with composite black, the printing method including: printing a test pattern having a plurality of patch images for which composite mode varies, this test pattern being printed for each dot size of the black to be complemented; causing a user to select a desired patch image from among the plurality of the patch images included in the printed test pattern, the selection being made for each of the dot size of the black ink to be complemented; and performing printing while complementing the black to be complemented with the composite black generated on a basis of the composite mode corresponding to the desired patch image selected correspondingly to the dot size of the black ink to be complemented.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: January 10, 2023
    Assignee: Seiko Epson Corporation
    Inventors: Hiroki Sato, Akito Sato
  • Patent number: 11548287
    Abstract: In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: January 10, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Patent number: 11548283
    Abstract: There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: January 10, 2023
    Assignee: SII PRINTEK INC.
    Inventors: Suguru Munakata, Yuji Nakamura, Yuzuru Kubota, Daiki Irokawa
  • Patent number: 11541659
    Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: January 3, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Silam J Choy, Michael W Cumbie, Devin Alexander Mourey, Chien-Hua Chen
  • Patent number: 11529814
    Abstract: A printing apparatus comprises: a print head comprising, for each of a plurality of types of inks, an ejection opening and pressure chamber, and configured to perform printing operation by ejecting the ink from the ejection opening; a circulation unit capable of circulating the ink of each ink type; a determination unit configured to determine an accumulated time for which a first type of ink is circulated by the circulation unit in the printing operation using the first type of ink and not using a second type of ink different from the first type of ink; and a control unit configured to perform control based on the determined accumulated time to cause the circulation unit to circulate at least the second type of ink among the plurality of types of inks in a case where the accumulated time is longer than a predetermined time.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: December 20, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takatoshi Nakano, Yoshinori Nakagawa, Atsushi Takahashi, Takuya Fukasawa
  • Patent number: 11524499
    Abstract: A substrate includes a first substrate which has a first substrate through hole, and a second substrate which has a second substrate through hole and directly or indirectly overlaps the first substrate, the first substrate through hole and the second substrate through hole directly or indirectly communicate with each other to form a liquid supply path and a width D1 of an opening portion of the first substrate through hole on a surface of the first substrate closer to the second substrate, a width D2 of an opening portion of the second substrate through hole on a surface of the second substrate closer to the first substrate, a width D3 of an opening portion of the second substrate through hole on a surface of the second substrate farther from the first substrate have a relationship of D1<D2 and D3<D2.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: December 13, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Noriyasu Ozaki, Takayuki Kamimura
  • Patent number: 11524506
    Abstract: A mobile device configured to be coupled to a counterpart device includes a driving section configured to be driven by electric power, a coupling section configured to be coupled to the counterpart device, and an accommodation section configured to accommodate an all-solid-state battery. When the counterpart device is coupled to the coupling section, the driving section is driven by electric power supplied from the counterpart device, and when the counterpart device is not coupled to the coupling section, the driving section is driven by electric power supplied from the all-solid-state battery.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: December 13, 2022
    Assignee: Seiko Epson Corporation
    Inventor: Shota Odajima
  • Patent number: 11518168
    Abstract: A liquid discharge head includes a plurality of discharge elements, a plurality of driving elements, a plurality of control circuits, a first ground wiring and a first power supply wiring configured to supply power to the plurality of discharge elements and the plurality of driving elements, and a second ground wiring and a second power supply wiring configured to supply power to the plurality of control circuits. The first ground wiring and the first power supply wiring include, in a first conductive layer of a plurality of conductive layers, a first wiring group extending in a first direction, and in a second conductive layer, a second wiring group extending in a second direction which intersects with the first direction. The second power supply wiring is arranged on one of the first conductive layer and the second conductive layer.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: December 6, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventor: Makoto Takagi
  • Patent number: 11518167
    Abstract: A liquid jet device includes a head body configured to jet droplets from a nozzle, a frame at which the head body is positioned, a grounding portion configured to contact a first side surface of the head body in a removal direction from the frame to electrically couple the head body to the frame, and a first pin serving as a pin for positioning the head body with respect to the frame, wherein a contact position between the first side surface and the grounding portion and a position of the first pin overlap in a normal direction of the first side surface.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: December 6, 2022
    Assignee: Seiko Epson Corporation
    Inventor: Masaki Kobayashi
  • Patent number: 11518166
    Abstract: There is provided a method of manufacturing a liquid ejection head. The liquid ejection head includes a recording device substrate, an electric wiring member configured to be connected to the recording device substrate at an electric connection portion, and a support member including a concave portion and a convex portion. The convex portion includes a first surface and a second surface. The method includes applying an adhesive to the surface of the concave portion on which the recording device substrate is to be placed and to the first surface, pressing the applied adhesive after the recording device substrate is placed on the surface of the concave portion on which the recording device substrate is to be placed, to fill, with the adhesive, a gap between the convex portion and the recording device substrate to a position higher than the first surface, and sealing the electric connection portion.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: December 6, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yasuaki Kitayama, Kyosuke Toda, Tatsunori Fujii
  • Patent number: 11518169
    Abstract: Provided are a load distribution apparatus capable of efficiently distributing loads for a plurality of inkjet head modules and a substrate treatment system including the same. The load distribution apparatus includes a second support formed to be elongated in one direction and having both side portions higher than a central portion and in which a head module for discharging droplets onto a substrate is installed in the central portion, a first support supporting the second support on at least one side and supporting the second support below the second support, a first support unit supporting the second support on at least one side and supporting the second support above the second support, and a plate installed above the first support unit and connected to the first support unit, wherein a load of the head module is distributed by the first support and the first support unit.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: December 6, 2022
    Assignee: Semes Co., Ltd.
    Inventors: In Seok Ha, Jin Hyuck Yang, Jae Young Jang
  • Patent number: 11504967
    Abstract: Disclosed is a method of manufacturing, a metal nozzle plate, in which is formed a nozzle for discharging a liquid and that is to be bonded with adhesive to a head chip provided with an actuator for discharging the liquid, the method including: forming the nozzle in a metal plate-like member; forming a groove in the metal plate-like member; and performing exterior processing with respect to the nozzle plate.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: November 22, 2022
    Assignee: KONICA MINOLTA, INC.
    Inventors: Jun Marubayashi, Akihisa Shimomura, Yusuke Hayashi, Tadashi Hirano, Shingo Uraki, Yohei Sato
  • Patent number: 11504968
    Abstract: A liquid ejection head includes a liquid ejection face on which multiple ejection port arrays, each of which is formed with multiple ejection ports that eject liquid, are arranged. In the liquid ejection head, a first protrusion and a second protrusion, which have different sizes, are arranged in peripheral areas of the ejection port arrays on the liquid ejection face.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: November 22, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Keiji Matsumoto, Shinji Kishikawa
  • Patent number: 11491787
    Abstract: There are provided a head chip and so on capable of improving the print image quality. The head chip according to an embodiment of the present disclosure is provided with an actuator plate having a plurality of ejection grooves and a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves. The plurality of ejection grooves is arranged side by side so as to at least partially overlap each other along a predetermined direction. Further, the nozzle holes adjacent to each other along the predetermined direction out of the plurality of nozzle holes are arranged so as to be shifted from each other along an extending direction of the ejection grooves in the nozzle plate.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: November 8, 2022
    Assignee: SII PRINTEK INC.
    Inventors: Tomoki Ai, Yuki Yamamura, Masakazu Hirata, Kenji Suzuki
  • Patent number: 11485159
    Abstract: A liquid discharge apparatus includes an apparatus body, a liquid discharge device configured to discharge a liquid, a carriage in the apparatus body, the carriage configured to movably mount the liquid discharge device, a first storage container detachably attached to the carriage, the first storage container configured to store a first liquid, and a second storage container detachably attached to the apparatus body, the second storage container configured to store a second liquid different from the first liquid.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: November 1, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Tetsu Morino, Takeyuki Kobayashi
  • Patent number: 11485145
    Abstract: A physical quantity detection device including a container that accommodates a detection object formed of a dielectric and whose depth direction is a direction of a z axis when an x axis, a y axis, and the z axis along a vertical direction are set as axes orthogonal to one another, a first electrode provided at an outer side of the container, at least one second electrode that has an elongated shape extending in a direction of the y axis, is provided at an outer side of the container, and is separated from and faces the first electrode in a direction of the x axis, a first insulation layer that covers the first electrode, a second insulation layer that covers the second electrode, and an electrostatic capacitance detector that detects an electrostatic capacitance between the first electrode and the second electrode.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: November 1, 2022
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Takayuki Yonemura