Patents Examined by John Bedtelyon
  • Patent number: 12656550
    Abstract: One embodiment of the present disclosure relates to an optical fiber alignment method that enables highly accurate alignment of an optical fiber without applying a complicated driving system. The alignment method includes finely aligning the first and second optical fibers and finely aligning. Roughly aligning the first and second optical fibers based on a result of end-surface observation. Finely aligning the first and second optical fibers based on a result of side-surface observation in such a manner as to increase an optical coupling efficiency between each pair of the cores in the first and second optical fibers.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: June 16, 2026
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tetsu Morishima, Shintaro Mouri, Soichi Endo, Akinori Kimura
  • Patent number: 12656555
    Abstract: A combinable optical-fiber adapter assembly includes combinable optical-fiber adapters. A first optical-fiber adapter of the adapters has first connection units. A second optical-fiber adapter of the adapters has second connection units. The first connection units are assembled with the second connection units. In a one-to-one manner, the first connection unit on the front portion of the outer side surface of the first adapter body is docked with the second connection unit on the front portion of the outer side surface of the second adapter body adjacent to the first adapter body, and the first connection unit on the rear portion of the outer side surface of the first adapter body is docked with the second connection unit on the rear portion of the outer side surface of the second adapter body adjacent to the first adapter body, so that two adjacent optical-fiber adapters can be assembled side-by-side.
    Type: Grant
    Filed: June 5, 2023
    Date of Patent: June 16, 2026
    Assignee: ACON OPTICS COMMUNICATIONS INC.
    Inventors: Yang-Yang Cui, Rui Zhang
  • Patent number: 12650555
    Abstract: A hollow core fiber is provided. The hollow core fiber includes at least one cleaved fiber end-face and a dielectric coating. The dielectric coating is formed by a passivation layer of dielectric that is applied to the at least one cleaved fiber end-face such that a portion of an interior surface that defines a hollow core of the hollow core fiber adjacent to the at least one cleaved fiber end-face is coated with the dielectric coating.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: June 9, 2026
    Assignee: Honeywell International Inc.
    Inventors: Teresa Marta, Karl D. Nelson
  • Patent number: 12613445
    Abstract: An optical angle modulator includes: a first unit configured to generate first angle-modulated light and second angle-modulated light by performing angle modulation on continuous light using an electrical signal; and a second unit configured to generate third angle-modulated light by causing partially degenerate four-wave mixing of the first and second angle-modulated lights. A frequency band of the first angle-modulated light and a frequency band of the second angle-modulated light are different, and an angle of the second angle-modulated light decreases due to the electrical signal while an angle of the first angle-modulated light is increasing due to the electrical signal, and the angle of the second angle-modulated light increases due to the electrical signal while the angle of the first angle-modulated light is decreasing due to the electrical signal.
    Type: Grant
    Filed: November 22, 2023
    Date of Patent: April 28, 2026
    Assignee: KDDI CORPORATION
    Inventor: Shota Ishimura
  • Patent number: 12578539
    Abstract: Disclosed are apparatus and methods for optical coupling in optical communications. In one embodiment, an apparatus for optical coupling is disclosed. The apparatus includes: a planar layer; an array of scattering elements arranged in the planar layer at a plurality of intersections of a first set of concentric elliptical curves crossing with a second set of concentric elliptical curves rotated proximately 90 degrees to form a two-dimensional (2D) grating; a first taper structure formed in the planar layer connecting a first convex side of the 2D grating to a first waveguide; and a second taper structure formed in the planar layer connecting a second convex side of the 2D grating to a second waveguide. Each scattering element is a pillar into the planar layer. The pillar has a top surface whose shape is a concave polygon having at least 6 corners.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: March 17, 2026
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chan-Hong Chern, Min-Hsiang Hsu
  • Patent number: 12571962
    Abstract: An optical phased array chip, including optical splitting stages with the number being N. Each of the optical splitting stages includes optical waveguide branches; a first end of a first thermal-optic phase shifter is connected to a preset voltage, a first end of a second thermal-optic phase shifter is grounded, and in a common optical waveguide branch, a second end of the first thermal-optic phase shifter and a second end of the second thermal-optic phase shifter are connected to a common voltage, and the first thermal-optic phase shifter and the second thermal-optic phase shifter have the same resistance. When N is greater than 1, the number of optical waveguide branches in a next optical splitting stage is twice the number of optical waveguide branches in a previous optical splitting stage. A method for controlling an optical phased array chip and a waveguide optical phased array system are also provided.
    Type: Grant
    Filed: May 23, 2025
    Date of Patent: March 10, 2026
    Assignee: SILITH TECHNOLOGY (SUZHOU) CO., LTD.
    Inventor: Xingyu Zhang
  • Patent number: 12554082
    Abstract: The module device assemblies and systems described herein provide for increased cooling airflow through electronic devices via airflow channels. The module device assemblies also prevent radiation or other noise from emitting through the device assemblies using electromagnetic compatibility (EMC) shields.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: February 17, 2026
    Assignee: Cisco Technology, Inc.
    Inventors: Joseph F. Jacques, Mark C. Nowell
  • Patent number: 12554081
    Abstract: Certain embodiments of the present disclosure are directed towards an optical assembly such as a multiplexers/demultiplexers (MDM). One example optical assembly generally includes: a fiber array configured to provide an optical signal with a plurality of wavelengths; optical wavelength filters configured to separate the plurality of wavelengths into respective optical signals; a lens array configured to receive the respective optical signals from the optical wavelength filters and focus the respective optical signals before reaching an optical interface for a photonic chip; and a birefringent crystal disposed between the lens array and the optical interface.
    Type: Grant
    Filed: May 10, 2023
    Date of Patent: February 17, 2026
    Assignee: Cisco Technology, Inc.
    Inventor: Roman Bruck
  • Patent number: 12553768
    Abstract: A pipe segment for use in construction of a pipeline comprising a pipe body and a sensing nerve network that is embedded in or coupled to the pipe body and is configured to monitor a condition of the pipe segment in real-time. The sensing nerve network comprises plastic optical fiber (POF) nerves and a nanomaterial coating covering a span of the plastic optical fiber nerves, the coating having an approximately constant diameter and the nanomaterial having a property that changes in the presence of a targeted gas, enabling detection of the targeted gas along the length of the optical fiber nerves.
    Type: Grant
    Filed: March 22, 2023
    Date of Patent: February 17, 2026
    Assignee: Saudi Arabian Oil Company
    Inventors: Ali Alshehri, Nada Alruwaii
  • Patent number: 12554080
    Abstract: A photonic assembly includes: a composite die including a photonic integrated circuits (PIC) die and an electronic integrated circuits (EIC) die, the PIC die including waveguides and photonic devices therein, and the EIC die including semiconductor devices therein; an optical connector unit including a first connector-side mirror reflector and a first transition edge coupler and attached to a top surface of the composite die, wherein the first connector-side mirror reflector is configured to change a beam direction between a vertically-extending beam path through the composite die and a horizontally-extending beam path through the first transition edge coupler; and a fiber array units assembly attached to a sidewall of the optical connector unit.
    Type: Grant
    Filed: November 12, 2023
    Date of Patent: February 17, 2026
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chen-Hua Yu, Hsing-Kuo Hsia, Chih-Wei Tseng, Jiun Yi Wu, Szu-Wei Lu, Jui Lin Chao
  • Patent number: 12546962
    Abstract: An optical connector has a first connection end configured to fit with a peer adapter. The electrical connector has a second connection end configured to fit with the peer adapter. The first connection end and the second connection end have a same opening direction. In addition, the first connection end may slide along a plugging direction of the peer adapter relative to the second connection end. The first connection end is configured to be connected to the peer adapter before the second connection end. The optical connector is connected to the peer adapter before the electrical connector. This ensures that a channel for transmitting an optical signal is communicated before a channel for transmitting an electrical signal is communicated, thereby avoiding fiber burning and improving security and reliability of the opto-electronic adapter during use.
    Type: Grant
    Filed: August 25, 2023
    Date of Patent: February 10, 2026
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zhongxing Wang, Bo Yan, Fei Yu, Le Liu
  • Patent number: 12546934
    Abstract: In one embodiment, an optical fiber includes an inner core having a core refractive index delta and profile shape parameter ? in the range of 1.8 to 2.6, including endpoints, and a cladding layer surrounding the inner core. The cladding layer includes an inner cladding segment having an inner refractive index delta, a trench segment having a trench refractive index delta, and an outer cladding segment having an outer refractive index delta. The optical fiber further includes a coating layer surrounding the cladding layer and having a thickness of less than 30 ?m and a modulus greater than or equal to 0.5 GPa.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: February 10, 2026
    Assignee: CORNING RESEARCH & DEVELOPMENT CORPORATION
    Inventors: Ming-Jun Li, Qi Wu
  • Patent number: 12541065
    Abstract: A photonic integrated circuit (PIC) includes photonic components fabricated on the PIC. One of the photonic components includes an optical coupler configured to optically couple to an optical component. The optical coupler includes waveguide elements arranged in a 2-dimensional array that is configured to provide a first mode having a first shape chosen to match a second shape of a second mode of the optical component.
    Type: Grant
    Filed: March 1, 2023
    Date of Patent: February 3, 2026
    Assignee: Marvell Asia Pte Ltd
    Inventors: Samira Karimelahi, Masaki Kato
  • Patent number: 12529846
    Abstract: Structures for an edge coupler and methods of forming a structure for an edge coupler. The structure comprises a substrate, a dielectric layer over the substrate, and a waveguide core over the substrate. The structure further comprises an airgap that extends at least partially through the dielectric layer and that surrounds a plurality of sides of a portion of the waveguide core.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: January 20, 2026
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Ravi Prakash Srivastava, Yusheng Bian, Shesh Mani Pandey, Vibhor Jain
  • Patent number: 12523503
    Abstract: A spectral interrogation device, including: an optical source for emitting a light signal, a measurement optical fibre comprising a series of successive Bragg gratings for reflecting the light signal in different wavelength bands, a reflective optical fibre comprising a total reflection element, a wavelength detector, and an optical switch for switching between a sequence of three operating modes. In a first mode, the light signal emitted by a given optical source is guided from the optical source to a corresponding measurement optical fibre. In a second mode, the light signal is guided to make a predetermined number of return trips in a line formed by a coupling between the measurement optical fibre and a corresponding reflective optical fibre, generating a predetermined delay between the successive gratings. In a third mode, the light signal is guided to a corresponding detector to successively measure the wavelength bands associated with the gratings.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: January 13, 2026
    Assignee: SAFRAN
    Inventors: Nassim Salhi, Minh Chau Phan Huy
  • Patent number: 12526048
    Abstract: A method includes: a first device sends a first data frame to a second device, where the first data frame includes an LFMS a1; the first device receives a mixed signal, where the mixed signal includes a first reflected data frame of the first data frame and a second data frame sent by the second device; the first device obtains a first offset based on the LFMS a1 in the first reflected data frame, and obtains a reconstructed data frame of the first reflected data frame based on the first data frame; and the first device eliminates the reconstructed data frame of the first reflected data frame from the mixed signal based on the first offset.
    Type: Grant
    Filed: September 8, 2023
    Date of Patent: January 13, 2026
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: You Wang, Wei Li, Shengwen Feng, Qiang Guo
  • Patent number: 12504656
    Abstract: An optical waveguide element includes a substrate, an optical waveguide disposed inside the substrate or on the substrate, and an electrode provided along the optical waveguide, working on the optical waveguide to generate a phase change in a light wave propagating through the optical waveguide. The electrode is a traveling-wave electrode. In a modulation section where the light wave is controlled by the electrode, the electrode and the optical waveguide are configured so that the phase change generated in a first modulation section located within a predetermined distance range from a downstream side end portion along a propagation direction of a traveling wave of an electrical signal propagating through the electrode has a sign opposite to a sign of the phase change generated in a second modulation section located within a predetermined distance range from an input end of the electrical signal on an upstream side along the propagation direction.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: December 23, 2025
    Assignees: SUMITOMO OSAKA CEMENT CO., LTD., Naitonal Institute of Information and Communications Technology
    Inventors: Shingo Takano, Yu Kataoka, Satoshi Oikawa, Junichiro Ichikawa, Yuya Yamaguchi, Atsushi Kanno, Naokatsu Yamamoto, Tetsuya Kawanishi
  • Patent number: 12504654
    Abstract: An embodiment photonic device may include a first terminal including silicon and a second terminal including polysilicon. The first terminal may be configured as a first three-dimensional structure extending along a first direction and having a first U-shaped portion in a first cross-sectional plane perpendicular to the first direction. Similarly, the second terminal may be configured as a second three-dimensional structure extending along the first direction and having a second U-shaped portion in the first cross-sectional plane. The photonic device may further include a capacitor dielectric layer disposed between the first terminal and the second terminal and a cladding dielectric layer surrounding the first terminal and the second terminal. The first U-shaped portion and the second U-shaped portion may be arranged in an interlocking configuration having an overlapping region that is configured as an optical transmission line in which the first direction is an optical propagation direction.
    Type: Grant
    Filed: September 29, 2023
    Date of Patent: December 23, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Tien-Lin Shen, Ming Lee, Wei-Heng Lin, Hsing-Kuo Hsia, Chen-Hua Yu
  • Patent number: 12474202
    Abstract: An optical fiber-based sensing membrane includes at least one optical fiber, and a substrate. The at least one optical fiber is integrated in the substrate. The substrate includes a thickness and a material property that are specified to ascertain, via the at least one optical fiber and for a device that is contiguously engaged with a surface of the substrate, includes the substrate embedded in the device, or includes the surface of the substrate at a predetermined distance from the device, a thermal property or a mechanical property associated with the device, or a radiation level associated with a device environment.
    Type: Grant
    Filed: May 22, 2024
    Date of Patent: November 18, 2025
    Assignee: VIAVI SOLUTIONS INC.
    Inventors: Jeffery Stephen Graves, Vincent Lecoeuche, Andre Champavere
  • Patent number: 12461316
    Abstract: The present disclosure relates to enclosures, systems, methods, designs, and assemblies for converting (e.g., modifying, retrofitting, etc.) a first adapter mounting opening compatible with a first type of hardened fiber optic adapter to a second adapter mounting opening compatible with a second type of hardened fiber optic adapter.
    Type: Grant
    Filed: November 22, 2022
    Date of Patent: November 4, 2025
    Assignee: CommScope Technologies LLC
    Inventors: Marc De Mesmaeker, Neil Stewart Bird, Peter Stockmans