Abstract: A multicore optical fiber is provided that includes a first core with silica glass doped with chlorine and/or an alkali metal, a first inner cladding surrounding the first core, and a first outer cladding surrounding the first inner cladding and having a first trench region having a volume of about 30%?-micron2 or greater. The multicore optical fiber also includes a second core with silica glass doped with chlorine and/or an alkali metal, a second inner cladding surrounding the second core, and a second outer cladding surrounding the second inner cladding and having a second trench region having a volume of about 30%?-micron2 or greater. Additionally, a common cladding surrounds the first core and the second core, and the first core and the second core each have an effective area at 1550 nm of about 100 micron2 or less.

Abstract: A silicon-based edge coupler for coupling a fiber with a waveguide includes a cantilever member being partially suspended with its anchored end coupled to a silicon photonics die in a first part of a silicon substrate and a free end terminated near an edge region separating a second part of the silicon substrate from the first part. The edge coupler further includes a mechanical stopper formed at the edge region with a gap distance ahead of the free end of the cantilever member. Additionally, a V-groove is formed in the second part of the silicon substrate characterized by a top opening and a bottom plane symmetrically connected by two sloped side walls along a fixed Si-crystallography angle. The V-groove is configured to support a fiber with an end facet being pushed against the mechanical stopper and a core center being aligned with the free end of the cantilever member.

Abstract: An MCF having a structure excellent in mass productivity and suppressing increases in splicing cost and loss are provided. The MCF includes 12 or 16 cores, a cladding, and a coating. The cores are arranged at positions of line symmetry while no adjacent relationship is established between the cores having an adjacent relationship with any core. A coating diameter is 235-265 ?m, a cladding diameter CD is from CDnominal?1 ?m to CDnominal+1 ?m with a nominal value CDnominal of 195 ?m or less, an MFD at 1310 nm is from MFD-reference-value ?0.4 ?m to the MCF-reference-value+0.4 ?m with the MFD-reference-value of 8.2-9.2 ?m, and a 22 m-cable-cutoff wavelength ?cc is 1260-1360 nm. A core's zero-dispersion wavelength is a wavelength-reference-value ?12 nm to the wavelength-reference-value+12 nm with the wavelength-reference-value of 1312-1340 nm, and a dispersion slope at the wavelength is 0.092 ps/(nm2·km) or less.

Abstract: The present disclosure relates to a resin composition for coating an optical fiber, the resin composition including: a base resin that contains an oligomer, a monomer, and a photopolymerization initiator; and inorganic oxide particles, in which the inorganic oxide particles include a plurality of particle groups having different volume average particle sizes, and the volume average particle size is measured by small-angle X-ray scattering.

Abstract: A patch panel may include a tray that is slidable between a retracted position and an extended position on tray supports and features for holding the tray in the retracted position and in the extended position. The patch panel may also include a cassette that is slidable on cassette supports, latches for engaging the cassette to block movement of the cassette and features for disengaging the latches.

Abstract: A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.

Abstract: An optical connection structure including first optical fibers, second optical fibers, a first optical connector, and a second optical connector is disclosed. The first optical connector is configured such that each of first distal end portions of the first optical fibers protrudes from a first front end surface to the outside when the first optical connector and the second optical connector are connected to each other. Each of the first distal end portions is inserted into a corresponding second fiber hole of the second optical connector. The second optical connector is configured such that each of second distal end portions of the second optical fibers is moved rearward inside second fiber holes due to each of the first distal end portions respectively inserted into the second fiber holes. The first optical fibers and the second optical fibers are optically coupled to each other inside the second fiber holes.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.

Abstract: An optical fiber includes a glass portion, a primary coating layer, and a secondary coating layer. In the optical fiber, a value of microbend loss characteristic factor F?BL_GO is 2.6 ([GPa?1·?m?10.5·dB/turn]·10?27) or less, when represented by F?BL_GO=F?BL_G×F?BL_O by using geometry microbend loss characteristic F?BL_G and optical microbend loss characteristic F?BL_O.

Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The connection port passageway defines a keying portion. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.

Abstract: An optical fiber cable including a central strength member, a first plurality of tight-buffered ribbon stacks, a binder film, and a cable sheath. The central strength member extends along a longitudinal axis of the optical fiber cable. The tight-buffered ribbon stacks are SZ-stranded around the central strength member. An interstitial space is provided between adjacent tight-buffered ribbon stacks. A binder film continuously and contiguously surrounds the first plurality of tight-buffered ribbon stacks along the longitudinal axis. The binder film includes first portions and at least one second portion. Each of the at least one second portion of the binder film extends into one of the interstitial spaces of the first plurality of tight-buffered ribbon stacks. The cable sheath continuously and contiguously surrounds the binder film along the longitudinal axis, and the cable sheath is coupled to the first portions of the binder film.

Abstract: A connector includes a ferrule assembly having a ferrule, a hub and a spring, the ferrule having a distal face accessible at a distal end of the connector housing, the ferrule being movable in a proximal direction relative to the connector housing. The distal and proximal positions are separated by an axial displacement distance. The ferrule proximal movement is against the spring's bias. The cable of the assembly includes an optical fiber contained within a jacket and also a strength layer between the fiber and the jacket that is anchored to the connector housing. The fiber extends through a fiber from the proximal end of the connector housing to the ferrule. The fiber has a distal portion potted within the ferrule. The fiber passage has a fiber take-up region configured to take-up an excess length of the fiber corresponding to the ferrule axial displacement.

Abstract: A guided-wave-driven metasurface antenna includes an input for receiving a guided wave; an output for outputting a free-space wave; and a spatial frequency mixer connected between the input and the output for converting the guided wave to the free-space wave. The spatial frequency mixer is implemented by a metasurface of the antenna. The superheterodyne metasurface can be fabricated with high accuracy using lithography step similar to conventional waveguides made by the well-established semiconductor processing technology, making their integration with PICs straightforward.

Abstract: A photonic component having a photonically integrated chip and a fibre mounting, wherein the fibre mounting has: at least one groove, into which an optical fibre is placed, and at least one mirror surface, which reflects radiation from the fibre in the direction of the photonically integrated chip and/or reflects radiation from the photonically integrated chip in the direction of the fibre. A chip stack comprising at least two chips is arranged between the photonically integrated chip and the fibre mounting, the chip stack has at least two through holes and in each case a guide pin, which positions the chip stack and the fibre mounting relative to one another, passes through the at least two through holes of the chip stack.

Abstract: A connector for a system circuit board or a power module is provided. The connector includes a main body and an optical connection mechanism. The main body includes a first connecting terminal and a second connecting terminal. The first connecting terminal and the second connecting terminal are power contacts or signal contacts. The optical fiber connection mechanism is embedded within the main body. The optical fiber connection mechanism is disposed between the first connecting terminal and the second connecting terminal. Since the optical fiber connection mechanism is embedded within the main body, it is not necessary to specifically remove the optical fiber cable when the power module is detached from the cabinet. Moreover, the appearance of the product is more aesthetically-pleasing, and the maintaining speed and the product reliability are increased.

Abstract: The present disclosure relates to a process by which an optical fiber array or a single optical fiber is cleaved with a laser-cleaving apparatus. The coating material is stripped or removed from a section of an optical fiber array or single optical fiber; a coated or ribbonized section of the optical fiber array or the single optical fiber is secured in a holder; the holder is aligned inside the laser-cleaving apparatus; the laser cleaves the stripped ends of the fibers in the optical fiber array or the single optical fiber; the laser-cleaved ends of the optical fiber(s) are then mechanically separated to remove the free ends from the optical fibers in the optical fiber array or the single optical fiber, leaving a cleaved array of optical fibers or a single cleaved optical fiber. The cleaving process enables the optical fiber array or single optical fiber to be cleaved at flexible locations along an optical fiber ribbon, optical fiber, or optical fiber apparatus (e.g.

Abstract: An optical fiber connector assembly comprises at least one connector having a latching arm for coupling to an adapter, and a remote release tab having a protrusion configured to cooperate with the adapter to depress said latching arm when the remote release tab is pulled relative to the adapter. The optical fiber connector assembly may further be configured to allow reversing its polarity.

Abstract: Integrated optical devices and methods of forming the same are disclosed. A method of forming an integrated optical device includes the following steps. A substrate is provided. The substrate includes, from bottom to top, a first semiconductor layer, an insulating layer and a second semiconductor layer. The second semiconductor layer is patterned to form a waveguide pattern. A surface smoothing treatment is performed to the waveguide pattern until a surface roughness Rz of the waveguide pattern is equal to or less than a desired value. A cladding layer is formed over the waveguide pattern.

Abstract: A pulsed light generation device, includes: a first optical fiber through which first pulsed light and second pulsed light, having an intensity that decreases while an intensity of the first pulsed light increases, and increases while the intensity of the first pulsed light decreases, having been multiplexed and entered therein, are propagated; and a second optical fiber at which the first pulsed light, having exited the first optical fiber and entered therein, is amplified while being propagated therein, wherein: at the first optical fiber, phase modulation occurs in the first pulsed light due to cross phase modulation caused by the second pulsed light; and self-phase modulation occurring in the first pulsed light at the second optical fiber is diminished by the phase modulation having occurred at the first optical fiber.

Abstract: An optical fiber cable includes a central tube having a first inner and a first outer surface. The first inner surface defines a bore along a longitudinal axis of the cable. Optical fibers are disposed within the bore of the central tube. A cable jacket is disposed around the central tube. The cable jacket has a second inner and a second outer surface defining a first thickness. A skin layer is disposed around the cable jacket. The skin layer has a third inner and a third outer surface defining a second thickness that is 100 ?m or less. The cable jacket material is different from the skin layer material, and the third outer surface defines the outermost surface of the optical fiber cable. Access sections made of the second material extend from the skin layer into the first thickness of the cable jacket.