Abstract: Systems and methods are directed to a three-phase non-volatile flip-flop (NVFF), which includes a master stage formed from a dual giant spin Hall effect (GSHE)-magnetic tunnel junction (MTJ) structure, with a first GSHE-MTJ and a second GSHE-MTJ coupled between a first combined terminal and a second combined terminal, and a slave stage formed from a first inverter cross-coupled with a second inverter. A first data value is read out from the slave stage during a read phase of the same clock cycle that a second data value is written into the master stage during a write phase. The three-phase NVFF includes three control signals, for controlling an initialization phase of the slave stage, the read phase, and the write phase.

Abstract: A storage device, apparatus, and method to write and/or read data from such storage device. The storage device, comprises a channel controller and phase change memory integrated circuits (PCM ICs) arranged in sub-channels, wherein each of the sub-channels comprises several PCM ICs connected by at least one data bus line, which at least one data bus line connects to the channel controller. The channel controller is configured to write data to and/or read data from the PCM ICs according to a matrix configuration of PCM ICs, wherein: a number of columns of the matrix configuration respectively corresponds to a number of the sub-channels, the sub-channels forming a channel, and a number of rows of the matrix configuration respectively corresponds to a number of sub-banks, the sub-banks forming a bank, wherein each of the sub-banks comprises PCM ICs that belong, each, to distinct sub-channels of the sub-channels.

Abstract: An active control device and a semiconductor device including the same are disclosed, which can control an active command in response to a pin change of a command address. The active control device includes: a bank decoding unit configured to decode a bank address to output a bank selection signal; an active controller configured to output a first active control signal, a second active control signal, and an active delay signal to control an active operation of a bank in response to the bank selection signal, a first active signal, and a second active signal; an address latch unit configured to latch a row address to output an address delay signal; and an address output unit configured to output an address corresponding to the address delay signal.

Abstract: To maintain stability of memory array operations, a supplemental current can supply a common source line of a memory array so that the combined current from the memory array and supplemental current is at least a minimum regulation current level. When enabled for sensing operations, a driver circuit maintains the common source line's voltage level. A current subtractor circuit determines the difference between a reference current and a current proportional to the current flowing from the array, where the reference current is proportional to the minimum regulation current. The difference current is then mirrored by a self-adjusting current loop and supplied to the common source line to maintain its current level.

Abstract: A one-time programmable (OTP) memory includes an OTP cell array including a plurality of OTP cells that each include a programming transistor configured to change irreversibly when programmed; a temperature compensation reference voltage generating unit configured to sense a temperature of the OTP cell memory and generate a reference voltage such that as the sensed temperature changes, the reference voltage generated by the temperature compensation reference voltage generating unit changes in a manner that is inversely proportional the change in the sensed temperature; and a temperature compensation operating voltage generating unit configured to receive the reference voltage to generate an operating voltage that is proportional to the reference voltage and is applied to the OTP cell array.

Abstract: A repair circuit includes a fuse set latch array including a plurality of fuse set latches, and configured to store fuse informations in target fuse latches selected among the plurality of fuse set latches in response to fuse latch select signals; a fuse information control unit configured to generate the fuse latch select signals by using boot-up source signals generated by differently combining boot-up mode region select informations according to a region determination signal; and a repair processing unit configured to compare an address inputted from an exterior and the fuse informations, and access a normal memory cell corresponding to the external address or a redundant memory cell.

Abstract: A data storage device includes a nonvolatile memory device; and a controller electrically coupled with the nonvolatile memory device, and configured to control an operation of the nonvolatile memory device, wherein the controller is configured to change a frequency of an internal clock and a level of an internal voltage, according to whether data is being transmitted through a channel.

Abstract: A device for monitoring process variations across memory bitcells includes a bitcell inverter that provides an output voltage to be used for identifying skewed corners of the memory bitcells. A first comparator compares the output voltage with a first reference voltage, and a second comparator compares the output voltage with a second reference voltage. The first and the second comparators generate a corner code based on comparison results.

Abstract: A memory device includes multiple bit lines extending in a first direction, multiple word lines extending in a second direction crossing the first direction, and multiple memory cells each coupled to corresponding two word lines and corresponding two bit lines. Each memory cell includes a memory element configured to store information on the basis of changes in resistance and two select transistors. One terminal of the memory element is coupled to one of the two bit lines corresponding to the memory cell; the other terminal is coupled to respective drains of the select transistors; respective sources of the select transistors are coupled to the other bit line; a gate of one of the select transistors is coupled to one of the two word lines corresponding to the memory cell; and a gate of the other is coupled to the other word line.

Abstract: Systems, methods and/or devices are used to adapt a target charge to equalize bit errors across page types for a storage medium, such as flash memory, in a storage system. In one aspect, the method includes performing a sequence of operations, including: (1) determining a first target charge, a second target charge, and a third target charge, the first, second, and third target charges used for controlling first, second, and third charge distributions, respectively, in cells of the storage medium when data is written to the cells, wherein the second charge distribution is between the first charge distribution and the third charge distribution, (2) determining a first error indicator for lower/fast pages of the storage medium, (3) determining a second error indicator for upper/slow pages of the storage medium, and (4) adjusting the second target charge in accordance with the first error indicator and the second error indicator.

Abstract: The invention comprises an improved process of reading out SRAM or like memory elements which utilize pre-charging of cell output buses. In the output configuration of the invention, Gray Code counter outputs are used as inputs in a decoder block, the decoder block being configured to output a valid column selection address for every two address inputs. These column outputs are mapped sequentially to the columns of the memory array, such that the columns are sequentially read out, each readout operation being interspersed with a parking interval. The Gray code address inputs reduce readout addressing errors and the parking interval creates a delay between cell readout operations that reduces glitch errors.

Abstract: One feature pertains to a method of implementing a physically unclonable function that includes providing an array of metal-insulator-metal (MIM) devices, where the MIM devices are configured to represent a first resistance state or a second resistance state and a plurality of the MIM devices are initially at the first resistance state. The MIM devices have a random breakdown voltage that is greater than a first voltage and less than a second voltage, where the breakdown voltage represents a voltage that causes the MIM devices to transition from the first resistance state to the second resistance state. The method further includes applying a signal line voltage to the MIM devices to cause a portion of the MIM devices to randomly breakdown and transition from the first resistance state to the second resistance state, the signal line voltage greater than the first voltage and less than the second voltage.

Abstract: A memory device includes a first memory circuit including a silicon transistor, a selection circuit including a silicon transistor, and a second memory circuit including oxide semiconductor transistors and a storage capacitor, in which one terminal of the storage capacitor is connected to a portion where two oxide semiconductor transistors are connected in series, an output of the second memory circuit is connected to a second input terminal of the selection circuit, and an input of the second memory circuit is connected to a first input terminal of the selection circuit or an output terminal of the first memory circuit.

Abstract: A non-volatile memory system includes a first non-volatile memory device, a second non-volatile memory device that performs a write operation more slowly than the first non-volatile memory device, where the first and second non-volatile memory devices are different types of non-volatile memory devices, and a controller that controls the first and second non-volatile memory devices to concurrently perform the write operation for data input from a host based on a write command signal and that outputs a write completion signal to the host when one of the first and second non-volatile memory devices completes the write operation.

Abstract: A resistive memory apparatus and a write-in method thereof are provided. The memory controller provides unselected bit-lines and unselected word-lines both not coupled to a selected resistive memory cell respectively with a first bit-line voltage and a first word-line voltage in one of a setting duration and a resetting duration, wherein the first bit-line voltage is equal to a product of a writing-in voltage VW and (n?1)/n and the first word-line voltage is equal to VW×1/n. The memory controller provides the unselected bit-lines not coupled to the selected resistive memory cell with a second bit-line voltage and the unselected word-lines not coupled to the selected resistive memory cell with a second word-line voltage in the other one of the setting duration and the resetting duration, wherein the second bit-line voltage is equal to VW×1/n and the second word-line voltage is equal to VW×(n?1)/n.

Abstract: An electronic device includes two conductive electrodes. A first current path extends from one of the electrodes to the other and has a dominant thermally activated conduction activation energy of 0.5 eV to 3.0 eV. A second current path extends from the one electrode to the other and is circuit-parallel the first current path. The second current path exhibits a minimum 100-times increase in electrical conductivity for increasing temperature within a temperature range of no more than 50° C. between 300° C. and 800° C. and exhibits a minimum 100-times decrease in electrical conductivity for decreasing temperature within the 50° C. temperature range. Other embodiments are disclosed.

Abstract: Systems and methods for managing data retention in a solid-state storage system utilizing data retention flag bytes are disclosed. A data storage device includes a non-volatile memory comprising a plurality of non-volatile memory devices and a controller configured to write data to a memory unit of the non-volatile memory array and write a data retention flag value indicating a number of bits of the written data programmed in a first of a plurality of logical states. The controller is further configured to read the data and determine a number of bits having the first of the plurality of logical states in the read data, and determine a difference between the number of bits of the written data programmed in the first logical state and the number of bits having the first logical state in the read data. The difference is used to determine data retention characteristics of the non-volatile memory.

Abstract: A nonvolatile memory apparatus includes a memory cell array including a plurality of sub arrays. A plurality of analog-to-digital converters (ADCs) configured to sense sensing voltages outputted from memory cells of the plurality of sub arrays and a path selection unit configured to electrically couple the plurality of sub arrays with the plurality of ADCs in one-to-one correspondence in a first operation mode, and electrically couple the plurality of ADCs with a terminal of a power supply voltage in a second operation mode.

Abstract: The invention provides a current detection circuit and a semiconductor memory apparatus using the current detection circuit thereof. The current detection circuit is capable of rapidly sensing the current flowing through a tiny bit line structure. A page buffer/sensing circuit of the invention includes: a transistor TP3 pre-charging a node SNS during a pre-charge period and providing a target constant current to the node SNS during a discharge period; a transistor TN3 pre-charging the bit line according to the voltage pre-charged to the node SNS; and a transistor TP2 connected to the node SNS. The transistor TP2 detects whether or not a current larger than the constant current supplied by the transistor TP3 is discharged from the bit line and outputs a detection result to a node SENSE.

Abstract: A nonvolatile semiconductor memory device for suppressing a current consumption caused by a transient current because of the potential change of the bit and word lines at the time of shifting between the programming, reading, and erasing actions in a highly integrated memory cell array is provided. A memory cell (1) array comprises two-terminal memory cells each having a variable resistance element whose resistance value reversibly changes by pulse application are arranged in a row and column directions, wherein the memory cells in a row are connected at one end to common word lines (WL1 to WLn), the memory cells in a column are connected at the other end to common bit lines (BL1 to BLm), and a common unselected voltage VWE/2 is applied to both unselected word and bit lines not connected to the selected memory cell during the reading, programming, and erasing actions for the selected memory cell.