Abstract: A ceramic ring for supporting a wafer, comprising: a body; and an annular recess provided in the center of the body, the annular recess having a bottom surface and a buffer portion extending upwards from the bottom surface to the surface of the body. The ceramic ring can ensure reliability in positioning the wafer, and can prevent the edge side of the wafer from generating particles by contacting the ceramic ring.

Abstract: A wet type processing apparatus includes a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid; a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having plural holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the holes.

Abstract: A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece corresponding to a discharge part with the fluid. The air in the workpiece is removed in advance, thereby filling the workpiece with the discharged fluid. A fluid discharge device in which, at one end of a discharge head, a suction port for sucking air in the mask on the workpiece, and a fluid discharge device having a discharge nozzle formed thereon for discharging the fluid are formed is used.

Abstract: A mask and a method of manufacturing a mask assembly, the mask including a body, and the body including one end and another end facing each other in a length direction and having a first surface and a second surface facing each other in a thickness direction; and a pattern region between the one end and the other end, the pattern region including a plurality of pattern holes and a plurality of ribs between the plurality of pattern holes, wherein a curl value of the mask, which is defined as a shortest distance from a plane tangent to a center of the body to the one end or the other end of the body, is 1,000 ?m to 4,000 ?m.

Abstract: A protective collar for temporarily protecting an item from paint on a surface that is being painted. The protective collar is formed as a band having a convex surface and a concave surface. The band has a uniform thickness between the convex surface and the concave surface in the primary areas that are not tapered. The band embodies a spring bias that biases the band into a circular configuration. The first end and the second end of the band are tapered. Additionally, the band is tapered along its length adjacent a first long edge. This causes the first long edge to be thinner than the opposite second long edge. The tapered regions minimize the footprint of the spring collar on a surface.

Abstract: Disclosed is a method of spraying a surface with a set-delayed cement. The method comprises providing a set-delayed cement composition comprising water, pumice, hydrated lime, and a set retarder; spraying a surface with the set-delayed cement composition; and allowing the set-delayed cement composition to set on the surface.

Abstract: A precleaning chamber (100, 200, 300) and a plasma processing apparatus, comprising a cavity (20) and a dielectric window (21, 21?) disposed at the top of the cavity (20), a base (22) and a process assembly (24) surrounding the base (22) are disposed in the precleaning chamber (100, 200, 300), and the base (22), the process assembly (24) and the dielectric window (21, 21?) together form a process sub-cavity (211) above the base (22); and a space of the cavity (20) located below the base (22) is used as a loading/unloading sub-cavity (202), the precleaning chamber (100, 200, 300) further comprises a gas is device (32), the gas inlet device (32) comprises a gas inlet (323), and the gas inlet (323) is configured to directly transport a process gas into the process sub-cavity (211) from above the process assembly (24).

Abstract: A raw material gas supply apparatus includes a raw material container, a carrier gas inlet line and a raw material gas line. The raw material container is configured to accommodate the solid raw material. The carrier gas inlet line is configured to discharge the carrier gas to the raw material gas originated from the solid raw material. The raw material gas is transferred to the consumption area together with the carrier gas through the raw material gas line. A flow rate of the carrier gas is set such that a variation rate of a gas flow rate of the raw material gas flowing in the raw material gas line obtained by subtracting a gas flow rate in the carrier gas inlet line from a gas flow rate in the raw material gas line becomes 10% or less.

Abstract: A vaporization system without a pressure sensor including: a vaporizer that vaporizes the liquid material; a supply amount controller that controls the supply amount of the liquid material to the vaporizer; a flow rate regulation valve that regulates the flow rate of vaporized gas produced by the vaporizer; a flow rate sensor that measures the flow rate of the vaporized gas; and a valve control part that outputs a drive signal to the flow rate regulation valve to control a valve opening level so that a measured flow rate measured by the flow rate sensor becomes equal to a predetermined set flow rate, is adapted to acquire a drive signal value that is a value indicated by the drive signal; and output a control signal to the supply amount controller on the basis of the drive signal value and control the supply of the liquid material.

Abstract: An ejector for jetting droplets of viscous media onto a substrate is disclosed. The ejector comprises a jetting nozzle having a nozzle space and a nozzle outlet, and an impacting device for impacting a volume of the viscous medium in the nozzle space such that droplets of viscous medium is jetted from the nozzle space through the nozzle outlet towards the substrate. The ejector also comprise a sensor arrangement arranged after the jetting nozzle in the jetting direction, wherein the sensor arrangement is adapted to detect a jetted droplet of viscous medium passing thereby.

Abstract: An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e.g., without unintended gaps or holes) while providing for variable volume and, thus, contributes to variable ink/material buildup to achieve desired thickness. The ink is jetted as liquid or aerosol that suspends material used to form the material layer, for example, an organic material used to form an encapsulation layer for a flat panel device. The deposited layer is then cured or otherwise finished to complete the process.

Abstract: A surface treating apparatus that suppresses occurrence of defects is provided. A treatment solution is accumulated in a tank 15 through a treatment solution collecting port/air discharging port 13 in a lower portion of a body 4. An air heated by the treatment solution flows toward an upper portion (portion without the treatment solution) of the tank 15 via the treatment solution collecting port/air discharging port 13 in the lower portion of the body 4, and is discharged via an exhaust duct 17. In this way, the air that is heated and tends to flow upward in the body 4 is discharged from the lower portion thereof and is replaced with an external air from the upper portion thereof. Accordingly, the air in the body 4 can be maintained at a uniform temperature. Thus, the treatment solution that reaches a lower portion of a substrate 54 from an upper portion thereof can be maintained at a uniform temperature.

Abstract: A shaping air spurting member (9) is formed in a tubular shape by using a conductive material, and is arranged on an outer peripheral side of a rotary atomizing head (4) in a state where a front end thereof is positioned in an intermediate section of the rotary atomizing head (4) in a length direction. The shaping air spurting member (9) has a front surface section (9D) that is provided with many numbers of air spurting holes (10, 12) for spurting shaping air toward paint particles sprayed from the rotary atomizing head (4). In addition, a shield member (14) composed of an annular body extending radially is provided on an outer diameter side of the front surface section (9D) in the shaping air spurting member (9) to shield electric flux lines traveling toward the rotary atomizing head (4) from each of electrodes (6C) in an external electrode member (6).

Abstract: A system that reduces the amount of water that enters a process chamber via a movable shaft is disclosed. The surface of the shaft is made hydrophobic. Any water droplets that are collected on the hydrophobic shaft are disposed at a high contact angle, making it more likely that these water droplets fall from the shaft. Further, any water that enters the process chamber is more readily removed from the shaft due to the lower energy of liberation. Reducing the amount of water in a process chamber may improve the lifetime of the components in the process chamber and may improve the yield of the workpieces being processed. This may be especially relevant when process gasses that contain halogens are employed.

Abstract: A technique capable of preventing by-products from adhering to a lower portion of a process vessel utilizes a substrate processing apparatus including: a process vessel having a process chamber; a lid configured to close a lower end opening of the process vessel; a substrate retainer; an insulating structure; a process gas supply mechanism configured to supply a process gas; a purge gas supply unit configured to supply a purge gas to a lower region of the process vessel via a gap between the insulating structure and the lid; and a restrictor disposed in the gap. The restrictor regulates flow of the purge gas such that the flow rate of the purge gas supplied to a first portion of the lower region of the process vessel is greater than a flow rate of the purge gas supplied to a second portion of the lower region of the process vessel.

Abstract: There is provided a film forming apparatus for performing a film forming process on substrates by heating the substrates while the substrates are held in a shelf shape by a substrate holder in a vertical reaction container. The film forming apparatus includes: an exhaust part configured to evacuate the reaction container; a gas supply part configured to supply a film forming gas into the reaction container; a heat insulating member provided above or below an arrangement region of the substrates to overlap with the arrangement region and configured to thermally insulate the arrangement region from an upper region above the arrangement region or a lower region below the arrangement region; and a through-hole provided in the heat insulating member at a position overlapping with central portions of the substrates to adjust a temperature distribution in a plane of each substrate held near the heat insulating member.

Abstract: An orifice plate having orifice openings is interposed between a roller body and a side plate. In a closed region of an outer peripheral surface of the roller body which is covered with a base material, the base material is held on the outer peripheral surface of the roller body under suction by a negative pressure developed in suction holes. In an open region of the outer peripheral surface which is not covered with the base material, the sucking of a gas from an exterior space into the roller body is suppressed because it is difficult for the gas to pass through the orifice openings. This suppresses a reduction in sucking force in the closed region due to the entry of the gas from the open region. The roller body, the orifice plate and the side plate rotate as a unit. This suppresses deterioration of the members due to the slidable movement thereof.

Abstract: A fixture for masking a gas turbine engine blade, the blade having a root, a platform and an airfoil, the platform having inner and outer surfaces and peripheral faces extending between the surfaces, the fixture including a base with a receptacle for receiving the root of the blade; a removable sidewall mountable to the base to form a masking box with the receptacle that shields the root; a first removable Z plane detail mountable to the base, the first removable Z plane detail providing a first electrical contact point to the root; and a second removable Z plane detail mountable to the removable sidewall, the second removable Z plane detail providing a second electrical contact point to the root.

Abstract: Disclosed are a mask frame, for mask frame manufacturing method and mask. The mask frame includes a main frame and shielding bars, an evaporation-deposition area penetrating the main frame in a thickness direction being formed on the main frame, the main frame being provided with pairs of first receiving slots, the two first receiving slots in each pair being located on both sides of the evaporation-deposition area in a first direction, respectively, each shielding bar corresponding to a pair of first receiving slot, two ends of shielding bars being disposed within corresponding two first receiving slots, respectively. The mask frame comprises at least one pair of first positioning holes, each pair of which corresponds to one pair of first receiving slots, and the two first positioning holes in each pair correspond to positions of the two first receiving slots in a corresponding pair, respectively.

Abstract: A photolithography system includes a variable-volume buffer tank, a dispensing system connected to the buffer tank, and a valve configured to release gas from a head space of the buffer tank while blocking the release of liquid from the head space. A storage container has an opening at the bottom and drains to the buffer tank through that opening. The buffer tank has a storage capacity sufficient to receive the full contents of the storage container. The system supplies chemical solutions to the dispensing system while keeping the chemical solutions from contact with air and other gases.