Abstract: According to one embodiment, there is provided a semiconductor memory device including a first chip, a second chip and a third chip. In the first chip, plural first conductive layers are stacked via a first insulating layer. In the second chip, plural second conductive layers are stacked via a second insulating layer. A number of stack layers in the plural first conductive layers and a number of stack layers in the plural second conductive layers are different from each other.

Abstract: The present disclosure includes apparatuses, methods, and systems for multi-state programming of memory cells. An embodiment includes a memory having a plurality of memory cells, and circuitry configured to program a memory cell of the plurality of memory cells to one of a plurality of possible data states by applying a voltage pulse to the memory cell, determining the memory cell snaps back in response to the applied voltage pulse, turning off a current to the memory cell upon determining the memory cell snaps back, and applying a number of additional voltage pulses to the memory cell after turning off the current to the memory cell.

Abstract: A memory device, and a method of operating the memory device, includes a memory block including strings formed between bit lines and a source line and includes a peripheral circuit configured to perform a read operation of a selected memory cell included in a selected string among the strings. The peripheral circuit includes page buffers configured to increase a voltage of channels of the strings by applying a first precharge voltage to the bit lines in a set-up phase of the read operation, apply a second precharge voltage lower than the first precharge voltage to the bit lines in a read phase of the read operation, and discharge the bit lines in a discharge phase of the read operation.

Abstract: A page buffer circuit including a data latch circuit and a sensing latch circuit. The data latch circuit configured to store data corresponding to a normal operation. The sensing latch circuit configured to receive and store the data in the data latch circuit in an entering operation in accordance with a suspend operation. The sensing latch circuit configured to transmit the data stored in the sensing latch circuit to the data latch circuit in a sensing operation in accordance with the suspend operation. The sensing latch circuit configured to suspend data in a memory cell, and to output the suspend data from the memory cell.

Abstract: An array of rail structures is formed over a substrate. Each rail structure includes at least one bit line. Dielectric isolation structures straddling the array of rail structures are formed. Line trenches are provided between neighboring pairs of the dielectric isolation structures. A layer stack of a resistive memory material layer and a selector material layer is formed within each of the line trenches. A word line is formed on each of the layer stacks within unfilled volumes of the line trenches. The word lines or at least a subset of the bit lines includes a carbon-based conductive material containing hybridized carbon atoms in a hexagonal arrangement to provide a low resistivity conductive structure. An array of resistive memory elements is formed over the substrate. A plurality of arrays of resistive memory elements may be formed at different levels over the substrate.

Abstract: A static random access memory device includes a memory matrix provided with at least one set of SRAM memory cells and a circuit for initializing cells of the set, the setting circuit being able to carry out various setting types and in particular a “deterministic” setting in which the cells are established at an imposed value and to carry out a “free” setting in which the cells are established at a value that depends on their manufacturing method.

Abstract: A memory chip includes row hammer threat detection circuitry. The memory chip includes an output. The memory chip includes backpressure signal generation circuitry coupled between the row hammer detection circuitry and the output. The backpressure signal generation circuitry is to generate a backpressure signal to be sent from the output in response to detection by the row hammer threat detection circuitry of a row hammer threat.

Abstract: Semiconductor devices and methods of manufacturing the same are provided in which memory cells are manufactured with a double sided word line structure. In embodiments a first word line is located on a first side of the memory cells and a second word line is located on a second side of the memory cells opposite the first side.

Abstract: Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations including determining a value of a data state metric of a memory page, wherein the data state metric value is reflective of a number of bit errors associated with the memory page; upon determining that the data state metric value satisfies a first threshold criterion, obtaining, from a neural network, a value of a voltage distribution metric associated with the page; and upon determining that the voltage distribution metric value satisfies a second threshold criterion, performing a media management operation with respect to a block associated with the page, wherein the media management operation comprises writing data stored at the block to a new block.

Abstract: Disclosed is a resistive random access memory (RRAM) circuit and related method to limit current, or ramp voltage, applied to a source line or bitline of an RRAM array. The RRAM array has one or more source lines and one or more bitlines. A control circuit sets an RRAM cell to a low resistance state in a set operation, and resets the RRAM cell to a high resistance state in a reset operation. A voltage applied to a bitline or source line is ramped during a first time interval, held to a maximum voltage value during a second interval, and ceased after the second time interval.

Abstract: A signal control circuit includes: a generating circuit configured to accumulate execution times of an activation operation and output a block signal in response to an accumulated value being greater than or equal to a first preset value; and a logic circuit configured to receive an activation operation signal and the block signal, block outputting of the activation operation signal in response to receiving the block signal, and output the activation operation signal in response to not receiving the block signal.

Abstract: A device is provided. The device includes a multi-layered structure that is non-magnetic at room temperature, the multi-layered structure comprising alternating layers of Co and E, wherein E comprises at least one other element selected from the group consisting of Ge, Ga, Sn and Al, wherein a composition of the multi-layered structure is represented by Co1?xEx, with x being in a range from 0.42 to 0.55. The device also includes a combined layer provided in contact with the multi-layered structure, the combined layer including an insertion layer comprising Co or Fe or Mn or Al in contact with a Heusler compound.

Abstract: Multi-gate NOR flash thin-film transistor (TFT) string arrays (“multi-gate NOR string arrays”) are organized as stacks of horizontal active strips running parallel to the surface of a silicon substrate, with the TFTs in each stack being controlled by vertical local word-lines provided along one or both sidewalls of the stack of active strips. Each active strip includes at least a channel layer formed between two shared source or drain layers. Data storage in the TFTs of an active strip is provided by charge-storage elements provided between the active strip and the control gates provided by the adjacent local word-lines. Each active strip may provide TFTs that belong to one or two NOR strings, depending on whether one or both sides of the active strip are used.

Abstract: A method of operating the memory system includes determining a boundary page line to be found, the boundary page line including a first page line of page lines in a programming order. States of pages forming the first page line of the page lines in the programming order are all erased state. The method also includes obtaining an address of a frozen page line, the frozen page line including a first page line of a first page line group. States of at least part of pages forming the first page line of the first page line group are erased state. The method further includes determining that states of pages forming the frozen page line are all programmed state. The method further includes determining the page line group to which the boundary page line belongs according to the address of the frozen page line. The method further includes determining an address of the boundary page line from the page line group to which the boundary page line belongs.

Abstract: A non-volatile multi-bit storage device that includes a phase change material doped with n-type or p-type semiconductor impurities, a first set of electrodes ohmically coupled to the phase change material, a second set of electrodes configured to apply an electric field across the phase change material. To program the non-volatile multi-bit storage device, an electrical field is applied to the phase change material as crystal annealing cool down is performed. Application of the electric field during the crystal annealing cool down forms a rectified current path through the phase change material.

Abstract: Apparatuses, systems, and methods for input buffer data feedback equalization (DFE). An input buffer includes a DFE circuit which adjusts a threshold voltage of the input buffer based on a previously latched data bit. The DFE circuit includes a number of DFE legs coupled in parallel to a node of the input buffer. Each DFE leg is selectively activated by a DFE code. Each DFE leg includes a capacitance (e.g., a field effect transistor) which is coupled to the node in an active leg based on the previously latched data bit. The previously latched data bit may also be used to generate a reset signal which couples the capacitors to ground. Each DFE leg may also include a transistor coupled to a bias voltage, which is stable across a range of PVT variations.

Abstract: Described is a packaging technology to improve performance of an AI processing system. An IC package is provided which comprises: a substrate; a first die on the substrate, and a second die stacked over the first die. The first die includes memory and the second die includes computational logic. The first die comprises DRAM having bit-cells. The memory of the first die may store input data and weight factors. The computational logic of the second die is coupled to the memory of the first die. In one example, the second die is an inference die that applies fixed weights for a trained model to an input data to generate an output. In one example, the second die is a training die that enables learning of the weights. Ultra high-bandwidth is changed by placing the first die below the second die. The two dies are wafer-to-wafer bonded or coupled via micro-bumps.

Abstract: Provided is a memory device including a cell array, a peripheral circuit configured to control a memory operation of the plurality of memory cells, a test logic circuit configured to operate in a test mode and configured to perform a test operation on the plurality of memory cells, a first regulator configured to regulate a first power supply voltage received through a first pad and provide the first power supply voltage to at least one of the cell array and the peripheral circuit, and a power manager between the first pad and an input terminal of the first regulator, and between the first pad and the test logic circuit and configured to provide a test power supply voltage to the test logic circuit. In the test mode, while a first target voltage level of the first regulator fluctuates, a second target voltage level of the power manager is maintained constant.

Abstract: The present technology relates to a voltage supply circuit, and the voltage supply circuit according to the present technology includes a signal generation circuit configured to generate an active mode enable signal according to a chip selection signal provided from an external device, and generate a standby mode enable signal using an external voltage provided from the external device, an active voltage regulator configured to receive the active mode enable signal and output an active mode operation voltage when the active mode enable signal is in a high state, and a standby voltage regulator configured to receive the active mode enable signal and the standby mode enable signal, output a standby mode operation voltage while the standby mode enable signal is in the high state, and output a voltage lower than the standby mode operation voltage when the active mode enable signal is in the high state.

Abstract: A semiconductor memory device according to an embodiment includes a first storage circuit. The first storage circuit is configured to store a first unique number uniquely assigned, and a first chip address having a bit number smaller than that of the first unique number and used to identify the semiconductor memory device from other semiconductor memory devices.