Patents Examined by Jayprakash N. Gandhi
  • Patent number: 9860987
    Abstract: An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: January 2, 2018
    Assignee: DEERE & COMPANY
    Inventors: Brij N. Singh, Thomas Roan, Andrew D. Wieland, Neal D. Clements
  • Patent number: 9852869
    Abstract: A switch module with a built-in structure of anti-surge and dual disconnection mainly comprises an overcurrent protection switch having plates and insulating elements for anti-surge and dual disconnection structure ingeniously built inside a heat-resisting housing. The switch module has a first connecting point and a second connecting point for operation. When overvoltage occurs, temperature of at least one metal oxide varistor would instantly rise up to a degree higher than the melting point thereof, melting at least one thermo-sensitive piece, loosening at least one spring element, displacing a pushing element and thus forcing the connecting points detaching from each other to turn off the switch and stop supplying electricity power; meanwhile, insulating elements would isolate conductive components such as thermo-sensitive pieces, spring elements and plates to further ensure a complete disconnection and more of electricity safety.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: December 26, 2017
    Inventors: Yi-Hsiang Wang, I-Ying Wang
  • Patent number: 9826662
    Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: November 21, 2017
    Assignee: General Electric Company
    Inventors: Joo Han Kim, Graham Charles Kirk, Jay Todd Labhart, Binoy Milan Shah, Yogen Vishwas Utturkar, Pramod Charmarthy, Tao Deng
  • Patent number: 9801314
    Abstract: A first printed circuit board on which a heatsink having a discrete semiconductor device attached to it and first capacitors for smoothing an electric current after a conversion from AC to DC are mounted is arranged in the horizontal direction of a bottom portion of a device casing. On the first printed circuit board, various electronic components such as a resistor, a diode, a capacitor, a coil, etc. are mounted in addition to the heatsink and the first capacitors. Further, in an in-device-casing vacant space in an upper portion of the heatsink mounted on the first printed circuit board, a second printed circuit board on which second capacitors for performing smoothing upon a conversion from AC to DC are mounted is arranged orthogonally to the first printed circuit board in the device spacing.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: October 24, 2017
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Takashi Kuwabara
  • Patent number: 9791901
    Abstract: A dual redundant computer safety relay box system includes first and second fail-safe computing systems (FSCs) individually mounted to first and second printed circuit boards. Each FSC includes two computing modules (CPUs) designated as a first CPU and a second CPU. The first and second FSC's are both connected to a safety relay box. The printed circuit boards are isolable from each other permitting maintenance on one of the printed circuit boards while operation of the FSC of the other printed circuit board is maintained. In each FSC a health signal generated from the first and second printed circuit boards of the first and second CPUs defines a multi-level dynamic pulse signal. Presence of the dynamic pulse signal produces an output identified as each of a first and a second healthy indication signal from each of the CPUs of one of the first or second FSCs.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: October 17, 2017
    Assignee: Artesyn Embedded Computing, Inc.
    Inventors: Robert Charles Tufford, Liu Jiang, Pasi Jukka Petteri Vaananen, Martin Peter John Cornes
  • Patent number: 9769949
    Abstract: A self-contained mobile surveillance apparatus has applicability in a variety of short or long term settings where security and documentation of activities are needed. Integral to the apparatus is a gas shock assisted swing arm lift assembly and a removable quick connect pod platform system for use in acquiring, recording, storing, and transmitting data to one or more receive locations.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: September 19, 2017
    Inventor: Steven T. Kuntz
  • Patent number: 9756761
    Abstract: Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation. A cooling fan 40 is arranged on the opposite side of a circuit board across an upper frame 20 and attached to the upper frame 20. The electronic apparatus includes a cover having a shape for covering the air flow path and defining a wall of the air flow path together with the upper frame 20. Heat sinks 61 and 62 are arranged on the inner side of the cover 50.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: September 5, 2017
    Inventors: Yukito Inoue, Kensuke Ikeda, Daisuke Kanda, Yasuhiro Ootori
  • Patent number: 9740250
    Abstract: An electronic device includes a housing body, a dividing member that divides the housing body into a first compartment and a second compartment, a sealing member that divides the first compartment into a liquid-stopper region and an exterior communication region, one or more heat emitting components disposed in the liquid-stopper region, a fan disposed in the exterior communication region, and a ventilation pathway through which an airflow passes through the dividing member to the second compartment due to driving the fan.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: August 22, 2017
    Inventors: Masao Honda, Yoshito Fukata, Takeshi Karuishi
  • Patent number: 9717152
    Abstract: A display apparatus has a friction surface which makes friction force between a base and a support surface on a lower surface of the base that supports the display body, in which the friction surface has a high friction surface having a relatively high friction coefficient and a low friction surface having a lower friction coefficient than that of the high friction surface, and the low friction surface protrudes further than the high friction surface.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: July 25, 2017
    Inventors: Tadayuki Ito, Yoshihito Mochizuki
  • Patent number: 9717160
    Abstract: A high-density server includes a plurality of server enclosures, each of which includes an enclosure housing with a pair of module insertion/extraction parts, a pair of power source units, a plurality of cooling fans, and two pairs of server modules. Cooling fans are linearly aligned in a crosswise direction and positioned in proximity to the rear opening of the enclosure housing with upper rear openings and lower rear openings, while server modules are installed in module insertion/extraction parts inside the enclosure housing in an insertable/removable manner. Server modules have module trays for mounting electronic components and interface units. Interface units are retractively inserted into upper rear openings or lower rear openings in connection with power source units when server modules are moved in a lengthwise direction along module insertion/extraction parts inside the enclosure housing.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: July 25, 2017
    Inventor: Toshiyuki Hayashi
  • Patent number: 9711307
    Abstract: In an overload relay, a tripping actuator 12 has a first magnet 18 and a moveable contact carrier 20 has a second magnet 28 mounted opposed to the first magnet. A moveable contact 22 on the moveable contact carrier is urged by repulsion between the magnets, to make a normally closed connection with a stationary contact 24, when the tripping actuator is in an ON position 15 and the contact carrier in a first stable position 26?. The magnets pass through an over-center tripping position (T) when the tripping actuator is moved to an OFF position 23 in response to an overcurrent condition sensed by a bimetallic thermal overload sensor 16. The magnets repel each other after passing through the over-center tripping position, to thereby urge the moveable contact into a second stable position 26, away from the stationary contact, to break the normally closed connection with the stationary contact.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: July 18, 2017
    Inventor: Conrad S. Weiden
  • Patent number: 9691515
    Abstract: A power distribution system element formed via an additive manufacturing technique, such as applying a conductive material to a memory metal substrate, are discussed herein. In operation (e.g. in response to delivering current through the distribution system), the memory metal contracts while the conductive material expands. The result is distribution system element having reduced thermal expansion, which can be net zero coefficient of thermal expansion.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: June 27, 2017
    Inventors: Eric Karlen, John Horowy
  • Patent number: 9685393
    Abstract: A phase-change chamber, a method for fabricating a phase-change chamber and a heat dissipation apparatus for electronic device cooling are disclosed. The phase-change chamber includes: a phase-change medium capable of transitioning between a plurality of phases; a first surface for transitioning a portion of the phase-change medium from a first phase into a second phase; a second surface for transitioning a portion of the phase-change medium from the second phase into the first phase; and at least one supporting member along the circumference of the first surface and the second surface for separating and enclosing the first surface and the second surface. The first surface is patterned on a first plate and includes regions of high and low affinity to the phase-change medium. The second surface is received on a second plate and comprises low affinity to the phase-change medium.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: June 20, 2017
    Assignee: The Hong Kong University of Science and Technology
    Inventors: Huihe Qiu, Zhen Sun, Xiaodan Chen, Bin Wang
  • Patent number: 9608250
    Abstract: A wire arrangement body includes: a wire arrangement groove portion of a groove shape that receives one or more wires; a lid portion that is rotatably connected to the wire arrangement groove portion about a first hinge and covers the wire arrangement groove portion so as to seal a groove opening of the wire arrangement groove portion; and a wire drawing piece that is rotatably connected to the lid portion about a second hinge. The wire arrangement body is provided so that a rotation axis of the second hinge crosses at a right angle to a rotation axis of the first hinge.
    Type: Grant
    Filed: August 18, 2010
    Date of Patent: March 28, 2017
    Inventors: Shigeyuki Ogasawara, Keizo Aoki
  • Patent number: 9603291
    Abstract: A semiconductor device includes a semiconductor element accommodated in an outer case; a control circuit board fixed to the outer case at a position away from the semiconductor element; and a shield plate provided between the semiconductor element and the control circuit board. The outer case is provided with a support having a convex portion longer than a thickness of the shield plate at a distal end thereof. The shield plate is formed with a through-hole in which the convex portion of the support passes through. The shield plate is fixed to the support with a fixing device engaging with the convex portion.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: March 21, 2017
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Shin Soyano
  • Patent number: 9418813
    Abstract: A first and a second pair of projecting portions are provided in a cavity portion of a fuse mounting portion made of resin. An upper end surface of each projecting portion is tapered, so as to guide a pair of male terminals of a fuse sub-assembly toward a corresponding female terminals attached to the cavity portion, when the fuse sub-assembly is inserted into the cavity portion. A gap is formed between the fuse sub-assembly and the tapered upper end surfaces in a fuse-mounted condition, in which the fuse sub-assembly is in contact with a stopper portion of the cavity portion, in order to prevent contact failure caused by thermal shock.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: August 16, 2016
    Assignee: ANDEN CO., LTD.
    Inventors: Koichi Sato, Hirohisa Suzuki
  • Patent number: 9357679
    Abstract: Embodiments of the present invention disclose an electronic equipment cooling system including: a cabinet; at least one electronic equipment chassis that is installed inside the cabinet; and an auxiliary cooling device including an air pressurizing device, an air supply plenum box, and an air-guiding device. The air supply plenum box is disposed on an inner side of the cabinet. The air pressurizing device is disposed at the top or bottom of the cabinet, and an air exhaust on a sidewall of the air pressurizing device is connected to a corresponding air intake on a sidewall of the air supply plenum box. The air-guiding device is installed inside the electronic equipment chassis, an air intake of the air-guiding device is connected to an air exhaust of the air supply plenum device, and an air exhaust of the air-guiding device faces a component inside the electronic equipment chassis.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: May 31, 2016
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yuan Dong, Liqian Zhai, Shanjiu Chi, Jun Zhao
  • Patent number: 9348365
    Abstract: The present invention describes a modular computerized system that includes the ability to magnetically attach to another similar or identical unit, integrates both male and female ports into each unit so that when two or more units are attached side by side the ports become functional and do not require external cables. Other elements of the invention include; the integration of one or more data splitters into the computerized unit and the integration of one or more power splitters into the computerized unit. The present invention also provides the ability to charge more than one computerized unit with only one cable attachment and the ability to share data quickly and easily between more than one computerized unit without the use of cables unless desired.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: May 24, 2016
    Inventor: John Archie Gillis
  • Patent number: 9320172
    Abstract: A thermal management system includes a distributor plate secured to and parallel to a circuit board. The circuit board has a module secured thereto and the distributor plate defines an area on an inner surface thereof secured to or otherwise in thermal contact with the module. Heat pipes embedded in the distributor plate include a portion over the module and a portion over the circuit board outward from the module. A portion of the heat pipes outward from the module may be substantially perpendicular to a direction of airflow between the circuit board and distributor plate. The module may be located closer to one edge of the circuit board and the heat pipes may according extend from adjacent that edge to an opposite edge of the circuit board. An inward facing surface may include fins extending toward the circuit board and the fins may be contoured to the circuit board.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: April 19, 2016
    Assignee: Ciena Corporation
    Inventors: Todd Andrew Newhouse, Colin John Wilson
  • Patent number: 9312752
    Abstract: An electronics apparatus having a housing, an inverting device, a first circuit board connected to the inverting device via at least one line, and a second circuit board connected via a first galvanic connection to the first circuit board and connected via a second galvanic connection to at least component, and having a first filter situated on the first circuit board and upstream from the first galvanic connection, the first filter having a first discharge connection to the housing, and having a second filter situated on the second circuit board and downstream from the first galvanic connection, the second filter having a second discharge connection to the housing, and having a third filter situated on the second circuit board and upstream from the second galvanic connection, the third filter having a third discharge connection to the housing. A method for producing an electronics apparatus is also described.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: April 12, 2016
    Inventor: Hartmut Sparka