Abstract: A semiconductor device includes a read write control circuit configured to generate first and second write command pulses from an external control signal for performing a write operation; a flag generation circuit configured to generate a write flag, a write shifting flag, an internal write flag and an internal write shifting flag based on the second write command pulse, a bank mode signal and a bank group mode signal; and a bank group selection signal generation circuit configured to store a bank address based on an write input control pulse generated from the second write command pulse in a bank mode, and output the stored bank address as a bank group selection signal based on a write output control pulse generated from the write flag.

Abstract: NOR memory strings may be used for implementations of logic functions involving many Boolean variables, or to generate analog signals whose magnitudes are each representative of the bit values of many Boolean variables. The advantage of using NOR memory strings in these manners is that the logic function or analog signal generation may be accomplished within one simultaneous read operation on the NOR memory strings.

Abstract: A semiconductor memory device has a first wiring extending in a first direction and a second wiring extending in a second direction. The first and second wirings are spaced from each other in a third direction. The second wiring has a first recess facing the first wiring. A resistance change memory element is connected between the first and second wirings. A conductive layer is between the resistance change memory element and the second wiring and includes a first protrusion facing the second wiring. A switching portion is between the conductive layer and the second wiring and includes a second recess facing the conductive layer and a second protrusion facing the second wiring. The first protrusion is in the second recess. The second protrusion is in the first recess. The switching portion is configured to switch conductivity state according to voltage between the first wiring and the second wiring.

Abstract: In an embodiment, a memory system may include at least two types of DRAM, which differ in at least one characteristic. For example, one DRAM type may be a high density DRAM, while another DRAM type may have lower density but may also have lower latency and higher bandwidth than the first DRAM type. DRAM of the first type may be on one or more first integrated circuits and DRAM of the second type may be on one or more second integrated circuits. In an embodiment, the first and second integrated circuits may be coupled together in a stack. The second integrated circuit may include a physical layer circuit to couple to other circuitry (e.g. an integrated circuit having a memory controller, such as a system on a chip (SOC)), and the physical layer circuit may be shared by the DRAM in the first integrated circuits.

Abstract: A switch device according to an embodiment of the present disclosure includes a first electrode; a second electrode opposed to the first electrode; and a switch layer including selenium (Se), at least one kind of germanium (Ge) or silicon (Si), boron (B), carbon (C), (Ga), and arsenic (As), and provided between the first electrode and the second electrode.

Abstract: Described are CMOS-compatible protonic resistive devices (e.g., processing elements and/or memory elements). In embodiments, a protonic resistive memory can be formed from a proton-sensitive metal oxide channel where the concentration of protons intercalated inside the layer is controlled to modulate its conductivity. The protons can initially be supplied to the material stack by an implantation method. Irradiation techniques can be implemented to increase the concentration and conductivity of protons inside the materials. Some designs can put the active layer and reservoir in direct contact, creating an electrolyte-free device. Designs provide scalable solutions for full-scale Si-integration.

Abstract: A system may include a first conductive plate configured at least to receive an input signal and a second conductive plate configured at least to output an output signal. The system may further include a first memristor material positioned between the first conductive plate and the second conductive plate. The system may further include a second memristor material positioned between the first conductive plate and the second conductive plate. The first memristor material and the second memristor material may be in parallel electrically. The first memristor material may be different from the second memristor material.

Abstract: Numerous embodiments are disclosed for compensating for differences in the slope of the current-voltage characteristic curve among reference transistors, reference memory cells, and flash memory cells during a read operation in an analog neural memory in a deep learning artificial neural network. The embodiments are able to compensate for slope differences during both sub-threshold and linear operation of reference transistors.

Abstract: A resistive switching memory device according to an exemplary embodiment includes: a first electrode; a second electrode formed to be separated from the first electrode; and an insulating layer formed near the first electrode and the second electrode, and changed to one of a high resistance state and a low resistance state when a conductive filament is controlled by a change of external humidity or a voltage applied through the first electrode or the second electrode.

Abstract: A method includes forming a bottom electrode, forming a dielectric layer, forming a Phase-Change Random Access Memory (PCRAM) region in contact with the dielectric layer, and forming a top electrode. The dielectric layer and the PCRAM region are between the bottom electrode and the top electrode. A filament is formed in the dielectric layer. The filament is in contact with the dielectric layer.

Abstract: A semiconductor device including a semiconductor substrate; a memory cell structure on the semiconductor substrate; and a peripheral wiring structure between the semiconductor substrate and the memory cell structure to connect the semiconductor substrate and the memory cell structure, wherein the peripheral wiring structure includes at least one lower wiring structure and an upper wiring structure on the at least one lower wiring structure, the at least one lower wiring structure includes a lower wiring, the upper wiring structure includes an upper wiring, the lower wiring includes a first material layer having first grains, the upper wiring includes a second material layer having second grains, an average size of the second grains is smaller than an average size of the first grains.

Abstract: A lookup-table type TL-TCAM hardware search engine includes a SL decoder, a TL-TCAM array, and the data stored in the TL-TCAM hardware search engine is obtained by performing lookup table operation in the corresponding TCAM hardware search engine, the SL decoder is used to decode the search word and send it to the TL-TCAM hardware search engine array, and the decoding is to convert a search word SL corresponding to data in a TCAM hardware search engine table into a search word LSL corresponding to TL-TCAM hardware search engine table data, the effect is that TCAM adds a decoder, cooperates with the decoder and by lookup table method converts the TCAM table data to a new circuit unit that can be adapted to the added search line.

Abstract: A semiconductor device capable of reducing electric power consumption while suppressing deterioration in reliability is provided. The semiconductor device includes a flash memory, a SRAM formed on a SOI substrate, oscillation circuits generating a signal of a first frequency and a signal of a second frequency lower than the first frequency, and a processor operating in synchronization with a system clock. The processor performs steps of turning on a power supply of the flash memory, lowering a threshold voltage of the SRAM, transferring a program from the flash memory to the SRAM by using the signal of the first frequency as the system clock, turning off the power supply of the flash memory, heightening the threshold voltage of the SRAM, and executing the program stored in the SRAM by using the signal of the second frequency as the system clock.

Abstract: A variable resistance memory device includes a first electrode on a substrate, a variable resistance pattern on the first electrode, a second electrode on the variable resistance pattern, a selection pattern structure on the second electrode, and a third electrode on the selection pattern structure. The selection pattern structure may include a first leakage current prevention pattern and a selection pattern sequentially stacked, and the first leakage current pattern may include a two-dimensional transition metal dichalcogenide (TMDC) material.

Abstract: An apparatus is provided that includes a memory device including a plurality of sub-arrays, and a memory controller. The memory controller is configured to determine a value of a parameter of a corresponding write pulse for each bit of a word based on a relative importance of each bit, and write each bit of the word to a corresponding one of the plurality of sub-arrays using the corresponding write pulses.

Abstract: A memory device may include a digit line, a ferroelectric memory cell coupled with the digit line, a first capacitor including a first node and a second node, the first node coupled with the digit line using a first path and the second node coupled with the digit line using a second path different from the first path, and a switching component positioned in the second path and coupled with the second node of the first capacitor and the digit line, the switching component configured to selectively couple the second node of the first capacitor with the digit line. In some cases, the memory device may further include a second capacitor coupled with the digit line and the second node of the first capacitor.

Abstract: A method is presented for improved linearity of a phase change memory (PCM) cell structure. The method includes forming a bottom electrode over a substrate, constructing a PCM stack including a plurality of PCM layers each having a different crystallization temperature over the bottom electrode, and forming a top electrode over the PCM stack. The crystallization temperature varies in an ascending order from the bottom electrode to the top electrode.

Abstract: A method, computer program product, and computing system for detecting a data location event concerning a data storage system; holistically analyzing the data storage system to determine a status for the data storage system; and generating one or more recommendations concerning the data location event based, at least in part, upon the status for the data storage system.

Abstract: A semiconductor memory may include: variable resistance layers and insulating layers alternately stacked; conductive pillars passing through the variable resistance layers and the insulating layers; a slit insulating layer passing through the insulating layers and extending in a first direction; and conductive layers interposed between the slit insulating layer and the variable resistance layers. The variable resistance layers may remain in an amorphous state during a program operation.

Abstract: According to some embodiments of the present invention a phase change device (PCD) has a first and second semiconductor layer. The first semiconductor layer made of a first semiconductor material and has a first semiconductor thickness, a first interface surface, and a first electrode surface. The first interface surface and first electrode surface are on opposite sides of the first semiconductor layer. The first semiconductor material can transition between a first amorphous state and a first crystalline state at one or more first conditions. The second semiconductor layer is made of a second semiconductor material and has a second semiconductor thickness, a second interface surface, and a second electrode surface. The second interface surface and second electrode surface are on opposite sides of the second semiconductor layer. The first interface surface and the second interface surface are in electrical, physical, and chemical contact with one another at an interface.