Abstract: Provided is such a conductive member that a change in its electrical resistance value caused by its long-term use is reduced to the extent possible. The conductive member has a conductive support and a conductive layer, the conductive layer contains a rubber composition formed of a modified epichlorohydrin rubber, and the modified epichlorohydrin rubber has a unit represented by the following formula (1). In the formula (1), R1, R2, and R3 each independently represent hydrogen or a saturated hydrocarbon group having 1 to 18 carbon atoms.

Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): wherein R1 is an organic group; and (D) a resin represented by the following formula (II): wherein n is an integer of 1 to 10.

Abstract: The present invention provides a low-dielectric resin composition comprising (A) a urethane resin obtained by reacting a polycarbonate diol and an isocyanate, (B) an epoxy resin, and (C) a filler, wherein the (A) urethane resin has a carboxyl group equivalent weight of 1,100 to 5,700 g/eq; the epoxy equivalent weight of the (B) epoxy resin is 0.3 to 4.5 equivalents per 1.0 equivalent of the carboxyl group of the (A) urethane resin, the (A) urethane resin has a weight-average molecular weight of 5,000 to 80,000; the (A) urethane resin has a polycarbonate content of 35% by mass or lower; the resin composition comprises 50 parts by mass or less of the (C) filler per 100 parts by mass of the (A) urethane resin; and the resin composition comprises substantially no imido group.

Abstract: A plank is described and a method for manufacturing the plank. The plank can be produced by mixing polyvinyl chloride powder, coarse whiting and light calcium compound powder, stabilizer, polyethylene wax, internal lubricant, plasticizer, and impact modifier together, and stirring this mixture. The mixture is then extruded through an extruder compound to form a plastic composite base material. A surface layer is then tiled onto the plastic composite base material using thermal compression, without the use of intermediate adhesive materials. The surface layer can be embossed when it is combined with the mixture being extruded.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly containing the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the as layer can also include additives, as desired.

Abstract: Disclosed are a polyimide resin containing a structural unit represented by the following formula (1-1), and a polyimide film containing a structural unit represented by the following formula (1-2) and having a thickness of 10 to 50 ?m. R1 and R2 in the formula (1-1) each independently represent any group of the following formulae (i) to (iv), R1 and R2 in the formula (1-2) each independently represent a group of the following formula (i) or formula (ii), and in these formulae, * bonds to the carbon with * in the formula (1-1) and the formula (1-2) and ** bonds to the carbon with ** in the formula (1-1) and the formula (1-2). A polyimide resin capable of forming a polyimide film excellent in transparency and having a low coefficient of linear thermal expansion, and a polyimide film having a lower coefficient of linear thermal expansion are provided.

Abstract: A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 ?m.

Abstract: To provide a laminate excellent in the oil resistance without using a polypropylene film for the innermost layer of a packaging material. A laminate comprising at least three layers (A), (B) and (C) in this order, wherein the layer (A) is composed of a polyolefin which satisfies the following requirements (a) to (c), the layer (B) is composed of an adhesive which satisfies the following requirements (d) to (f), and the layer (C) is a substrate comprising at least one layer: (a) density of from 900 to 970 kg/m3, (b) MFR of from 2 to 30 g/10 min, (c) film thickness of from 5 to 25 ?m, (d) film thickness of from 0.01 to 3.0 ?m, (e) glass transition temperature of from ?30 to +10° C., and (f) storage modulus E? at 20° C. of from 1.0×106 to 2.5×107 Pa.

Abstract: Provided is a graphite laminated body having excellent properties such as excellent mechanical properties, excellent heat resistance, and excellent thermal conductivity. In particular, provided is a graphite laminated body comprising a graphite film, a non-thermoplastic polyimide film, and an adhesive layer for bonding the graphite film to the non-thermoplastic polyimide film, the adhesive layer being made of a thermoplastic polyimide or a fluororesin.

Abstract: The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.

Abstract: The present invention provides polyamide compositions comprising (a) at least one high chain-length polyamide [polyamide (PA)]; (b) at least one grafted polyolefin [olefin (PO)]; and (c) at least one aromatic diacid [acid (DA)]. The polyamide composition can be advantageously used as a material to be coated on a surface of metal component.

Abstract: The present invention provide an adhesive composition which is suitable for laminating a polyimide film with a copper foil in a double-sided flexible copper-clad laminate to be used for a flexible printed wiring board. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-type flame retardant, wherein 15 to 40 parts by mass of the epoxy resin is compounded to 85 to 60 parts by mass of the polyamide-imide resin; a glass transition temperature of the polyamide-imide resin is 250° C. or higher; an acid value of the polyamide-imide resin is 50 to 150 mgKOH/g; the epoxy resin is liquid at 25° C.; 15 to 60 parts by mass of the phosphorus-type flame retardant is compounded to 100 parts by mass in total of the polyamide-imide resin and the epoxy resin; and 50% by mass or more of the phosphorus-type flame retardant is a phosphinic acid derivative of a phenanthrene type.

Abstract: The invention relates to a coating composition based on organic or water-based solvent, containing at least one binder (A), optionally at least one cross-linking agent (B), and at least one matting agent (M) based on silicon dioxide (SiO2), wherein the coating composition contains a combination of a) a matting agent based on silicon dioxide (SiO2) that is surface-modified with one or more waxes, b) an organic matting agent, and c) polyamide particles, and a clear lacquer comprising a coating composition of this type. In this way, automobile series paints can be produced having targeted, adjustable low gloss.

Abstract: A problem addressed by the present invention is to provide a low-friction member which does not easily lose low-friction properties thereof even when used for a relatively long period. The low-friction member LS according to the present invention is consisting of at least lubricating materials PL, PS and a polyimide resin MR. The low-friction member has a surface roughness Rsk or 0.500 or more and the surface exposure ratio of the lubricating materials of 15.0% or more. It is particularly preferred that the surface roughness Rsk be in a range of 0.0900 (inclusive) to 0.1400 (inclusive), and the surface exposure ratio of the lubricating materials be 35.0% or more. It is preferred that the lubricating materials be a fluororesin. The low-friction member thus has the property of not losing the low-friction properties thereof easily even when used for a relatively long period.

Abstract: The invention relates to a method for welding a polyamide plastic and a poly(meth)acrylate—particularly a polymethyl methacrylate—plastic using a primer, said primer containing at least one copolymer synthesised from at least one styrene or styrene derivative and at least one maleic anhydride or maleic anhydride derivative. The invention also relates to correspondingly welded products.

Abstract: The present invention relates to a pigmented aqueous basecoat material comprising a polyether-based reaction product which is preparable by reaction of (a) at least one cyclic carboxylic anhydride comprising a free carboxylic acid group and/or the halide of a carboxylic acid group with (b) at least one polyether of the general structural formula (I) in which R is a C3 to C6 alkylene radical and n is selected accordingly such that the polyether (b) possesses a number-average molecular weight of 800 to 4000 g/mol, the components (a) and (b) being used in the reaction in a molar ratio of 0.7/2.3 to 1.6/1.7 and the resulting reaction product possessing an acid number of 10 to 50 mg KOH/g.

Abstract: Disclosed is a plastic substrate, which includes a plastic film, a metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.

Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.

Abstract: A composition for preparing poly(imide-benzoxazole) copolymer is described, where the copolymer include: a tetracarboxylic acid dianhydride represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, and a diamine represented by Chemical Formula 3: wherein definitions of groups and variables in Chemical Formulae 1 to 3 are the same as described in the specification.