Patents Examined by Jason Thompson
  • Patent number: 8813833
    Abstract: To provide a heat exchanging device for powder, which is capable of suppressing as much as possible the compression force applied to an object to be processed and reducing the manufacturing man-hour (time), while ensuring the piston flowability of the object to be processed. In order to achieve this object, the present invention is a heat exchanging device for powder, which is configured such that a shaft 13 is rotatably supported within a horizontally long casing 1, that a plurality of heat exchangers 30 are disposed at predetermined intervals on the shaft, and that a heat exchanging medium is supplied into the heat exchangers via the shaft, wherein the heat exchangers 30 are formed as substantially hollow disk-shaped heat exchangers each having a notched recess 31 directed to a center from a circumferential edge.
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: August 26, 2014
    Assignee: Nara Machinery Co., Ltd.
    Inventor: Yorioki Nara
  • Patent number: 8800641
    Abstract: An apparatus for maintaining a temperature differential between a component and a source of heat is described. The apparatus includes a micro-truss structure having a plurality of nodes and members which define a first surface and a second surface. The second surface is operable for attachment to the component. The apparatus further includes a skin material attached to the first surface of the micro-truss structure such that the skin material is operable for placement between the heat source and the micro-truss structure. The skin material defines at least a portion of a fluid flow path through the micro-truss structure. A skin material is not utilized with certain configurations of the micro-truss structure.
    Type: Grant
    Filed: June 1, 2009
    Date of Patent: August 12, 2014
    Assignee: The Boeing Company
    Inventors: Alan Jon Jacobsen, Stephen Edward Lehman, Geoffrey P. McKnight, William Bernard Carter
  • Patent number: 8757247
    Abstract: A heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of first extended sections and a plurality of second extended sections. The first and the second extended sections are connected to and intersected with one another to thereby define a plurality of intersections and open spaces on the thin-sheet member. The bosses are provided on at least some of the intersections of the first and the second extended sections to provide supporting strength for the heat pipe structure as well as vapor-liquid circulation of the working fluid in the heat pipe structure.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: June 24, 2014
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Patent number: 8720535
    Abstract: A heat exchanger includes a block for the separated and heat-exchanging guiding of first and second fluids, the block having a number of fluid flow channels, at least one box which is flow-connected to the flow channels, and at least one base that includes one or more openings for feeding the flow channels from the box. At least one opening is formed as a passage with a collar having a near-bottom section and an end-side section, and a wall thickness of the end-side section is smaller than a wall thickness of the near-bottom section. A shoulder between the near-bottom and end-side section has a contour running transverse to the contour of the near-bottom section and/or the end-side section, and the end-side section is inclined away from a passage axis. Also a manufacturing process for a heat exchanger.
    Type: Grant
    Filed: August 10, 2009
    Date of Patent: May 13, 2014
    Assignee: Behr GmbH & Co. KG
    Inventors: Christian Saumweber, Stefan Schill
  • Patent number: 8689857
    Abstract: A combination heat sink including a first radiating element having a first plane section and a second radiating element having a second plane section. Multiple first radiating fins integrally upward extend from the first plane section. Each two adjacent first radiating fins define therebetween a first connection section. Multiple second radiating fins integrally upward extend from the second plane section. Each two adjacent second radiating fins define therebetween a second connection section. The first and second radiating elements are connected with each other in an alternating manner with the first radiating fins attaching to and contacting with the second radiating fins to form the heat sink.
    Type: Grant
    Filed: July 8, 2009
    Date of Patent: April 8, 2014
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Chi-Ming Lee
  • Patent number: 8678075
    Abstract: Heat exchanger. The heat exchanger includes a thermal contact plate defining a cavity in fluid communication with a first pipe and a plurality of stationary elements substantially perpendicular to the first pipe each defining a cavity wherein each cavity is in fluid communication with the first pipe and at least one cavity includes a wick. A plurality of movable elements are provided wherein the movable elements and the stationary elements are substantially parallel, alternatingly arranged and a portion of the movable elements overlaps a portion of the stationary elements. A working fluid is provided in the first pipe and cavities or stationary elements and thermal contact plate.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: March 25, 2014
    Assignee: Massachusetts Institute of Technology
    Inventors: Evelyn N. Wang, John G. Brisson, Stuart A. Jacobson, Jeffrey H. Lang, Matthew McCarthy
  • Patent number: 8662148
    Abstract: The invention is directed to a heat exchanger with optimal performance and a method of optimizing the performance of a heat exchanger. The heat exchanger has a first manifold, a second manifold and tubes extending therebetween. The tubes have at least one opening which extends through the entire length of the tubes.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: March 4, 2014
    Assignee: Alcoil, Inc.
    Inventor: Steven M. Wand
  • Patent number: 8656985
    Abstract: A heat exchange apparatus is provided and includes an external structure to support an airflow cooled computing device, first and second doors, each of which includes a heat transfer surface, sequentially coupled to the external structure downstream from the computing device, a water supply system fluidly coupled to a water supply and to the heat transfer surfaces of the first and second doors to thereby supply water to the heat transfer surfaces, first and second valves coupled to the water supply system for association with the first and second doors, respectively, and an exhaust system, disposed proximate to the external structure, configured to recycle the cooled airflow downstream from the first and second doors for repeated cooling of the computing device.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: February 25, 2014
    Assignee: International Business Machines Corporation
    Inventor: Jean-Michel Rodriguez
  • Patent number: 8622118
    Abstract: An exemplary loop heat pipe includes an evaporator, a condenser, a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A working medium is contained in the closed loop. A wick structure is received in the evaporator, and includes a bottom wall contacting the bottom plate, a support wall extending up from the bottom wall and contacting the cover plate, and guide walls extending out laterally from the support wall. The support wall separates an interior of the evaporator into a liquid chamber adjacent to the liquid line and a vapor chamber adjacent to the vapor line. The guide walls are located in the vapor chamber. Guide channels are defined between the guide walls for guiding the working medium in a vapor state to flow from the vapor chamber through the vapor line to the condenser.
    Type: Grant
    Filed: October 31, 2010
    Date of Patent: January 7, 2014
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: De-Yu Wang, Chao Xu, Jiang-Jun Hu
  • Patent number: 8587944
    Abstract: Heat pipe (400) includes a heat pipe body (402) having an inner cavity (408), and a wick structure (404) disposed in the inner cavity. The wick structure includes a first woven mesh layer (410) and a second woven mesh layer (412) disposed on the first woven mesh layer. The first woven mesh layer is a first weave pattern of thermally conductive fibers (103) having a first warp direction (W3 or W4) and the second woven mesh layer is a second weave pattern of thermally conductive fibers (105) having a second warp direction (W5 or W6). The second woven mesh layer is disposed on the first woven mesh layer such that the first and the second warp directions are rotationally offset by an inter-layer warp offset angle (?i).
    Type: Grant
    Filed: April 1, 2009
    Date of Patent: November 19, 2013
    Assignee: Harris Corporation
    Inventor: Mark A. Trautman
  • Patent number: 8584740
    Abstract: Each loop of the device includes an evaporator and a condenser connected by an outer tube in a portion of which extends a thermally insulating sleeve having one end that can lead into the condenser and another end that surrounds a first portion (8a) of a microporous mass provided in the outer tube and pumping by capillarity a liquid-phase heat-carrier fluid flowing in the insulating sleeve of the condenser towards the evaporator, while the gaseous-phase fluid flows from a vapor-collecting central duct in a second portion of the mass of the evaporator towards the condenser in a duct inside said outer tube. The invention can be used for the thermal energy transfer from an electronic component or circuit defining a heat source in relation with the evaporator to a cold source in relation with the condenser.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: November 19, 2013
    Assignee: Astrium SAS
    Inventor: Christophe Figus
  • Patent number: 8579018
    Abstract: A sandwich panel heat pipe with a three-dimensional ordered open-cellular micro-truss core and a method creating the same. In one embodiment, the sandwich panel heat pipe includes a first face sheet, a second face sheet, the three-dimensional ordered open-cellular micro-truss core between the first face sheet and the second face sheet, and a working fluid in the ordered open-cellular micro-truss core. Here, the three-dimensional ordered open-cellular micro-truss core includes a vapor region and a liquid region, the vapor region is for transporting a vapor phase portion of the working fluid to the liquid region, and the liquid region is for transporting a liquid phase portion of the working fluid to the vapor region.
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: November 12, 2013
    Assignee: HRL Laboratories, LLC
    Inventors: Christopher S. Roper, Alan J. Jacobsen
  • Patent number: 8567483
    Abstract: One embodiment provides a heatsink having a flexible base and height-adjusted cooling fins. The flexible base includes a single base plate, with cooling fins and heat pipes secured directly to an upper surface of the single base plate. The use of the single base plate allows the length of the cooling fins to be increased. The use of a single base plate also allows the base to flex when mounted at the outer region of the base plate to a circuit board using fasteners. The flexure of the base biases the heatsink against the heat-generating component. The flexure also displaces the outer cooling fins, and the length of the outer cooling fins is further increased to compensate for the anticipate displacement.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: October 29, 2013
    Assignee: International Business Machines Corporation
    Inventors: Vinod Kamath, Jason A. Matteson, Aparna Vallury
  • Patent number: 8561674
    Abstract: A heat dissipation module includes a plurality of fins and a heat pipe connected with the fins. The heat pipe includes a body, which forms an enclosed space, and an inner ring. A wick structure is disposed on the inner surface of the body, and the inner ring is disposed in the enclosed space for increasing a structural strength of the heat pipe. The inner ring is pressed against the top and bottom of the body or in contact with the wick structure located at the top and the bottom of the body, respectively. The inner ring includes at least one opening located close to the top of the body for communicating inside and outside of the inner ring.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: October 22, 2013
    Assignee: Delta Electronics, Inc.
    Inventors: Chi-Feng Lin, Min-Hui Yu
  • Patent number: 8550150
    Abstract: An exemplary loop heat pipe includes a plate-type evaporator, a pipe, a condenser thermally connected with the pipe and a working medium contained in the closed loop. The plate-type evaporator defines an exit for vapor in a lateral portion thereof and an entrance for liquid in a top portion thereof. The pipe connects the exit and the entrance to form a closed loop. A first wick structure has a lower end thereof attached to a bottom portion of the evaporator and has an upper end thereof attached to the top portion of the evaporator. The entrance for liquid corresponds to the upper end of the wick structure.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: October 8, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Chuen-Shu Hou
  • Patent number: 8550153
    Abstract: An evaporative heat exchanger including a plurality of parallel flow passages extending through the heat exchanger and together defining a first fluid flow path, and a plurality of substantially parallel stacked plates interleaved with the parallel flow passages. Each plate can have first, second, and third sets of flow channels, a first collection manifold adjacent to an end of the plate and connecting the first and second passes, and a second collection manifold. The second collection manifold can intersect the second set of flow channels and at least some of the third set of flow channels. The plate separates the first set of flow channels from the second collection manifold.
    Type: Grant
    Filed: October 2, 2009
    Date of Patent: October 8, 2013
    Assignee: Modine Manufacturing Company
    Inventors: Jian-min Yin, Gregory G. Hughes
  • Patent number: 8528628
    Abstract: A liquid cooling block consisting essentially of carbon for use with electric devices generating heat, comprising in combination; the cooling block contains grain in substantially normal orientation to the heat transfer surface between the cooling block and the electric device; a chamber with a bottom wall having prismatic projections for surface increase; the coolant is injected into the center of the cooling chamber and moves centrifugally towards block outlet channels in heat transfer relation with said projections; and, wherein the cooling block communicates with a cooler receiving coolant from the outlet channels of the liquid cooling block.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: September 10, 2013
    Assignee: Olantra Fund X L.L.C.
    Inventor: Stanley Robinson
  • Patent number: 8528360
    Abstract: A method for cooling a natural gas stream (CxHy) and separating the cooled gas stream into various fractions having different boiling points, such as methane, ethane, propane, butane and condensates, comprises: cooling the gas stream (1,2); and separating the cooled gas stream in an inlet separation tank (4); a fractionating column (7) in which a methane lean rich fluid fraction (CH4) is separated from a methane lean fluid fraction (C2+Hz); feeding at least part of the methane enriched fluid fraction from the inlet separation tank (4) into a cyclonic expansion and separation device (8), which preferably has an isentropic efficiency of expansion of at least 80%, such as a supersonic or transonic cyclone; and feeding the methane depleted fluid fraction from the cyclonic expansion and separation device (8) into the fractionating column (7) for further separation.
    Type: Grant
    Filed: February 24, 2006
    Date of Patent: September 10, 2013
    Assignee: Twister B.V.
    Inventors: Marco Betting, Jacob Michiel Brouwer, Pascal van Eck, Cornelis Antonie Tjeenk Willink
  • Patent number: 8528629
    Abstract: The invention relates to a heat exchanger (e.g., a charge air cooler) having a cooling body composed of flat tubes arranged at intervals and having corrugated fins positioned in the intervals. The charge air in the flat tubes can be cooled by cooling air flowing through the corrugated fins. The heat exchanger can include a flow connector and an integrated pre-cooler in which a medium, for example charge air, is cooled by means of a coolant. The pre-cooler/post cooler can be integrated into a section of the cooling body. A flow connector composed of at least two tubular parts which can be plugged one into the other, locked and sealed, can include a partitioning wall extending in one of the parts. At least one inlet connection and/or at least one outlet connection can be arranged on one or the other of the parts.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: September 10, 2013
    Assignee: Modine Manufacturing Company
    Inventor: Klaus Kalbacher
  • Patent number: 8522861
    Abstract: A cold plate assembly is provided having a cold plate with a generally planar member that provides a support surface. The support surface is configured to support a heat generating device. A structural member provides attaching features that are configured to secure the cold plate assembly to a support. The cold plate is secured to the structural member by a braze material. In one example, the cold plate assembly is manufactured by arranging multiple sheets with a first braze material provided between the sheets. The multiple sheets comprise a cold plate. The braze material is heated to mechanically join the multiple sheets to one another and the cold plate to the structural member.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: September 3, 2013
    Assignee: Hamilton Sundstrand Space Systems International, Inc.
    Inventors: Mark A. Zaffetti, Edmund P. Taddey