Patents Examined by Jason Thompson
  • Patent number: 8297341
    Abstract: A forming method for a heat dissipating structure is provided. According to the method, an extrudate is formed by extrution molding, wherein the extrudate includes protruding bending portions extending in parallel. Fins are extruded monolithically on the bending portions. One or more cut channels are formed by cutting the fins and the extrudate with a cutting tool. The cutting tool cuts the fins for forming a notch on each fin at first, and then cuts the bending portions for forming a cut-through slot on each bending portion, wherein each cut-through slot is formed for cooling air flowing through two side of the extrudate. By cutting the bending portions and the fins by the cutting tool at the same time, a large number of cut-through slots are formed in despite of the existence of the fins, and the performance of heat dissipation is enhanced.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: October 30, 2012
    Assignee: Getac Technology Corp.
    Inventors: Ting Wei Liang, Min Jui Wu
  • Patent number: 8291967
    Abstract: A heat sink includes a plurality of fins. The fins are formed to serve as partition walls of flow paths of a coolant. The fins are formed such that the coolant flows along a surface thereof. A merge space is formed to allow the coolant in the flow paths separated by the fins to merge. The merge space is formed in the flow paths formed by the fins.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: October 23, 2012
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Tadafumi Yoshida, Hiroshi Osada, Yutaka Yokoi
  • Patent number: 8267158
    Abstract: A centrifugal fan includes a housing and an impeller rotatably received in the housing. The housing defines an air inlet in a top plate thereof and an air outlet in a sidewall thereof. The air inlet is perpendicular to the air outlet. The impeller includes a hub and a plurality of blades extending outwardly from a sidewall of the hub. Each of the blades includes an inner blade section connected with the sidewall of the hub and an outer blade section extending outwardly from the inner blade section. An upper portion of the inner blade section is curved upwardly and forwardly from a curved lower portion of the inner blade section towards an adjacent front blade. The curved lower portion has a curvature smaller than that of the upper portion.
    Type: Grant
    Filed: June 20, 2009
    Date of Patent: September 18, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xin-Xiang Zha, Shu-Min Li
  • Patent number: 8267157
    Abstract: A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipes include evaporating sections and condensing sections extending upwardly from the evaporating sections and through the fin group. The evaporating sections are wholly accommodated in the substrate and in contact with the conducting plate.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: September 18, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ji-Yun Qin, Zhi-Yong Zhou
  • Patent number: 8256499
    Abstract: A heat dissipation device includes a heat sink, a fan and a holding frame securing the fan onto the heat sink. The holding frame is mounted on a top of the heat sink and has four beams located around the top of the heat sink and defines an opening in a central part thereof corresponding to the heat sink. The holding frame has two air-guiding plates extending inwardly and downwardly from two inner edges of two opposite beams to two opposite lateral sides of the heat sink. The fan is mounted on the holding frame and covers the opening and the two air-guiding plates of the holding frame.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: September 4, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Min Li, Bi-Tao Wu
  • Patent number: 8256496
    Abstract: The invention relates to an air diverter for a vehicle cooling system. There is a need for an improved vehicle cooling system. An air diverter is provided for a vehicle cooling system having a radiator, a fan for moving air through the radiator and a cooling unit positioned in front of the radiator with respect to air moving through the radiator. The fan is surrounded by a fan shroud. The air diverter includes a collector and a conduit. The collector is positioned between the cooling unit and the radiator. The collector receives a portion of air which passes through the cooling unit. The conduit extends around an edge of the radiator and communicates air from the collector to the interior of the fan shroud while bypassing the radiator.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: September 4, 2012
    Assignee: Deere & Company
    Inventors: Adam Joe Shuttleworth, Matthew Robert Oliver, Ronnie Franklin Burk, Dick J. Goering
  • Patent number: 8240360
    Abstract: One embodiment exemplarily described herein can be generally characterized as a heat sink for an electronic component. The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body; and a confining member. The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: August 14, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyo-Jae Bang, Jung-Hyeon Kim
  • Patent number: 8240363
    Abstract: A heat dissipation apparatus includes a heat sink, a fan, and a fixing structure. The fan defines a number of fixing holes. The fixing structure includes a base, two resilient side panels bent from two sides of the base. The base and the side panels bound an accommodating space to accommodate the fan. An airflow opening is defined in the base for allowing air to flow between the heat sink and the fan. First ends of a number of fasteners secure the base of the fixing structure to the heat sink. Second ends of the number of fasteners protrude through the base into the accommodating space, to be accommodated in the corresponding fixing holes of the fan.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: August 14, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chia-Shin Chou, Zhen-Xing Ye, Xiao-Zhu Chen
  • Patent number: 8235095
    Abstract: A heat dissipation device includes a heat sink, a fan mounted on a side of the heat sink, and an engaging portion pivotally engaging with the heat sink and connecting the fan and the heat sink. The fan includes a bracket. A mounting plate with a mounting hole is formed by the bracket. The engaging portion includes a pivot portion pivotally engaging with the heat sink and a pressing portion extending from the pivot portion. A protruded portion extends downwardly from a bottom surface of the pressing portion. The pressing portion presses the mounting portion of the bracket of the fan and the protruded portion engages in the mounting hole of the mounting portion.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: August 7, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Cheng Kong
  • Patent number: 8230905
    Abstract: A heat dissipation device includes a fin group, a fan and two fan holders fixing the fan onto a front side of the fin group. The fin group defines two elongated slots in two opposite lateral side thereof and two receiving grooves in two opposing inner faces of each elongated slot. The receiving grooves have openings defined at a top of the fin group. Each fan holder has a main plate attached to a lateral side of the fin group and a locking plate connected to an inner side of the main plate and being inserted into the two receiving grooves of a corresponding elongated slot from the openings at the top of the fin group.
    Type: Grant
    Filed: June 20, 2009
    Date of Patent: July 31, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jian Liu, Jing Zhang
  • Patent number: 8230904
    Abstract: A heat dissipation device includes a heat sink, a fan placed on a top of the heat sink for providing an airflow through the heat sink and a fan duct located at a side of the heat sink. The heat sink includes a plurality of upwardly extending first fins and a plurality of laterally extending second fins located below the first fins. A plurality of first airflow channels are defined in the adjacent first fins and a plurality of second airflow channels are defined in the adjacent second fins. The fan duct guides a significant part of the airflow produced by the fan to the second airflow channels from a lateral side of the heat sink to have a sufficient contact with the second fins of the heat sink.
    Type: Grant
    Filed: May 27, 2009
    Date of Patent: July 31, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Hong-Bo Xu
  • Patent number: 8215379
    Abstract: A debris filter trap to prevent potentially damaging debris carried by the feedwater entering the pressure vessel of a once through steam generator from entering into the section of tubes which are positioned within the confines of an integrally contained economizer of the once through steam generator. The trap will remove foreign material, from the feedwater flow, that is larger than the space between the tubes, and thus prevent debris particles that are large enough to get lodged in the tube spacing from entering the economizer.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: July 10, 2012
    Inventor: Richard G. Klarner
  • Patent number: 8176973
    Abstract: A heat sink assembly in accordance with the present invention increases heat dissipation area, improves heat dissipation efficiency and comprises a base, a core pipe, an outer pipe, a top cover and a working fluid. The base has a top surface. The core pipe is mounted securely on and protrudes from the top surface with an air-tight fit and comprises an inner surface, an outer surface, a wick, multiple holes and a top. The wick is formed on the inner and outer surface. The outer pipe is mounted securely on and protrudes from the base concentrically around the core pipe and comprises an inner surface, an outer surface, a wick and a top. The wick is formed on the inner surface. The holes are formed around the core pipe away from the base. The top cover closes the top of the core pipe and the top of the outer pipe.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: May 15, 2012
    Inventor: Wen-Chih Liao
  • Patent number: 8151870
    Abstract: A tube shield assembly for protecting tubes includes a guard, a securing member and a holding tooth, wherein welding is not required to secure the guard to the tube. The guard is axially elongated and can have a semi-cylindrical cross-section to define a main body portion. The securing member includes at least one pair of fastening clips to secure the guard to the tube. The fastening clips permit radial expansion and contraction of the tube and the tube shield assembly in response to, for example, temperature fluctuations. The holding tooth is a tooth-like protrusion between the tube shield assembly and the tube to which it is secured to prevent axial slippage of the tube shield assembly up or down the length of the tube.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: April 10, 2012
    Assignee: The Southern Company
    Inventor: Damon E. Woodson
  • Patent number: 8051898
    Abstract: A water cooling type heat dissipation module for an electronic device includes a base disk, a suction disk, a water guide and a cover. The base has two containing spaces and a plurality of cooling strips in the containing space. The suction base is attached to the base disk and further includes two water chambers for receiving sucked water, two inlets and two outlets. The water guide is attached to the suction disk with two guide port at the periphery thereof. The cover closes the suction disk and is movably joined to a guide fan. When the heat dissipation module is full with fluid, the fluid can flow therein rapidly while the guide fan rotating such that the fluid is discharged from and flows into the heat dissipation module more effectively.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: November 8, 2011
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Kuei-Fung Chiang
  • Patent number: 8051906
    Abstract: The assembly includes a pair of heat exchangers, each including an upper and lower manifold, parallel and spaced relative to one another. Tubes extend between each set of upper and lower manifolds with fins disposed between each of the tubes. A valve system controls fluid flow between the upper manifolds and the lower manifolds. The valve system is movable between a maximum cooling mode with fluid flow form the first upper manifold through both of the tubes and to said first lower manifold. A temperate mode allows fluid to flow from the first upper manifold to the first lower manifold and from the second upper manifold to the second lower manifold to prevent flash fogging. A maximum cooling mode allows fluid to flow from the second upper manifold through both of the first and second tubes to the lower manifolds.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: November 8, 2011
    Assignee: Delphi Technologies, Inc.
    Inventors: Edward Wolfe, IV, Gregory J. Kowalski, Prasad S. Kadle, John F. O'Brien
  • Patent number: 8037925
    Abstract: The present invention relates to a heat exchanger, and more particularly, to a heat exchanger in which a partition wall integrally formed with a header is fixedly inserted into a partition inserting groove of a tank and it is easy to check leakage of a heat exchange medium between the tank and the partition wall through a leakage checking hole formed in the partition inserting groove.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: October 18, 2011
    Assignee: Halla Climate Control Corp.
    Inventors: Kwang Hun Oh, Hong-Young Lim, Li-Yong Park