Patents Examined by Jayprakash N. Gandhi
  • Patent number: 8791360
    Abstract: The electrical connection of a sealed electrical machine is provided and includes a casing containing lead conductors each connected to a bushing via an electrical connector. The casing has at least an inlet and an outlet for a cooling fluid. The electrical connector includes at least a permeable element defining a chamber such that during operation the cooling fluid, passing through the chamber and the permeable element, cools the permeable element. A method is also provided for cooling an electrical connection.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: July 29, 2014
    Assignee: Alstom Technology Ltd
    Inventors: Not-Curdin Fried, Daniel Hediger, Andrzej Klopotowski
  • Patent number: 8792223
    Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls?10 ?m is satisfied.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: July 29, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Hee Gu, Myung Jun Park, Kyu Ha Lee, Da Young Choi, Jae Young Park, Sang Hoon Kwon, Byung Jun Jeon
  • Patent number: 8787000
    Abstract: A interactive electrostatic field high energy storage AC blocking capacitor in which a first a first embodiment of the invention comprises a charging plate in the form of an active interactive electrostatic field charging plate 10 being formed from electric conducting material into a three longitudinal parallel partially separated sectioned closed continuous electrical loop, comprising a mid-section 12 and two outer sections 13 and 14, one at each side of the mid-section. The charging plate in the form of an active interactive electrostatic field charging plate 10 is capacitively coupled to a negative plate 27 by a dielectric material 22 and the negative plate 27 is provided with a connector 15 for connection to an electric circuit. The mid-section 12 is provided with a connector 15 as means to connect it to a source of a charge and the two outer sections 13 and 14 being electrically connected at 16 and 17 to the mid-section 12 is such a way so they have opposing charging current flow.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: July 22, 2014
    Inventor: Paul Lenworth Mantock
  • Patent number: 8780577
    Abstract: The invention discloses a COF packaging unit and a COF packaging tape. The COF packaging unit comprises COF baseband(s), IC Die(s) packaged on the COF baseband(s), and input end wires and output end wires connected with the IC Die(s); the input end wires and the output end wires are respectively provided with input terminals and output terminals at two edges of the COF baseband. In the invention, because the input terminals and the output terminals are pitched along the edges of the COF baseband, the length of the single COF packaging unit is set in accordance with the pitching requirement of the input end wires and the output end wires, so that the COF baseband can have sufficient area for wiring, to adapt to the requirement of large LCD panels. Thus, resources are reasonably integrated and used, equipment utilization rate is increased, material purchasing cost is saved, and economic benefits are increased.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: July 15, 2014
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventors: Liang-Chan Liao, Po-Shen Lin, Yuxin Bi
  • Patent number: 8780523
    Abstract: There is provided a high voltage and high capacitance multilayer ceramic electronic component having enhanced reliability, including: a ceramic body; a first layer including conductive patterns; and a second layer including a floating pattern, wherein the sum of the number of the first and second layers is 100 or more, the ceramic body has first and second external electrodes formed on outer surfaces thereof, and a ratio of a length of the floating pattern to a length of the ceramic body is 0.7 to 0.9, and a ratio of a length of the overlapped portion to the length of the floating pattern is 0.5 to 0.95, in a cross section taken in a length direction in which the first and second external electrodes are connected to and extended from the ceramic body and a stacking direction of the first and second layers.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: July 15, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung Kil Seo, Byung Sung Kang
  • Patent number: 8780574
    Abstract: A double-sided PCB includes a circuit plate, a first chip, and a second chip. The circuit plate includes a spacer layer having a first surface and an opposing second surface, a first multilayer structure, and a second multilayer structure. The first multilayer structure includes a first wire layer, a first middle layer, and a second wire layer having a first grounding portion and first conductive pattern portions, that are stacked on each other on the first surface. The second multilayer structure on the second surface is either a mirror image of the first multilayer structure, or is very similar thereto. The first and second chips are each arranged on a grounding portion and are each electrically connected to their respective conductive pattern portions.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: July 15, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Patent number: 8780571
    Abstract: An interposer lead provides a connection between an integrated circuit and a circuit board. The interposer lead includes a first leg for interfacing with the circuit board. The interposer lead also includes a second leg disposed generally parallel to the first leg for interfacing with an IC electrical lead extending from the integrated circuit. A connecting portion operatively connects the first leg and the second leg. The interposer lead further includes a lip extending non-parallel from the second leg for limiting movement of the IC electrical lead on the second leg.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: July 15, 2014
    Assignee: General Dynamics Advanced Information Systems, Inc.
    Inventors: Karl Geisler, Jason Klassen, Michael Woizeschke
  • Patent number: 8772639
    Abstract: A method is provided for maintaining an electric cable, said electric cable comprising at least one electric conductor surrounded by an outer sheath, said outer sheath containing an insulating oil distributed around said electric conductor, such as a fluid-oil cable or an oil-filled cable. A drying oil, selected so as to solidify upon contacting the air, is added to the oil of the cable for sealing off any accidental oil leak through an outer sheath of the electric cable.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: July 8, 2014
    Assignee: Electricite de France
    Inventors: Yves Bertrand, Céline Martin, Gérard Mortha
  • Patent number: 8767392
    Abstract: A portable electronic device is provided. The portable electronic device includes a body, an operation interface, a supporting element and an image capturing unit. A receiving recess is formed on the body. The operation interface is disposed on the body. The supporting element is rotated between a first orientation and a second orientation relative to the body, wherein when the supporting element is in the first orientation, the supporting element is in the receiving recess, and when the supporting element is in a second orientation, an angle is formed between the supporting element and the body, wherein the angle is greater than 0 degree. The image capturing unit is disposed in the supporting element.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: July 1, 2014
    Assignee: HTC Corporation
    Inventor: Chih-Kuang Wang
  • Patent number: 8760846
    Abstract: An apparatus and associated method for an energy-storage device (e.g., a capacitor) having a plurality of electrically conducting electrodes including a first electrode and a second electrode separated by a non-electrically conducting region, and wherein the non-electrically conducting region further includes a non-uniform permittivity (K) value. In some embodiments, the method includes providing a substrate; fabricating a first electrode on the substrate; and fabricating a second electrode such that the second electrode is separated from the first electrode by a non-electrically conducting region, wherein the non-electrically conducting region has a non-uniform permittivity (K) value. The capacitor devices will find benefit for use in electric vehicles, of all kinds, uninterruptible power supplies, wind turbines, mobile phones, and the like requiring wide temperature ranges from several hundreds of degrees C. down to absolute zero, consumer electronics operating in a temperature range of ?55 degrees C.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: June 24, 2014
    Assignee: GranBlueTech, L.L.C.
    Inventor: John P. Snyder
  • Patent number: 8755170
    Abstract: A metal electrolytic capacitor capable of quickly absorbing and immobilizing a belching vapor of a driving electrolyte and widely reducing leakage when an explosion-proof valve operates. An aluminum electrolytic capacitor body is configured by housing a capacitor element in a cylindrical aluminum case, a pair of leads extend from the capacitor body, an explosion-proof valve. is formed on a top panel portion of the metal case, a cylindrical cap as a casing is attached from above to the capacitor body, a plurality of small openings are formed on a top panel portion (bottom portion) of the cap, and an absorbent or a mixture of an absorbent and a water molecular compound wrapped in a permeable fiber material, such as unwoven fabric and filter paper, is placed in a space between the cap and the top panel portion of the capacitor body.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: June 17, 2014
    Assignee: Kurita Water Industries Ltd.
    Inventors: Koichi Mori, Mitsuru Nozue, Minoru Yagi
  • Patent number: 8755171
    Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: June 17, 2014
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Ching-Feng Lin, Chi-Hao Chiu, Kun-Huang Chang
  • Patent number: 8749954
    Abstract: Electrode foil includes an aluminum alloy having a composition in a region at least 10 ?m deep from a surface of the foil. The composition includes aluminum as a main component and zirconium of at least 0.03 at % and at most 0.5 at %.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: June 10, 2014
    Assignee: Panasonic Corporation
    Inventors: Masashi Shoji, Hitoshi Ishimoto, Ayumi Kochi, Tomohiro Maruoka, Naomi Kurihara, Takao Sato
  • Patent number: 8743560
    Abstract: In one embodiment, a circuit board is disclosed. The circuit board includes a first metal core; a second metal core spaced apart from the first metal core in a first direction when viewed as a cross section, such that a first side of the first metal core faces a first side of the second metal core; a first electrode electrically connected to the first side of the first metal core; a second electrode electrically connected to the first side of the second metal core facing the first metal core; and a dielectric layer between the first and second electrodes.
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: June 3, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yonghoon Kim, Hyunki Kim, Heeseok Lee
  • Patent number: 8735722
    Abstract: The invention relates to an end fitting and an enclosure assembly with the end fitting, and with a sealing enclosure. In order to improve the reliability of the enclosure assembly, the invention provides that the end fitting is provided with a sealing protrusion and that a sealing section and a retention section of the sealing enclosure are arranged one behind the other in a connection direction.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: May 27, 2014
    Assignee: TE Connectivity Nederland B.V.
    Inventors: Martijn Scholten, Jacco Elenbaas, Jarno Verhoeven, Marc Jansen
  • Patent number: 8737038
    Abstract: An electroactive polymer based super capacitor capable of operation at MILSPEC temperatures, with electroactive polymers acting as the charge storage layers, and a mixture of electrolytes enabling operation down to ?60° C.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: May 27, 2014
    Assignee: The United States of America as Represented by the Secretary of the Navy
    Inventors: David J. Irvin, Jennifer A. Irvin, John D. Stenger-Smith
  • Patent number: 8735724
    Abstract: An electric equipment of the present invention has an insulation structure at a welding part formed by joining end parts of a plurality of conductors with each other, the welding part having a rectangular cross section and being coated with an insulating coating, in which the insulating coating is voidless and has a coating thickness of 50 to 1000 ?m in the welding part, and in which an edge cover ratio of the insulating coating is 20% or more. According to the present invention, the insulation performance of the insulation structure in which the welding part formed by joining the end parts of the plurality of conductors with each other can be improved, the welding part having a rectangular cross section and being coated with an insulating coating, and a highly reliable electric equipment can be provided.
    Type: Grant
    Filed: October 17, 2011
    Date of Patent: May 27, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Takahito Muraki, Satoru Amou
  • Patent number: 8735723
    Abstract: An apparatus and method for mounting cables within a magnetic resonance imaging (MRI) system are provided. One apparatus includes a cable assembly having a rigid support structure defining a channel with a cross-section and an electrical cable having a cross-section smaller than the cross-section of the channel. The electrical cable is secured within the channel of the rigid support structure, with the rigid support structure configured for coupling to a stationary component of the MRI system to resist movement from a movable component to which the electrical cable is connected.
    Type: Grant
    Filed: November 15, 2010
    Date of Patent: May 27, 2014
    Assignee: General Electric Company
    Inventors: Longzhi Jiang, Robert Belinski, Robbi McDonald
  • Patent number: 8724294
    Abstract: A solid electrolytic capacitor having an anode element, a dielectric film covering a surface of the anode element, a conductive polymer layer provided on the dielectric film, and a water-repellent portion provided on the dielectric film not in contact with the conductive polymer layer and containing silicone oil is provided.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: May 13, 2014
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Yousuke Abe, Atsushi Furuzawa
  • Patent number: 8717767
    Abstract: A server cabinet includes a housing and a number of cable management brackets longitudinally mounted to the housing. Each cable management bracket includes two opposite mounting portions mounted to the housing, and a base plate connected between the mounting portions. Each mounting portion defines a number of openings for cables extending through.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: May 6, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: An-Gang Liang, Fei Teng