Patents Examined by John Chu
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Patent number: 8080361Abstract: A positive photosensitive composition includes: a resin (A) whose dissolution rate in an alkaline developing solution increases by the action of an acid, the resin (A) containing an acid decomposable repeating unit represented by a general formula (I) and an acid nondecomposable repeating unit represented by a general formula (II); and a compound (B) capable of generating an acid upon irradiation with one of active rays and radiations: wherein Xa1 represents one of a hydrogen atom, an alkyl group, a cyano group, and a halogen atom, A1 represents one of a single bond and a divalent connecting group, ALG represents an acid leaving hydrocarbon group, Xa2 represents one of a hydrogen atom, an alkyl group, a cyano group, and a halogen atom, A2 represents one of a single bond and a divalent connecting group, and ACG represents an acid nonleaving hydrocarbon group.Type: GrantFiled: January 24, 2007Date of Patent: December 20, 2011Assignee: FUJIFILM CorporationInventors: Hyou Takahashi, Naoya Sugimoto, Kunihiko Kodama, Kei Yamamoto
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Patent number: 8080350Abstract: Disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (d1) an activated silicon compound and (d2) an aluminum complex. Also disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (C) a compound having two or more oxetanyl groups in one molecule and (D) a catalyst for accelerating the ring-opening reaction of the oxetanyl groups of the compound (C).Type: GrantFiled: November 17, 2006Date of Patent: December 20, 2011Assignee: Sumitomo Bakelite Company, Ltd.Inventors: Toshio Banba, Ayako Mizushima
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Patent number: 8076058Abstract: Compositions and methods for production of color images which are developable at desired wavelengths are disclosed and described. The color forming composition can include a color former which is a spiro dye. The color forming composition can include a radiation antenna admixed with or in thermal contact with the color former. The color forming composition can also be optimized for development using electromagnetic radiation having a selected development wavelength. The color forming compositions are useful in forming images on a wide variety of substrates such as optical disks.Type: GrantFiled: September 30, 2004Date of Patent: December 13, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventor: Makarand P. Gore
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Patent number: 8062826Abstract: A positive resist composition includes: (A) a resin capable of increasing the solubility in an alkali developing solution by the action of an acid, including: (a1) a repeating unit selected from repeating units represented by specific formulae (a1-1) to (a1-3); (a2) a repeating unit represented by a specific formula (a2); and (a3) a repeating unit selected from repeating units represented by specific formulae (a3-1) to (a3-4); (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation, (C) a resin including: at least one of a fluorine atom and a silicon atom; and a group selected from specific groups (x) to (z):(x) an alkali-soluble group, (y) a group capable of decomposing by the action of an alkali developing solution to increase the solubility in the alkali developing solution, and (z) a group capable of decomposing by the action of an acid; and (D) a solvent.Type: GrantFiled: March 28, 2008Date of Patent: November 22, 2011Assignee: FUJIFILM CorporationInventor: Shinichi Kanna
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Patent number: 8062830Abstract: The present invention provides a chemically amplified resist composition comprising: a resin (A) which contains no fluorine atom and a structural unit (a1) having an acid-labile group in a side chain, a resin (B) which contains a structural unit (b2) having a fluorine-containing group in a side chain and at least one structural unit selected from the group consisting of a structural unit (b1) having an acid-labile group, a structural unit (b3) having a hydroxyl group and a structural unit (b4) having a lactone structure in a side chain, and an acid generator, wherein the content of the structural unit (b1) based on the total units of the resin (B) is less than 10 mol %.Type: GrantFiled: April 17, 2009Date of Patent: November 22, 2011Assignee: Sumitomo Chemical Company, LimitedInventors: Yusuke Fuji, Junji Shigematsu, Takayuki Miyagawa, Nobuo Ando, Ichiki Takemoto
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Patent number: 8062829Abstract: A chemically amplified resist composition, comprising: a resin which includes a structural unit having an acid-labile group in a side chain, a structural unit represented by the formula (I) and a structural unit having a polycyclic lactone structure, and which is soluble in an organic solvent and insoluble or poorly soluble in an alkali aqueous solution but rendered soluble in an alkali aqueous solution by the action of an acid; and an acid generator represented by the formula (II). wherein X1 represents a hydrogen atom, a C1 to C4 alkyl group, etc., Y in each occurrence independently represent a hydrogen atom or an alkyl group, and n is an integer of 1 to 14, R1 to R4 independently represent a hydrogen atom, an alkyl group, etc., and A+ represents an organic counterion, E? represents CF3SO3—, C2F5SO3—, C4F9SO3—, etc., Y1 and Y2 independently represent a fluorine atom or a C1 to C6 perfluoroalkyl group.Type: GrantFiled: March 2, 2009Date of Patent: November 22, 2011Assignee: Sumitomo Chemical Company, LimitedInventors: Mitsuhiro Hata, Yusuke Fuji, Takayuki Miyagawa
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Patent number: 8062831Abstract: Carboxyl-containing lactone compounds having formula (1) are novel wherein R1 is H, F, methyl or trifluoromethyl, R2 and R3 are H or monovalent hydrocarbon groups, or R2 and R3 may together form an aliphatic ring, W is CH2, O or S, k1 is an integer of 0 to 4, and k2 is 0 or 1. They are useful as monomers to produce polymers which are transparent to radiation?500 nm. Radiation-sensitive resist compositions comprising the polymers as base resin exhibit excellent properties including resolution, LER, pattern density dependency and exposure margin.Type: GrantFiled: May 1, 2009Date of Patent: November 22, 2011Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Satoshi Shinachi, Tsunehiro Nishi, Koji Hasegawa, Takeshi Kinsho, Seiichiro Tachibana, Takeru Watanabe
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Patent number: 8057983Abstract: The present invention provides a chemically amplified resist composition comprising: a resin (A) which contains no fluorine atom and a structural unit (a1) having an acid-labile group in a side chain, a resin (B) which contains a structural unit (b2) having a fluorine-containing group in a side chain and at least one structural unit selected from the group consisting of a structural unit (b1) having an acid-labile group, a structural unit (b3) having a hydroxyl group and a structural unit (b4) having a lactone structure in a side chain, and an acid generator, wherein the amount of the resin (B) is 2 parts by weight or less per 100 parts by weight of the resin (A).Type: GrantFiled: April 17, 2009Date of Patent: November 15, 2011Assignee: Sumitomo Chemical Company, LimitedInventors: Yusuke Fuji, Junji Shigematsu, Takayuki Miyagawa, Nobuo Ando, Ichiki Takemoto
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Patent number: 8053158Abstract: Disclosed herein are compositions useful in forming organic active patterns that may, in turn, be incorporated in organic memory devices. The compositions comprise N-containing conjugated electroconductive polymer(s), photoacid generator(s) and organic solvent(s) capable of dissolving suitable quantifies of both the electroconductive polymer and the photoacid generator. Also disclosed are methods for patterning organic active layers formed using one or more of the compositions to produce organic active patterns, portions of which may be arranged between opposed electrodes to provide organic memory cells. The methods include directly exposing and developing the organic active layer to obtain fine patterns without the use of a separate masking pattern, for example, a photoresist pattern, thereby tending to simplify the fabrication process and reduce the associated costs.Type: GrantFiled: January 19, 2007Date of Patent: November 8, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Sang Kyun Lee, Won Jae Joo, Kwang Hee Lee, Tae Lim Choi, Myung Sup Jung
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Patent number: 8048609Abstract: A radiation-sensitive composition can be used to prepare positive-working imageable elements having improved sensitivity and solvent resistance. These elements are useful for making lithographic printing plates and printed circuit boards. The composition includes a water-insoluble polymeric binder that has at least 20 mol % of recurring units comprising hydroxyaryl carboxylic acid ester groups, some of which can be substituted with cyclic imide moieties.Type: GrantFiled: December 19, 2008Date of Patent: November 1, 2011Assignee: Eastman Kodak CompanyInventors: Moshe Levanon, Georgy Bylina, Vladimir Kampel, Larisa Postel, Marina Rubin, Tanya Kurtser
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Patent number: 8043788Abstract: To a resist composition comprising a polymer which changes its alkali solubility under the action of an acid as a base resin, is added a copolymer comprising recurring units containing amino and recurring units containing ?-trifluoromethylhydroxy as an additive. The composition is suited for immersion lithography.Type: GrantFiled: July 2, 2008Date of Patent: October 25, 2011Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tomohiro Kobayashi, Jun Hatakeyama, Yuji Harada
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Patent number: 8039199Abstract: A negative resist composition for immersion exposure including a fluorine-containing polymeric compound (F) containing a structural unit having a base dissociable group, an alkali-soluble resin component (A) excluding the fluorine-containing polymeric compound (F), an acid generator component (B) that generates acid upon exposure, and a cross-linking component (C); and a method of forming a resist pattern including applying the negative resist composition for immersion exposure to a substrate to form a resist film, subjecting the resist film to immersion exposure, and subjecting the resist film to alkali developing to form a resist pattern.Type: GrantFiled: April 30, 2009Date of Patent: October 18, 2011Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventor: Sho Abe
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Patent number: 8039198Abstract: A polymer comprising recurring units of a sulfonium salt represented by formula (1) is provided as well as a chemically amplified resist composition comprising the same. R1 is H, F, methyl or trifluoromethyl, R2 to R4 are C1-C10 alkyl or alkoxy, R5 is C1-C30 alkyl or C6-C14 aryl, k, m and n are 0 to 3. The recurring units generate a sulfonic acid upon exposure to high-energy radiation so as to facilitate effective scission of acid labile groups in the resist composition. The resist composition exhibits excellent resolution and a pattern finish with minimal LER.Type: GrantFiled: March 13, 2009Date of Patent: October 18, 2011Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Seiichiro Tachibana, Jun Hatakeyama, Youichi Ohsawa, Masaki Ohashi
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Patent number: 8034536Abstract: A novel resist composition and method of forming a resist pattern that can be used in lithography applications. The resist composition includes a base component (A) that exhibits changed solubility in an alkali developing solution under action of acid, and an acid generator component (B) that generates acid upon exposure, wherein the base component (A) contains a polymer compound (A1) having a structural unit (a0) represented by general formula (a0-1) shown below, wherein R1 represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a fluorinated alkyl group of 1 to 5 carbon atoms, R2 and R3 each independently represents a hydrogen atom or an alkyl group that may include an oxygen atom at an arbitrary position, or R2 and R3 are bonded together to form an alkylene group, and W represents a cyclic alkylene group that may include an oxygen atom at an arbitrary position.Type: GrantFiled: May 26, 2009Date of Patent: October 11, 2011Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Jun Iwashita, Shogo Matsumaru, Sho Abe
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Patent number: 8034529Abstract: A photosensitive resin composition comprising (a) a compound obtained by reacting a polybasic acid anhydride with the phenolic hydroxyl groups of a novolac-type phenol resin, and (b) a 1,2-quinonediazide compound. The photosensitive resin composition, which comprises component (b) composed of a 1,2-quinonediazide compound in combination with a component (a) obtained by reacting a polybasic acid anhydride with the phenolic hydroxyl groups of a novolac-type phenol resin, exhibits sufficiently high photosensitivity, image contrast, resolution and adhesiveness.Type: GrantFiled: July 19, 2006Date of Patent: October 11, 2011Assignee: Hitachi Chemical Company, Ltd.Inventors: Ken Sawabe, Takeshi Nojiri
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Patent number: 8029968Abstract: A positive resist composition with a broad DOF and a method for resist pattern formation are provided. This composition is a positive resist composition which includes a resin component (A) that exhibits increased alkali solubility under the action of acid and an acid generator component (B) that generates acid upon exposure, wherein the component (A) is a copolymer that contains n [wherein, n is an integer from 4 to 6] structural units with mutually different structures, and the proportion of each structural unit within the copolymer is greater than 0 mol % but no higher than 100/(n?1) mol %.Type: GrantFiled: June 17, 2005Date of Patent: October 4, 2011Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Ryotaro Hayashi, Satoshi Yamada, Makiko Irie
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Patent number: 5346801Abstract: An image forming process of an image forming material comprising a support and provided thereon, a photosensitive layer and a covering layer in that order comprises imagewise exposing the material by laser beam scanning, and peeling the covering film from the exposed material to form an image on the support or on the covering film, wherein said photosensitive layer contains a colorant, an addition-polymerizable or cross-linkable compound and a salt of a cationic dye with a borate anion represented by the following Formula (1):Formula (1) ##STR1##Type: GrantFiled: March 18, 1993Date of Patent: September 13, 1994Assignee: Konica CorporationInventors: Hiroshi Watanabe, Tatsuichi Maehashi, Koichi Nakatani, Katsunori Kato, Tawara Komamura