Abstract: A semiconductor device may include: a mode input control signal generation circuit configured to generate a control pulse when a mode control operation is performed, generate a mode input control signal by delaying the control pulse by a mode delay period, and control the mode delay period on the basis of a restart signal; a read strobe signal generation circuit configured to generate a read strobe signal on the basis of the control pulse; a read delay circuit configured to generate the read input control signal by delaying the read strobe signal by a read delay period; and a read pipe circuit configured to receive mode data on the basis of the mode input control signal, and receive cell data on the basis of the read input control signal.

Abstract: A phase change memory (PCM) cell comprising a substrate a first electrode located on the substrate. A phase change material layer located adjacent to the first electrode, wherein a first side of the phase change material layer is in direct contact with the first electrode. A second electrode located adjacent to phase change material layer, wherein the second electrode is in direct contact with a second side of the phase change material layer, wherein the first side and the second side are different sides of the phase change material layer. An airgap is located directly above the phase change material layer, wherein the airgap provides space for the phase change material to expand or restrict.

Abstract: Provided is a semiconductor storage device that includes a substrate, a first storage element formed on the substrate and including a first insulating film, and a second storage element formed on the substrate and including a second insulating film having a film thickness of equal to or greater than 0.5 times and equal to or less than 2 times a film thickness of the first insulating film, the second storage element differing from the first storage element in power consumption at a time of writing.

Abstract: Method and circuit for adaptive column-select line signal generation for a memory device are provided. The method comprises the following steps. A first signal is generated in response to a memory access command. A second signal is generated according to a candidate signal selected from a plurality of candidate signals including a first candidate signal and a second candidate signal, wherein after the first signal is asserted, the first candidate signal is asserted when a configurable time interval with respect to a parameter from a register set elapses and the second candidate signal is asserted when a specified time interval elapses, and the selected candidate signal is asserted before a remaining part of the candidate signals after the first signal is asserted. A column-select line signal is generated according to the first signal and the second signal.

Abstract: According to one embodiment, a semiconductor memory device includes a first string unit including a first memory string including a first selection transistor and a first memory cell coupled to the first selection transistor, a second string unit including a second memory string including a second selection transistor and a second memory cell coupled to the second selection transistor, a first select gate line, a second select gate line, a first bit line, a second bit line, and a first word line. Both of the first select gate line and the second select gate line are selected in a first read operation. The first select gate line is selected and the second select gate line is not selected in a second read operation.

Abstract: A processing apparatus includes a bit-cell array including at least one bit-cell line including a plurality of bit-cells electrically connected to each other in series, wherein each of the plurality of bit-cells includes: a first magnetic resistor that is configured to store a first resistance value based on a movement of a location of a magnetic domain-wall; a second magnetic resistor that is configured to store a second resistance value, wherein the second resistance value is equal to or less than the first resistance value; a first switching element configured to switch an electrical signal applied to the first magnetic resistor; and a second switching element configured to switch an electrical signal applied to the second magnetic resistor.

Abstract: A memory system includes a memory array including a plurality of memory cells; and a controller coupled to the memory array, the controller configured to: determine a target profile including distribution targets, wherein each of the distribution targets represent a program-verify target corresponding to a logic value for the memory cells, determine a feedback measure based on implementing a processing level for processing data, and dynamically adjust the program-verify target according to the feedback measure.

Abstract: According to one embodiment, a semiconductor storage device includes strings each with a first select transistor, memory cell transistors, and a second select transistor connected in series. Word lines are provided, each connected to memory cell transistors in a same position across the strings. A bit line is connected in common to a first end of each of the strings. A source line is connected in common to a second end of each of the strings. A control circuit is configured to perform an erase operation on strings. The control circuit adjusts, for each of the strings, either an application time of a first voltage applied to a gate of the first select transistor of the respective string in the erase operation or a voltage level of the first voltage applied to the gate of the first select transistor of the respective string in the erase operation.

Abstract: A 3-dimensional array of NOR memory strings being organized by planes of NOR memory strings, in which (i) the storage transistors in the NOR memory strings situated in a first group of planes are configured to be programmed, erased, program-inhibited or read in parallel, and (ii) the storage transistors in NOR memory strings situated within a second group of planes are configured for storing resource management data relating to data stored in the storage transistors of the NOR memory strings situated within the first group of planes, wherein the storage transistors in NOR memory strings in the second group of planes are configured into sets.

Abstract: A method includes forming a bottom electrode, forming a dielectric layer, forming a Phase-Change Random Access Memory (PCRAM) region in contact with the dielectric layer, and forming a top electrode. The dielectric layer and the PCRAM region are between the bottom electrode and the top electrode. A filament is formed in the dielectric layer. The filament is in contact with the dielectric layer.

Abstract: An array of rail structures is formed over a substrate. Each rail structure includes at least one bit line. Dielectric isolation structures straddling the array of rail structures are formed. Line trenches are provided between neighboring pairs of the dielectric isolation structures. A layer stack of a resistive memory material layer and a selector material layer is formed within each of the line trenches. A word line is formed on each of the layer stacks within unfilled volumes of the line trenches. The word lines or at least a subset of the bit lines includes a carbon-based conductive material containing hybridized carbon atoms in a hexagonal arrangement to provide a low resistivity conductive structure. An array of resistive memory elements is formed over the substrate. A plurality of arrays of resistive memory elements may be formed at different levels over the substrate.

Abstract: A memory cell may include a first electrode, a second electrode, and a self-selecting storage element between the first electrode and the second electrode. The self-selecting storage element may extend between the first electrode and the second electrode in a direction that is parallel with a plane defined by the substrate. The self-selecting storage element may also include a bulk region and a sidewall region. The bulk region may include a chalcogenide material having a first composition, and the sidewall region may include the chalcogenide material having a second composition that is different than the first composition. Also, the sidewall region may extend between the first electrode and the second electrode.

Abstract: An example apparatus includes a processing in memory (PIM) capable device having an array of memory cells and sensing circuitry coupled to the array. The PIM capable includes a row address strobe (RAS) component selectably coupled to the array. The RAS component is configured to select, retrieve a data value from, and input a data value to a specific row in the array. The PIM capable device also includes a RAS manager selectably coupled to the RAS component. The RAS manager is configured to coordinate timing of a sequence of compute sub-operations performed using the RAS component. The apparatus also includes a source external to the PIM capable device. The RAS manager is configured to receive instructions from the source to control timing of performance of a compute operation using the sensing circuitry.

Abstract: A phase change memory (PCM) structure including a bottom electrode, a first dielectric spacer disposed above and in contact with the bottom electrode, the first dielectric spacer comprising a vertical seam, a PCM layer disposed above the first dielectric spacer, and a heater element disposed in the seam and in contact with the bottom electrode.

Abstract: Embodiments of present invention provide a SRAM device. The SRAM device includes a first, a second, and a third SRAM cell each having a first and a second pass-gate (PG) transistor, wherein the second PG transistor of the second SRAM cell and the first PG transistor of the first SRAM cell are stacked in a first PG transistor cell, and the first PG transistor of the third SRAM cell and the second PG transistor of the first SRAM cell are stacked in a second PG transistor cell. The first and second PG transistors of the first SRAM cell may be stacked on top of, or underneath, the second PG transistor of the second SRAM cell and/or the first PG transistor of the third SRAM cell.

Abstract: A program effective time (PET) for programming at least a portion of a plurality of memory cells based on one or more program step characteristics is determined. The determined PET and a target PET is compared. In response to the determined PET being different than the target PET, the one or more program step characteristics is adjusted to adjust the determined PET to the target PET.

Abstract: A semiconductor memory device including a substrate having a first region and a second region; a plurality of first transistors provided in the first region; a plurality of second transistors provided in the second region, the plurality of second transistors being electrically coupled to the plurality of first transistors, respectively, and a breakdown-voltage of the second transistor being lower than a breakdown-voltage of the first transistor. A plurality of joint metals are provided above the first region, the plurality of joint metals being electrically coupled to the plurality of first transistors, respectively. A plurality of bit lines are provided in an upper layer of the plurality of joint metals, the plurality of bit lines being coupled to the plurality of joint metals, respectively; and a plurality of memory cells are provided in an upper layer of the plurality of bit lines, the plurality of memory cells being coupled to the plurality of bit lines, respectively.

Abstract: A memory cell and formation thereof. The memory cell including: a first dielectric material having a via; a dielectric spacer on a sidewall of the via, and a second dielectric material pinching off the via and forming a seam.

Abstract: A storage device includes a resistance change memory element including a first electrode, a second electrode, a resistance change layer between the first and second electrodes, including at least two elements selected from a group consisting of germanium (Ge), antimony (Sb), and tellurium (Te), and having a crystal structure with a c-axis oriented in a first direction from the first electrode toward the second electrode, and a first layer between the first electrode and the resistance change layer and including nitrogen (N) and at least one of silicon (Si) or germanium (Ge).

Abstract: Semiconductor devices and methods of manufacturing the same are provided in which memory cells are manufactured with a double sided word line structure. In embodiments a first word line is located on a first side of the memory cells and a second word line is located on a second side of the memory cells opposite the first side.