Abstract: Command/address and timing information is distributed to buffer integrated circuits on a module using multiple wavelengths of light modulated with the same information. Each individual wavelength of modulated light carrying command/address information is received by a corresponding single buffer device that deserializes the command/address information and communicates it electrically to memory devices(s). Likewise, each individual wavelength of modulated light carrying timing/synchronization/clock information is received by a corresponding single buffer device and used to synchronize accesses to the memory device(s). Thus, multiple buffer integrated circuits on a module each receive information from the CPU using different wavelengths of light transmitted on the same waveguide.

Abstract: A optical apparatus to display an image to a user is disclosed. The apparatus comprises an image source to generate an image bearing light beam having a first numerical aperture; and a diffuser screen. The diffuser screen is configured to increase the numerical aperture of the image bearing light beam to a second numerical aperture. The diffuser screen comprises a first part comprising: a first face and second face substantially parallel to each other, a first array of a plurality of waveguides forming an optical path between the first face and the second face. A value of an optical property of each of the plurality of waveguides is selected randomly from a set of values of the optical property. The first array of a plurality of waveguides is arranged such that each of the plurality of waveguides has an optical axis that is substantially parallel to it's nearest neighbour.

Abstract: An optical device, having at least first and second light-transmitting substrates, each having at least two external surfaces and an input aperture and an output aperture. The external surface of the first light-transmitting substrate is optically cemented to an external surface of the second light-transmitting substrate by an optical adhesive defining an interface plane. The refractive index of the optical adhesive is substantially lower than the refractive index of the first substrate. Part of the light waves entering the device through the input aperture and exiting the device through the output aperture impinge on the interface plane of the first substrate having incidence angles smaller than the critical angle. Another part of the light waves impinging on the interface plane have incidence angles higher than the critical angle. The interface plane is substantially transparent for the light waves impinging on interface plane having incidence angles smaller than the critical angle.

Abstract: An optical fiber-based sensing membrane includes at least one optical fiber and a substrate. The at least one optical fiber is integrated in the substrate. The optical fiber-based sensing membrane includes, based on a specified geometric pattern of the at least one optical fiber, an optical fiber-based sensing membrane layout. The substrate includes a thickness and a material property that are specified to ascertain, via the at least one optical fiber and based on the optical fiber-based sensing membrane layout, a thermal property or a mechanical property associated with a device, or a radiation level associated with a device environment.

Abstract: A server rack is cabled to obviate the need for top-of-rack switches. Switches and severs are connected through de-mateable connection interfaces at distribution modules disposed along the raceway above the server cabinets. The distribution modules may have externally accessible ports, internally accessible ports, and/or payout spools for the switch cables and/or the server cables.

Abstract: A method of using an integrated circuit includes monitoring a current between a first photodetector (PD) and an electronic circuit. The method further includes determining whether the monitored current is abnormal. The method further includes controlling a resonant structure to optically couple a first waveguide connected to the first PD to a second waveguide connected to a second PD, different from the first PD, in response to a determination that the monitored current is abnormal.

Abstract: A semiconductor package includes a first mold layer at least partially encasing at least one photonic integrated circuit. A redistribution layer structure is fabricated on the first mold layer, the redistribution layer structure including dielectric material and conductive structures. A second mold layer at least partially encasing at least one semiconductor chip is fabricated on the redistribution layer structure. The redistribution layer structure provides electrical pathways between the at least one semiconductor chip and the at least one photonic integrated circuit. One or more voids are defined in the second mold layer in an area above an optical interface of the at least one photonic integrated circuit such that light is transmittable through dielectric material above the optical interface.

Abstract: A multi-fiber, fiber optic connector may include a reversible keying arrangement for determining the orientation for plugging the connector into an adapter to thereby allow for a change in polarity of the connection to be made on site. The connector housing may be configured to engage with a removable key that may be engaged with the housing in at least two different locations to provide the plug-in orientation, or the housing may have slidably displaceable keys movable between multiple positions on the housing.

Abstract: An optical package comprising an optical die that is electrically coupled to a package substrate, and an optical interconnect adjacent the optical die. The optical interconnect comprises a first polarizing filter adjacent to a first lens, a second polarizing filter adjacent to a second lens; and a film comprising a magnetic material between the first polarizing filter and the second polarizing filter. The second polarizing filter is rotated with respect to the first polarizing filter and the magnetic material is to rotate a polarization vector of light incoming to the optical interconnect. An optical fiber interface port is immediately adjacent to the first lens. The second lens is immediately adjacent to an optical interface of the optical die.

Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.

Abstract: An optical multiplexing and demultiplexing method of the present disclosure includes arranging, face to face, a polished surface of a coated optical fiber whose side surface is polished to a core or a vicinity of the core and a polished surface of an optical waveguide whose propagation constant varies in a longitudinal direction and whose side surface is polished to a core or a vicinity of the core, and aligning the polished surface of the coated optical fiber and the polished surface of the optical waveguide so that desired branching ratio is obtained from one end of the coated optical fiber to the end, distal to the former end, of the optical waveguide by relatively moving the polished surface of the coated optical fiber and the polished surface of the optical waveguide.

Abstract: Disclosed is a nanoimprintable resin for use in optical waveguide applications. The nanoimprintable resin includes a base resin, metal oxide nanoparticles, and a photoinitiator. A cured film of the nanoimprintable resin exhibits a refractive index greater than or equal to 1.8 (589 nm), such as 1.9 (599 nm), according to ASTM D1218-21 at 25° C.

Abstract: An optical modulator includes a Mach-Zehnder interferometer including (i) a first optical waveguide including a first semiconductor junction diode, and (ii) a second optical waveguide including a second semiconductor junction diode. A semiconductor region connects the first and second semiconductor junction diodes such that a distance between the first and second optical waveguides is less than 2.0 ?m for at least a portion of a longitudinal direction of the optical modulator. In another aspect, a method of modulating an optical signal includes splitting input light into first and second optical transmission paths; modulating a phase difference between light in the first optical transmission path and light in the second optical transmission path without applying a bias voltage through an impedance less than 100 ohm between the first and second optical transmission paths; and combining light that is output from the first and second optical transmission paths.

Abstract: An optical beam scanning semiconductor device includes 1×N electrically controlled, integrated optical switch matrix and specifically designed integrated optical grating output couplers at each of N output waveguides of 1×N switch. By selecting one of the N outputs of the 1×N switch as the output of the input optical signal, an optical output beam scans in free space. Variation in the grating output coupler design enables a smart scanning device with multiple controllable beam characteristics.

Abstract: In one embodiment, an apparatus includes an upper cold plate and a lower cold plate, at least one of the upper cold plate or the lower cold plate comprising an electrical or optical path extending therethrough, a substrate and die package interposed between the upper cold plate or the lower cold plate, and a connector coupled to one of the upper cold plate or the lower cold plate for transmitting power or an optical signal through the electrical or optical path to the substrate and die package.

Abstract: A method of making a photonic integrated circuit (PIC) is provided. The method comprises depositing a functional resist material layer over a substrate, disposing and pressing a stamp with a plurality of nanopatterns into the functional resist material for a period of time, and removing the stamp from the functional resist material to provide nanofeatures that are inverted versions of the nanopatterns, wherein the nanofeatures form one or more optical elements.

Abstract: An optical scan device includes an optical waveguide array, including a plurality of optical waveguides each of which propagates light along a first direction, that emits a light beam, the plurality of optical waveguides being arranged in a second direction that intersects the first direction, a phase shifter array including a plurality of phase shifters connected separately to each of the plurality of optical waveguides, a control circuit that controls a phase shift amount of each of the plurality of phase shifters and/or inputting of light to each of the plurality of phase shifters and thereby controls a direction and shape of the light beam that is emitted from the optical waveguide array, a photodetector that detects the light beam reflected by a physical object, and a signal processing circuit that generates distance distribution data on the basis of output from the photodetector.

Abstract: An integrated on-chip polarization rotator splitter (26) comprises a waveguide polarization rotator (54) having a first and a second layer (62) that form a rib waveguide (66) together and are both made of silicon nitride. The first layer (62) has a first, a second and a third section. The first layer (64) has a first width (w1) that increases in the first section (S1), is constant in the second section (S1) and decreases in the third section (S3). The second layer (64) has a second width (w2) that continuously increases. The polarization rotator splitter (26) further includes a waveguide polarization splitter (61) comprising a first strip waveguide (71) and a second strip waveguide (72) that are separated by a gap (74). The first and second strip waveguides (71, 72) are also made of silicon nitride. The first and second strip waveguide (71, 72) form an asymmetric evanescent direction coupler.

Abstract: Disclosed is a coherent optical combining photonic integrated circuit that can detect and align light amplified by a scalable quantity of semiconductor optical amplifiers (SOAs). The light can be split into beams and amplified by individual SOAs in a PIC and combined via couplers in the PIC. The combined light can be measured using a photodetector and the light beams can be adjusted based the photodetector measurement to coherently combine the light to achieve high optical power from the photonic integrated circuit.

Abstract: An optical device including a waveguide, electrodes, and a connecting dielectric is described. The waveguide includes an electro-optic material having a waveguide optical refractive index and a waveguide microwave dielectric constant. The electrodes include a first electrode and a second electrode. The waveguide is between the first electrode and the second electrode. At least a portion of the connecting dielectric is between the waveguide and electrodes. The connecting dielectric has a microwave dielectric constant greater than the waveguide microwave dielectric constant.