Patents Examined by Jason S Uhlenhake
  • Patent number: 11618259
    Abstract: A liquid jetting apparatus includes: a liquid jetting head having: a plurality of kinds of individual channels, a jetting surface formed with a plurality of kinds of nozzles from which a plurality of kinds of liquids are jetted, respectively, a plurality of kinds of inflow channels, a plurality of kinds of outflow channels; valves provided at least on the plurality of kinds of inflow channels; a wiper configured to be movable relative to the liquid jetting head in a direction along the jetting surface; a first motor configured to move the liquid jetting head and the wiper relative to each other; and a controller. The controller executes a wiping by driving the first motor in a state that the valves are closed.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: April 4, 2023
    Inventor: Taisuke Mizuno
  • Patent number: 11618266
    Abstract: A liquid discharge apparatus includes a recording head, a height changing mechanism, an image sensor, and control circuitry. The head discharges liquid onto a recording medium from above the medium to form an image on the medium. The height changing mechanism changes a height position of the head. The image sensor captures the image on the medium. The control circuitry is configured to: cause the height changing mechanism to change the height position of the head; cause the head to discharge the liquid at different height positions to form adjustment patterns on the medium; cause the image sensor to image the adjustment patterns; select at least one adjustment pattern from the adjustment patterns based on information on an abnormal image obtained from imaging data of the adjustment patterns; and determine, as the height position of the head, a height position corresponding to the at least one adjustment pattern selected.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: April 4, 2023
    Assignee: Ricoh Company, Ltd.
    Inventor: Yuri Suetsugu
  • Patent number: 11613122
    Abstract: A liquid ejecting head that has an ejection surface configured to eject a liquid includes a plurality of head chips that are long in a first direction. The plurality of head chips are arranged inside a virtual parallelogram including a first virtual side and a second virtual side that are in contact with at least one of the plurality of head chips and that extend in the first direction, and a third virtual side and a fourth virtual side that are in contact with at least one of the plurality of head chips and that extend in a second direction intersecting the first direction, and the ejection surface is not overlapped with an acute-angled portion of the virtual parallelogram when the ejection surface is viewed in a normal direction of the ejection surface.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: March 28, 2023
    Assignee: Seiko Epson Corporation
    Inventors: Hiroaki Okui, Eiichiro Watanabe, Shun Katsuie
  • Patent number: 11613133
    Abstract: A method is provided for manufacturing a paper layer having a printed pattern for use in panels that at least include a substrate and a top layer. The top layer includes the paper layer. The method may involve providing the paper layer with an inkjet receiver coating by transporting the paper layer relative to a coater in a coating direction. The coated paper layer may be provided with at least a portion of the printed pattern using a digital inkjet printer that includes a housing containing print heads. Providing the printed pattern may involve using water based pigment containing inks. The printed pattern may include a wood motif having wood nerves extending generally in a nerve direction substantially corresponding to the coating direction. Providing the printed pattern may involve a relative motion between the digital inkjet printer and the paper layer during a printing operation in a printing direction substantially corresponding or substantially opposite to the coating direction.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: March 28, 2023
    Assignees: UNILIN BV, AGFA, NV
    Inventors: Benjamin Clement, Laurent Meersseman, Patrick Van Den Bergen, Rudi Vanhooydonck
  • Patent number: 11597213
    Abstract: A liquid jetting apparatus includes a recording head unit including nozzles; a moving mechanism configured to alternately perform a scanning operation of moving the recording head unit in a scanning direction while causing the recording head unit to discharge a liquid and a sub-scanning movement operation of moving the recording head unit or the recording medium in a sub-scanning direction without causing the recording head unit to discharge the liquid; a gradation setting unit configured to set gradation on portions of image data corresponding to setting regions at ends of the recording head unit; an irregular pattern setting unit configured to set an irregular pattern on the image data to randomize a dot ratio indicating the number of dots per unit area; and a head discharge drive unit configured to cause the nozzles to discharge the liquid based on the image data.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: March 7, 2023
    Assignee: Ricoh Company, Ltd.
    Inventor: Atsushi Hada
  • Patent number: 11584126
    Abstract: A multi-chip module (MCM) assembly comprising: a graphite substrate having a front surface and a back surface and comprising a plurality of silicon chips mounted on the front surface, a Printed Wiring Board (PWB) attached to the graphite substrate and provided with openings surrounding outer profiles of the silicon chips, the graphite substrate comprises one or more ink channels on the back surface and one or more ink feeding slots passing through the graphite substrate and being in fluidic communication with the respective one or more ink channels, so that each of the silicon chips can be fed with one or more different types of inks, the MCM assembly further comprises a graphite cover plate configured to cover the one or more ink channels of the graphite substrate.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: February 21, 2023
    Assignee: SICPA HOLDING SA
    Inventors: Silvano Tori, Marco Sarti, Paolo Cappello
  • Patent number: 11577513
    Abstract: A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate contains two or more arrays of nozzle holes therein and a barrier structure disposed on an exposed surface of the nozzle plate between adjacent arrays of nozzle holes, wherein the barrier structure deters cross-contamination of fluids between the adjacent arrays of nozzle holes.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: February 14, 2023
    Inventor: Sean T. Weaver
  • Patent number: 11571894
    Abstract: A multi-chip module (MCM) assembly comprising: a graphite substrate comprising a plurality of silicon chips directly attached to the graphite substrate, and a Printed Wiring Board (PWB) attached to the graphite substrate by means of a solvent-resistant adhesive glue and provided with openings surrounding outer profiles of the silicon chips. A printing bar comprising a plurality of the MCM assemblies is also disclosed.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: February 7, 2023
    Assignee: SICPA HOLDING SA
    Inventors: Silvano Tori, Tazio Sandri, Marco Sarti, Lucia Giovanola
  • Patent number: 11565531
    Abstract: A physical quantity detection device including a container that accommodates a detection object formed of a dielectric, a first electrode provided at an outer side of the container, a second electrode that is provided separately from and to face the first electrode, and an electrostatic capacitance detector that detects an electrostatic capacitance between the first electrode and the second electrode. The electrostatic capacitance detector includes a waveform generation source coupled to the first electrode and a voltage detection circuit coupled to the second electrode. A relationship of |Zc|/|Z1|+|Zc|>|Zc|/|Z2|+|Zc| is satisfied in which |Zc| is an absolute value of an input impedance of the electrostatic capacitance detector, |Z1| is an absolute value of an impedance when the detection object is present between the first electrode and the second electrode, and |Z2| is an absolute value of an impedance when no detection object is present between the first electrode and the second electrode.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: January 31, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Takayuki Yonemura
  • Patent number: 11559982
    Abstract: A printing process is disclosed which comprises directing droplets of an ink onto an intermediate transfer member to form an ink image, the ink including an organic polymeric resin and a coloring agent in an aqueous carrier, and the transfer member having a hydrophobic outer surface so that each ink droplet in the ink image spreads on impinging upon the intermediate transfer member to form an ink film. The ink is dried while the ink image is being transported by the intermediate transfer member by evaporating the aqueous carrier from the ink image to leave a residue film of resin and coloring agent. The residue film is then transferred to a substrate.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: January 24, 2023
    Assignee: LANDA CORPORATION LTD.
    Inventors: Benzion Landa, Yehoshua Sheinman, Sagi Abramovich, Galia Golodetz, Gregory Nakhmanovich, Meir Soria
  • Patent number: 11554585
    Abstract: A liquid ejecting head includes wiring members including a first-wiring member having a first-output terminal portion extending in a first-direction and a first-input terminal portion extending in the first-direction, and a second-wiring member having a second-output terminal portion extending in the first-direction and a second-input terminal portion extending in the first-direction; and a first-wiring substrate coupled to the first and second input terminal portions, in which a center of the first-output terminal portion is located in the first-direction with respect to a center of the second-output terminal portion in plan view, a center of the first-input terminal portion is disposed in a second-direction opposite to the first-direction with respect to the center of the first-output terminal portion in the plan view, and a center of the second-input terminal portion is disposed in the first-direction with respect to the center of the second-output terminal portion in the plan view.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: January 17, 2023
    Assignee: Seiko Epson Corporation
    Inventor: Hiroaki Okui
  • Patent number: 11548283
    Abstract: There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: January 10, 2023
    Assignee: SII PRINTEK INC.
    Inventors: Suguru Munakata, Yuji Nakamura, Yuzuru Kubota, Daiki Irokawa
  • Patent number: 11548287
    Abstract: In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: January 10, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Patent number: 11548281
    Abstract: A printing method for performing printing while complementing black with composite black, the printing method including: printing a test pattern having a plurality of patch images for which composite mode varies, this test pattern being printed for each dot size of the black to be complemented; causing a user to select a desired patch image from among the plurality of the patch images included in the printed test pattern, the selection being made for each of the dot size of the black ink to be complemented; and performing printing while complementing the black to be complemented with the composite black generated on a basis of the composite mode corresponding to the desired patch image selected correspondingly to the dot size of the black ink to be complemented.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: January 10, 2023
    Assignee: Seiko Epson Corporation
    Inventors: Hiroki Sato, Akito Sato
  • Patent number: 11541659
    Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: January 3, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Silam J Choy, Michael W Cumbie, Devin Alexander Mourey, Chien-Hua Chen
  • Patent number: 11529814
    Abstract: A printing apparatus comprises: a print head comprising, for each of a plurality of types of inks, an ejection opening and pressure chamber, and configured to perform printing operation by ejecting the ink from the ejection opening; a circulation unit capable of circulating the ink of each ink type; a determination unit configured to determine an accumulated time for which a first type of ink is circulated by the circulation unit in the printing operation using the first type of ink and not using a second type of ink different from the first type of ink; and a control unit configured to perform control based on the determined accumulated time to cause the circulation unit to circulate at least the second type of ink among the plurality of types of inks in a case where the accumulated time is longer than a predetermined time.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: December 20, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takatoshi Nakano, Yoshinori Nakagawa, Atsushi Takahashi, Takuya Fukasawa
  • Patent number: 11524506
    Abstract: A mobile device configured to be coupled to a counterpart device includes a driving section configured to be driven by electric power, a coupling section configured to be coupled to the counterpart device, and an accommodation section configured to accommodate an all-solid-state battery. When the counterpart device is coupled to the coupling section, the driving section is driven by electric power supplied from the counterpart device, and when the counterpart device is not coupled to the coupling section, the driving section is driven by electric power supplied from the all-solid-state battery.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: December 13, 2022
    Assignee: Seiko Epson Corporation
    Inventor: Shota Odajima
  • Patent number: 11524499
    Abstract: A substrate includes a first substrate which has a first substrate through hole, and a second substrate which has a second substrate through hole and directly or indirectly overlaps the first substrate, the first substrate through hole and the second substrate through hole directly or indirectly communicate with each other to form a liquid supply path and a width D1 of an opening portion of the first substrate through hole on a surface of the first substrate closer to the second substrate, a width D2 of an opening portion of the second substrate through hole on a surface of the second substrate closer to the first substrate, a width D3 of an opening portion of the second substrate through hole on a surface of the second substrate farther from the first substrate have a relationship of D1<D2 and D3<D2.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: December 13, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Noriyasu Ozaki, Takayuki Kamimura
  • Patent number: 11518169
    Abstract: Provided are a load distribution apparatus capable of efficiently distributing loads for a plurality of inkjet head modules and a substrate treatment system including the same. The load distribution apparatus includes a second support formed to be elongated in one direction and having both side portions higher than a central portion and in which a head module for discharging droplets onto a substrate is installed in the central portion, a first support supporting the second support on at least one side and supporting the second support below the second support, a first support unit supporting the second support on at least one side and supporting the second support above the second support, and a plate installed above the first support unit and connected to the first support unit, wherein a load of the head module is distributed by the first support and the first support unit.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: December 6, 2022
    Assignee: Semes Co., Ltd.
    Inventors: In Seok Ha, Jin Hyuck Yang, Jae Young Jang
  • Patent number: 11518167
    Abstract: A liquid jet device includes a head body configured to jet droplets from a nozzle, a frame at which the head body is positioned, a grounding portion configured to contact a first side surface of the head body in a removal direction from the frame to electrically couple the head body to the frame, and a first pin serving as a pin for positioning the head body with respect to the frame, wherein a contact position between the first side surface and the grounding portion and a position of the first pin overlap in a normal direction of the first side surface.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: December 6, 2022
    Assignee: Seiko Epson Corporation
    Inventor: Masaki Kobayashi