Patents Examined by John D. Freeman
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Patent number: 11848123Abstract: The present disclosure relates to insulation. Various embodiments thereof may include a solid insulation material and/or a formulation for production of an insulation system. For example, a formulation for an impregnating agent may include: an impregnating resin comprising a cycloaliphatic epoxy resin having a viscosity of less than 1500 mPas at impregnation temperature; and a curing catalyst deposited in the solid insulation material. The curing catalyst may be reactive toward the cycloaliphatic epoxy groups of the cycloaliphatic epoxy resin in the formulation of the impregnating agent but be sufficiently reactively inert with respect to the functional groups of the tape adhesive likewise present in the solid insulation material to confer storage stability to the solid insulation material.Type: GrantFiled: May 19, 2016Date of Patent: December 19, 2023Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Jürgen Huber, Dieter Schirm, Matthias Übler
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Patent number: 11846755Abstract: Provided is a hard coating film. The hard coating film includes a base layer and a hard coating layer disposed on the base layer and having a pencil hardness of 4H or higher. A surface elongation at break of the hard coating film falls within a predetermined range, as measured by a certain method. The hard coating film shows excellent durability under high-temperature/high-humidity conditions, has no microcracks formed after repeated folding, and shows excellent pencil hardness.Type: GrantFiled: February 10, 2020Date of Patent: December 19, 2023Assignees: SK Innovation Co., Ltd., SK ie technology Co., Ltd.Inventors: Jong Nam Ahn, Byoung Sun Ko, Jin Su Park, Tae Sug Jang, Keon Hyeok Ko, Ho Chul Yoon
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Patent number: 11845243Abstract: A multilayer structure comprising a sealant layer which comprises (a) a blend comprising (i) from 80 to 95 percent by weight of at least one ethylene/?-olefin interpolymer composition which comprises a homogeneously branched linear ethylene polymer composition and a heterogeneously branched linear ethylene polymer composition and (ii) from 5 to 20 percent by weight of at least one high pressure ethylene polymer characterized as having a melt index, I2 less than 6.0 g/10 minutes, a density of at least 0.916 g/cc, a Mw/Mn ratio of at least 7.0, wherein the blend has a melt index, I2, of at least 1.0 g/10 minutes; and (b) a low density polyethylene composition which comprises at least two components selected from the group consisting of homogeneously and heterogeneously branched linear ethylene polymers, wherein the composition has density from 0.90 to 0.930 g/cc and an I2 of from 1 to 50 g/10 minutes is provided.Type: GrantFiled: November 19, 2021Date of Patent: December 19, 2023Assignee: Dow Global Technologies LLCInventors: Shashibhushan Mishra, Prajwal Shah
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Patent number: 11845241Abstract: A laminate can contain a substrate, an adhesion promoter layer, and a coating layer, wherein the adhesion promoter layer may include an isocyanate group containing compound of formula (1): R1—R2—N?C?O (1), with R1 being a functional group different than the isocyanate group, and R2 being substituted or unsubstituted alkyl or aryl. The adhesion promoter layer can provide strong adhesion of the coating layer to the substrate by forming covalent bonds with the substrate and covalent bonds with the coating layer.Type: GrantFiled: March 18, 2021Date of Patent: December 19, 2023Assignee: CANON KABUSHIKI KAISHAInventor: Weijun Liu
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Patent number: 11833790Abstract: A laminate includes a polycarbonate substrate and an ultraviolet hard coat film disposed on the polycarbonate substrate. The ultraviolet hard coat film may include a polyethylene terephthalate (PET) layer, an adhesive interposed between the PET layer and the polycarbonate substrate, and an exterior hard coat disposed on the PET layer opposite the polycarbonate substrate. The exterior hard coat may include UV stabilizers. The laminate may include additional ultraviolet hard coat films stacked on the ultraviolet hard coat film. The laminate may be thermoformed into the shape of a curved vehicle windshield.Type: GrantFiled: May 18, 2022Date of Patent: December 5, 2023Assignee: Racing Optics, Inc.Inventors: Stephen S. Wilson, Bart E. Wilson
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Patent number: 11839024Abstract: Disclosed are composites comprising copper foils having at least one smooth surface and an adhesive layer with low Dk and Df properties. Also disclosed are copper clad laminates made by laminating the present composites with flexible or rigid substrates that exhibit heat resistance and good to excellent bonding strength. The PCBs made therefrom exhibit low insertion loss and may be assembled with other components to form various electrical devices utilizing high speed of at least 1 Gps or high frequency signals of at least 1 GHz.Type: GrantFiled: May 21, 2021Date of Patent: December 5, 2023Assignee: DUPONT ELECTRONICS, INC.Inventors: Yu-Cheng Chen, Mu-Huan Chi, Shih-Ching Lin, Wei-Guang Liu
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Patent number: 11813827Abstract: A multilayer film having coextruded layers comprising a znLLDPE-based core layer, and mLLDPE-based outer layers on each side of the core layer comprising, wherein the znLLDPE of the core layer has a density which is less than 0.005 g/cc different from a density of the mLLDPE of the outer layers, and wherein the znLLDPE of the core layer has a melting temperature which is less than 15° C. different from a melting temperature of the mLLDPE of the outer layers.Type: GrantFiled: October 21, 2019Date of Patent: November 14, 2023Assignee: INTEPLAST GROUP CORPORATIONInventors: Shen-Hsiu Hung, Ter-Hai Lin
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Patent number: 11813828Abstract: The invention relates to a structure comprising at least one layer (1) comprising a BACT/XT copolyamide in which: —BACT is a unit with an amide moiety having a molar ratio of between 20 and 70%, preferably between 25 and 60%, and more preferably between 35 and 55%, where BAC is chosen from 1,3-bis (aminomethyl) cyclohexyl (1,3 BAC), 1,4-bis (aminomethyl) cyclohexyl (1,4 BAC) and a mixture of same, and T is terephthalic acid, —XT is a unit with an amide moiety having a molar ratio of between 30 and 80%, preferably between 40 and 75%, and more preferably between 45 and 65%, where X is a C9 to C18, preferably C9, C10, C11 and C12, linear aliphatic diamine, and where T is terephthalic acid, preferably a C10, C11 and C12 terephthalic acid.Type: GrantFiled: July 10, 2017Date of Patent: November 14, 2023Assignee: ARKEMA FRANCEInventors: Mathieu Capelot, Nicolas Dufaure, Thierry Briffaud
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Patent number: 11807730Abstract: Provided are a composition for forming a polyimide film for a cover window which may satisfy performance required for an advanced cover window, a method for preparing the same, and a use thereof. According to an implementation, a polyimide film for a cover window, which has excellent visibility without optical stain while colorless and transparent optical properties were not deteriorated and has excellent heat resistance and mechanical properties, and thus, is for use in optical applications, may be provided. In addition, a polyimide film for a cover window according to an implementation may be useful in various display devices.Type: GrantFiled: June 15, 2022Date of Patent: November 7, 2023Assignees: SK Innovation Co., Ltd., SK ie technology Co., Ltd.Inventors: Cheol Min Yun, Hye Jin Park
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Patent number: 11794385Abstract: The following configuration is adopted for the purpose of solving reduction in strength and rigidity at a weldline which is a problem of an injection molding body, and enabling free design such as thin wall molding or complex shape molding of the injection molding body. That is, there is provided an integrally molded body in which a substrate for reinforcement (a) having a discontinuous fiber (a1) and a resin (a2) and an injection molding body (b) having a discontinuous fiber (b1) and a resin (b2) are integrated, the substrate for reinforcement (a) covering a part or all of a weldline of the injection molding body (b) to be integrated with the injection molding body (b), the ratio of thickness Ta of the substrate for reinforcement (a) to thickness T of a weldline part of the integrally molded body satisfying relational expression: in a case of Ea?Ebw, Ta/T?((Ebw??(Ea·Ebw))/(Ebw?Ea)) in a case of Ea=Ebw, Ta/T?0.Type: GrantFiled: August 24, 2018Date of Patent: October 24, 2023Assignee: TORAY INDUSTRIES, INC.Inventors: Takafumi Suzuki, Yuichiro Sento, Naokichi Imai, Mitsushige Hamaguchi, Masato Honma
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Patent number: 11798863Abstract: The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate (1) according to the present invention includes a metal substrate (4), an insulating layer (2) laminated on one surface of the metal substrate (4), and a patterned metal layer (3) laminated on the surface of the insulating layer (2) on the side opposite to the metal substrate (4), the metal layer (3) is 300 ?m or more in thickness, and the insulating layer (2) includes boron nitride (12) and an inorganic filler (13) other than boron nitride.Type: GrantFiled: December 7, 2018Date of Patent: October 24, 2023Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Kouji Ashiba, Keigo Oowashi, Aki Koukami, Rui Zhang
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Patent number: 11795271Abstract: An embodiment relates to a polyimide based film for a cover window that may satisfy required performance of an advanced cover window, and a use thereof, and the polyimide based film for a cover window according to the embodiment has excellent visibility without optical stains without deterioration in colorless and transparent optical physical properties, and excellent heat resistance and mechanical physical properties, and thus, may be usefully used for optical applications or the purpose of replacing existing tempered glass. In addition, the polyimide based film for a cover window according to an embodiment may be usefully used in a multilayer structure and a display device.Type: GrantFiled: June 13, 2022Date of Patent: October 24, 2023Assignees: SK Innovation Co., Ltd., SK ie technology Co., Ltd.Inventors: Cheol Min Yun, Hye Jin Park
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Patent number: 11796719Abstract: Provided are a protective film for a foldable display and a foldable display device comprising the same.Type: GrantFiled: October 8, 2019Date of Patent: October 24, 2023Assignee: LG CHEM, LTD.Inventors: Han Sol Yoo, Hyun Cheol Kim, Hyon Gyu Park, Hee Song
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Patent number: 11787942Abstract: A polyimide precursor solution includes: a polyimide precursor; polyester resin particles containing a polyester resin and having a volume average particle diameter of from 3 ?m to 50 ?m inclusive and an average circularity of 0.970 or more; and a solvent.Type: GrantFiled: February 3, 2022Date of Patent: October 17, 2023Assignee: FUJIFILM Business Innovation Corp.Inventors: Shigeru Seitoku, Kosuke Nakada, Takeshi Iwanaga, Hidekazu Hirose
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Patent number: 11773262Abstract: A resin comprises at least one compound selected from one of the following formulasType: GrantFiled: December 16, 2019Date of Patent: October 3, 2023Assignee: A.C.R. TECH CO., LTD.Inventors: Shih-Hao Liao, Min-Yuan Yang, Ya-Yen Chou, Jheng-Hong Ciou, Cheng-Chung Chen
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Patent number: 11766850Abstract: Provided is a laminate that generates a structural color, where the laminate can be subjected to a deep-drawing process without deteriorating the color developing structure of the structural color. The laminate according to an embodiment of the present invention includes a polyamide layer (1) and a thermoplastic polyurethane layer (2) having a color developing structure of a structural color. The thermoplastic polyurethane layer (2) is preferably a thermoplastic polyurethane layer having a structure having recesses and protrusions on a face that is opposite a face in contact with the polyamide layer (1) or a layer formed by alternately laminating two types of thermoplastic polyurethanes having a difference in refractive indexes of 0.03 or greater.Type: GrantFiled: July 19, 2019Date of Patent: September 26, 2023Assignee: DAICEL-EVONIK LTD.Inventors: Daisuke Fujiki, Toshihiko Fujinaka
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Patent number: 11760838Abstract: The polyimide resin precursor in the present embodiment is a polyimide resin precursor obtained by allowing a diamine component and a tetracarboxylic acid anhydride component to react with each other, wherein based on the whole of the diamine component, the content of p-phenylenediamine is 75 mol % or more; the tetracarboxylic acid anhydride component includes an ester-containing tetracarboxylic acid anhydride represented by formula (1), and at least one biphenyltetracarboxylic acid anhydride selected from the group consisting of 3,4,3?,4?-biphenyltetracarboxylic acid dianhydride, 2,3,3?,4?-biphenyltetracarboxylic acid dianhydride and 2,3,2?,3?-biphenyltetracarboxylic acid dianhydride; and based on the whole of the tetracarboxylic acid anhydride component, (i) the total of the content of the ester-containing tetracarboxylic acid anhydride and the content of the biphenyltetracarboxylic acid anhydride is 75 mol % or more, and (ii) the content of the ester-containing tetracarboxylic acid anhydride is 15 to 80 moType: GrantFiled: April 30, 2020Date of Patent: September 19, 2023Assignee: Arisawa Mfg. Co., Ltd.Inventors: Hiroyuki Matsuyama, Yoshinori Sato
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Patent number: 11762416Abstract: A transparent laminated film, a display device, and a method for manufacturing a transparent laminated film are disclosed. The transparent laminated film includes a first film layer, a central film layer, and a second film layer which are sequentially stacked, each of a material of the first film layer and a material of the second film layer includes a thermoplastic plastic, and a material of the central film layer includes a thermosetting plastic.Type: GrantFiled: January 3, 2019Date of Patent: September 19, 2023Assignee: BOE Technology Group Co., Ltd.Inventors: Penghao Gu, Jiahao Zhang, Pao Ming Tsai
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Patent number: 11752734Abstract: A base material for a printed circuit board includes: an insulating base film; and a sintered body layer of metal particles layered on one side surface of the base film; wherein an arithmetic mean roughness (Sa) of a surface of the sintered body layer that is opposite to the base film is greater than or equal to 0.005 ?m and less than or equal to 0.10 ?m.Type: GrantFiled: September 24, 2018Date of Patent: September 12, 2023Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Motohiko Sugiura, Issei Okada, Kenji Ohki
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Patent number: 11752744Abstract: The present disclosure provides a multilayer polyimide film in which the core layer is made of a non-thermoplastic polyimide resin comprising one or more imidization catalysts and one or more dehydrating agents, and the skin layer laminated on one or both surfaces of the core layer contains one or more imidization catalysts, but does not contain a dehydrating agent, and a method for manufacturing the same.Type: GrantFiled: October 23, 2019Date of Patent: September 12, 2023Assignee: PI Advanced Materials Co., Ltd.Inventors: Ki-Hoon Kim, Kil-Nam Lee