Abstract: The present disclosure relates to a process by which an optical fiber array is cleaved with a laser-cleaving apparatus. The coating material is stripped or removed from a section of an optical fiber array; a coated or ribbonized section of the optical fiber array is secured in a holder; the holder is aligned inside the laser-cleaving apparatus; the laser cleaves the stripped ends of the fibers in the optical fiber array; the laser-cleaved ends of the optical fibers are then mechanically separated to remove the free ends from the optical fibers in the optical fiber array, leaving a cleaved array of optical fibers. The cleaving process enables the optical fiber array to be cleaved at flexible locations along an optical fiber ribbon or optical fiber cable with no swelling, minimal cleave angle variation across the cores of the optical fibers, a controlled surface roughness of the optical fiber end-faces, and high process yield.

Abstract: The present invention relates to an optical fiber device for removing cladding light, an apparatus and a method for etching the same.

Abstract: The present disclosure describes fusion spliced cable assemblies.

Abstract: A break-out assembly includes an enclosure defining a first port at the first end to receive an optical cable and a second port at the second end to receive a plurality of break-out cables. Each port leads to the interior of the enclosure. A cable retention region defined within the enclosure at the second end is configured to enable the break-out cables to each secure to the enclosure at one of a plurality of axial locations. Certain types of break-out assemblies include other cable retention regions to axially and/or rotationally secure the optical cable to the enclosure. A splice retention region is disposed within the enclosure between the first port and the second cable retention region. The splice retention region receives optical splices at which optical fibers of the optical cable are spliced to optical fibers of the break-out cables.

Abstract: An optically traceable patch cord includes a cable extending from a first connector at a first end to a second connector at a second end. A trace assembly in the cable is located between the first end of the cable and the second end of the cable. An optical tracing fiber extends from the trace assembly to one of the first connector and the second connector.

Abstract: A fiber optic tray system includes a tray. The tray includes a tray body, the tray body extending along a longitudinal axis between a front and a rear and extending along a lateral axis between a first side and a second side. The tray further includes a plurality of alignment rails, each of the plurality of alignment rails protruding from the tray body along a transverse axis. The tray further includes a plurality of retainer features disposed at the rear of the tray body. The fiber optic tray system further includes a fiber optic module, the fiber optic module including an outer housing and at least one retainment feature. The at least one retainment feature is interfaced with at least one of the plurality of retainer features to retain the fiber optic module on the tray.

Abstract: In some implementations, a fiber optic combiner may comprise an enclosing tube having a geometric shape and multiple optical fibers bundled within the enclosing tube. In some implementations, the multiple fibers comprise at least one optical fiber having a core and a non-circular cladding surrounding the core. The non-circular cladding may cause the multiple optical fibers to have a larger tube fill factor and a lower expected beam parameter product increase factor relative to the multiple optical fibers all having circular claddings.

Abstract: A layer of amorphous Ge is formed on a substrate using electron-beam evaporation. The evaporation is performed at room temperature. The layer of amorphous Ge has a thickness of at least 50 nm and a purity of at least 90% Ge. The substrate is complementary metal-oxide-semiconductor (CMOS) compatible and is transparent at Long-Wave Infrared (LWIR) wavelengths. The layer of amorphous Ge can be used as a waveguide in chemical sensing and data communication applications. The amorphous Ge waveguide has a transmission loss in the LWIR of 11 dB/cm or less at 8 ?m.

Abstract: Optical modulators are described having a Mach-Zehnder interferometer and a pair of RF electrodes interfaced with the Mach-Zehnder interferometer in which the Mach-Zehnder interferometer comprises optical waveguides formed from semiconductor material. The optical modulator additionally comprises a plurality of phase shifters configured to interface with the plurality of interconnected optical waveguides such that at least one phase shifter of the plurality of phase shifters is interfaced with at least one optical waveguide of the plurality of interconnected optical waveguides. A phase shifter controller, including an energy source with a variable output controlled by the controller and a plurality of electrical connections connecting the energy source to each of the plurality of phase shifters, is also included. In various embodiments, the plurality of electrical connections are configured to provide approximately equal power to each of the phase shifting elements from the energy source.

Abstract: An optical fiber comprises a glass fiber comprising a core and a cladding, a primary resin layer being in contact with the glass fiber and covering the glass fiber, and a secondary resin layer covering the primary resin layer, wherein the secondary resin layer consists of a cured product of a resin composition comprising a base resin containing a urethane (meth)acrylate oligomer, a monomer, and a photopolymerization initiator and hydrophobic inorganic oxide particles, the content of the inorganic oxide particles is 1% by mass or more and 60% by mass or less based on the total amount of the resin composition, and the glass transition temperature of the secondary resin layer is 60° C. or more and 120° C. or less.

Abstract: An opto-electric hybrid board connector includes an opto-electric hybrid board extending along a transmission direction of light in an optical waveguide, and a connector to which an attached region of the opto-electric hybrid board is attached. The attached region has a board front end surface for inputting and outputting light to and from the optical waveguide. The connector has a connector front end surface disposed to be flush with the board front end surface. The surface roughness SRa1 of the board front end surface is 0.2 ?m or more and 3 ?m or less. A difference D between the surface roughness SRa1 of the board front end surface and the surface roughness SRa2 of the connector front end surface is 1 ?m or less.

Abstract: The present disclosure provides an intermittently bonded optical fibre ribbon. The intermittently bonded optical fibre ribbon includes a plurality of optical fibres. The plurality of optical fibres has bonded regions and un-bonded regions between adjacent optical fibres of the plurality of optical fibres. The bonded regions have a plurality of bonds. Each bonded region has a bond of the plurality of bonds joining the adjacent optical fibres such that the bond does not cover a top optical fibre region and a bottom optical fibre region of the plurality of optical fibres.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.

Abstract: A photonic integrated circuit including first and second opto-electronic devices that are fabricated on a semiconductor wafer having an epitaxial layer stack including an n-type indium phosphide-based contact layer that is provided with at least one selectively p-type doped tubular-shaped region for providing an electrical barrier between respective n-type contact regions of the first and second opto-electronic devices that are optically interconnected by a passive optical waveguide that is fabricated in a non-intentionally doped waveguide layer including indium gallium arsenide phosphide, the non-intentionally doped waveguide layer being arranged on top of the n-type contact layer, wherein a first portion of the at least one selectively p-type doped tubular-shaped region is arranged underneath the passive optical waveguide between the first and second opto-electronic devices. An opto-electronic system including the photonic integrated circuit.

Abstract: An optical cable includes a plurality of buffer tubes, each of the buffer tubes includes a flexible ribbon, the flexible ribbon including a plurality of optical fibers, the flexible ribbon being wrapped with a finished tape.

Abstract: A microstructured multicore optical fibre (MMOF) includes a cladding in which a plurality of basic cells are formed that run along the MMOF. Each of the basic cells includes a core, and at least one of the basic cells is surrounded by a plurality of longitudinal areas that run parallel to the core along the MMOF and are arranged in a hexagonal arrangement around the core. The longitudinal areas are spaced by a lattice constant ?. Sides of the hexagon can be shared with adjacent basic cells.

Abstract: The method provided by the present disclosure is for performing curing during manufacturing of an optical fibre ribbon. The method of the present disclosure performs a first stage of curing and a second stage of curing 200 on a matrix material of the optical fibre ribbon. The first stage of curing is performed using a ribbon die and one or more ultraviolet light emitting diode (UV LED) units. Further, the second stage of curing is performed using a source of the one or more ultraviolet lamps (UV lamps) in an UV chamber.

Abstract: The present disclosure provides a method for stacking of a plurality of optical fibre ribbons (106). The plurality of optical fibre ribbons (106) is defined by a top surface (S1) and a bottom surface (S2). The top surface (S1) and bottom surface (S2) are defined by a plurality of elevated regions and a plurality of groove regions. The method for stacking of the plurality of optical fibre ribbons (106) includes arranging the plurality of optical fibre ribbons (106) over each other such that the plurality of elevated regions of each of the plurality of optical fibre ribbons fits over the plurality of groove regions of an adjacent optical fibre ribbon of the plurality of optical fibre ribbons (106). In addition, arrangement of the plurality of optical fibre ribbons forms an optical fibre ribbon stack (200).

Abstract: An MCF having a structure excellent in mass productivity and suppressing increases in splicing cost and loss are provided. The MCF includes 12 or 16 cores, a cladding, and a coating. The cores are arranged at positions of line symmetry while no adjacent relationship is established between the cores having an adjacent relationship with any core. A coating diameter is 235-265 ?m, a cladding diameter CD is from CDnominal?1 ?m to CDnominal+1 ?m with a nominal value CDnominal of 195 ?m or less, an MFD at 1310 nm is from MFD-reference-value?0.4 ?m to the MCF-reference-value+0.4 ?m with the MFD-reference-value of 8.2-9.2 ?m, and a 22 m-cable-cutoff wavelength ?cc is 1260-1360 nm. A core's zero-dispersion wavelength is a wavelength-reference-value?12 nm to the wavelength-reference-value+12 nm with the wavelength-reference-value of 1312-1340 nm, and a dispersion slope at the wavelength is 0.092 ps/(nm2·km) or less.

Abstract: In various embodiments, the beam parameter product and/or beam shape of a laser beam is adjusted by coupling the laser beam into an optical fiber of a fiber bundle and directing the laser beam onto one or more in-coupling locations on the input end of the optical fiber. The beam emitted at the output end of the optical fiber may be utilized to process a workpiece.