Abstract: A heat sink clip (1) includes a main body (10), a post (40), a spring (50) and a cammed handle (30). The main body includes a horizontal portion (12) and two locking arms (16). A locking hole (17) is defined in an end of each locking arm for engaging with catches (82) of a socket (80). The post has a pressing block (44) at a bottom portion and a cutout (42) at a top portion. The spring is placed around the post and rests on the pressing block The post extends through a through aperture (13) of the horizontal portion, and the cutout pivotally receives a cam (32) at one end of the handle. When the handle is pressed, the horizontal portion of the main body is raised by the decompressed spring, so that the locking arms tightly engage with the catches of the socket.

Abstract: A multiple blade computer server housing comprises a cabinet having a first side and a second side, at least one chassis positioned within the cabinet that houses a plurality of server blades and a plurality of interface cards, and at least one door panel hingedly mounted to the second side such that access to the second side is gained by opening the door panel. The door panel has mounted thereon at least one network switch card. Generally, the network switch card can be connected by cables to at least a portion of the plurality of interface cards. In another aspect, the invention pertains to a door for a computing blade server housing where the door comprises a door panel, a track system located on at least one side of the door panel, and plurality of interface connectors located along at least one edge of the door panel.

Abstract: A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to the hub motor, wherein the first impeller pushes air in a first direction and the second impeller pulls air in a second direction. The heat sink is oriented between the axial fan and the hot electronic device such that the hot electronic device, the heat sink, and the axial fan are axially oriented, wherein cool air is forced onto the heat sink by one impeller in the axial fan, and wherein heated air from the heat sink is removed by an other impeller in the axial fan.

Abstract: A heat dissipating apparatus of a computer system is used for a first heat generating component (such as an interface card and a display card) of the computer system without being interfered by a second heat generating component (such as a hard disk drive and an optical disk drive) of the heat dissipating apparatus. The heat dissipating apparatus has a rack installed between the first and second heat generating components, corresponding openings on both sides of the rack, a fan between the openings, and holes disposed on the casing and corresponding to the openings of the rack. The fan is rotated to drive external cold air into the casing through the openings of the rack from the holes of the casing and blown at the first heat generating component directly to improve the heat dissipating effect without being interfered by the second heat generating component in the casing.

Abstract: The present invention provides a thermally conductive holder for holding a heat-generating component. The thermally conductive holder comprising a material formed from a thermally conductive composition. The thermally conductive composition includes a silicone rubber; and a thermally conductive filler in a range of 40 to 70 percent by volume with respect to total volume of the silicone rubber and the thermally conductive filler. From 35 to 100 percent by volume of the thermally conductive filler is composed of magnesium oxide of 5 ?m or less in average particle size. Said material has a hardness in a range of 20 to 70 as measured by a Type A durometer in conformity with ISO 7619.

Abstract: An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly also includes a heat sink device positioned in thermal communication with a first side of the electronics packages. The assembly further includes a carrier disposed between the substrate and the heat sink device. The carrier has a resilient wall that biases the electronics packages towards the heat sink device such that a controlled bond line is provided between the first side of the electronics packages and the heat sink device.

Abstract: A heat sink (200) for a portable computer (100) includes a plurality of fins (210) located external to the portable computer, a conducting plate (230) extending into an inner space of the portable computer for absorbing heat in the portable computer, and a heat pipe (220) transferring the heat absorbed by the conducting plate to the fins. Therefore, the heat in the portable computer is removed from the inner space of the portable computer by the heat sink.

Abstract: A plasma display apparatus including a display panel, a chassis base coupled to a rear of the display panel, and a reinforcement member. The reinforcement member includes a base portion coupled to the chassis base and an extended portion bent from the base portion. A cross-sectional thickness of the extended portion is different from a cross-sectional thickness of the base portion.

Abstract: A fixing structure is for a detachable electronic assembly. The detachable electronic assembly has at least one first hole. The fixing structure includes a housing, a first movable member, and a second movable member. In this case, the housing has at least one guiding bar, at least one fist connecting portion, and a first opening opposite to the first hole. The first movable member has a second opening and a second connecting portion. The first movable member is pivoted on the housing, and the second connecting portion connects with the first connecting portion. The second movable member has a third opening and a protrusion. The second movable member moves along the guiding bar caused by the rotation of the first movable member, so that the protrusion is inserted into the first opening and the first hole. An apparatus having a fixing structure is also provided.

Abstract: A cooling system for an electronic display may include a heat collector plate with internal gas and liquid phase lines. The cooling plate may be thermally isolated together with electronic components of the display within an enclosure of the display, while external lines carry liquid and gas phase refrigerant outside the enclosure to and from the heat collector plate. The external lines may be similar in size to each other and may be connected to the heat collector outside the heat collector plate by a manifold. The heat collector plate contacts a base plate of the electronic display in a thermally conductive relation to transfer heat from electronic components within the display to the gas phase refrigerant. Fans may be included for additional convective heat transfer. A single compressor may be fluidly connected to multiple heat collector plates in respective electronic displays.

Abstract: A device and method is provided for providing a notebook computer casing whose contour and outward features can be change by the user. The device includes a main body, at least one decorative piece that can be fixed on and detached from the main body at random. The main body includes a slot, set on its rims, and a first locking part, set inside the slot, at least one decorative piece that includes a first interlocking part can be locked into position with the first locking part. The decorative pieces are to be fixed on the main body to change the contour and outward features of the computer and, meanwhile, serve as buffers protecting the computer against impact damage.

Abstract: In an image forming apparatus including a thermal head attached to a supporting body having a heat release function, a power supply circuit board that is disposed inside a casing and supplies electrical power to the thermal head, and a cooling fan that takes in the outside air for cooling the thermal head and the power supply circuit board, on the substrate of the power supply circuit board near the cooling fan provided on the side wall of the casing, a pair of heat sinks that guide cooling air from the cooling fan to the thermal head are implanted opposite each other by being spaced from the thermal head.

Abstract: An assembly of devices including at least one switchgear cabinet and a cooling device. The switchgear cabinet has a closed interior, in which electric installations can be housed. The cooling device is attached in the vicinity of or near a lateral surface of the switchgear cabinet that runs vertically with respect to the front face, extending at least over part of the height of the switchgear cabinet and having a spatial connection with the interior via at least one air inlet and at least one vent outlet. The cooling device includes a receiving chamber that houses at least one heat exchanger. This invention facilitates the adaptation of the cooling device in superstructures of this type to modified cooling requirements. To achieve this, at least sections of the receiving chamber of the cooling device are divided into two or more receiving sub-chambers that are situated one above the other and a cooling module is housed in at least one of the receiving sub-chambers.

Abstract: A module houses an optical transceiver device and provides a dedicated heat-transfer environment for the device. A fan draws in ambient air and blows it through a heat exchanger and out an exhaust. Heat transfer is by conduction from the device into the heat exchanger through an opening in an EMI shield of the device. In some embodiments the fan is a pluggable unit, allowing quick replacement if status LEDs indicate a fault.

Abstract: A resin two-panel intergral-type holder holds first and second display panels of different sizes on two surfaces. The holder has a first bank-like rib which surrounds at least three sides of a periphery of the first display panel and defines first accommodating region and a second bank-like rib which surrounds at least three sides of a periphery of the second display panel and defines a second accommodating region. A conductive sheet member is formed on a first portion of another surface corresponding to the first accommodating region except for the second accommodating region and a second portion of another surface corresponding to the second accommodating region respectively. The conductive sheet member contacts another surface. A notch is formed in the second bank-like rib to electrically connect the first and second portions of the conductive sheet member.

Abstract: An adjustable, folding mount for attaching a flat panel display to a fixed structure. The mount includes a portion adapted to attach to an element of a fixed structure, and a swing arm operably coupled thereto. The swing arm is selectively positionable along a path of travel between a folded position proximate the fixed structure and an extended position wherein the swing arm depends downwardly from the fixed structure. A device interface portion operably couples the other end of the swing arm and the flat panel display. The mount includes friction means arranged to apply a first frictional resistance force opposing positioning of the swing arm toward the extended position, and a second frictional resistance force opposing positioning of the arm toward the folded position, the first frictional resistance force being greater than the second frictional resistance force.

Abstract: An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a plurality of walls coupled to the microchannel structure to define a manifold. The manifold is in communication with at least a plurality of the microchannels. The plurality of walls includes a side wall. The side wall has a port therein. The port allows the coolant to flow in a direction that is either into the manifold or out of the manifold.

Abstract: An external expanding apparatus or “docking station” operable with a portable computer device of a type having a display unit having a display screen on an inner surface thereof and a hard shell backing surface opposite thereof and pivotally mounted on a substantially rigid casing having a pair of locating holes adjacent to opposite corners of a substantially planar bottom surface thereof, and an input/output (I/O) connector positioned on a back plane thereof with a pair of positioning apertures provided on opposite sides thereof.

Abstract: A system for controlling airflow around an air-cooled heat generating device includes a cooling fluid line and heat exchangers positioned along the cooling fluid line to cool airflow around components in the heat generating device. The heat exchangers are positioned adjacent to the heat generating device such that the heat exchangers are directly in the path of at least one of airflow supplied into the components and airflow exhausted from the components. The system also includes valves positioned along the cooling fluid line to control cooling fluid flow through respective heat exchangers. The system further includes a secondary heat exchanger configured to absorb heat from the cooling fluid and a controller configured to control the valves to thereby control the cooling fluid flow through the heat exchangers.

Abstract: A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.