Abstract: A glove with a sleeve is provided in which the bonding strength between the glove main body and the sleeve is great, allowing easy wearing and removal as well as easy overlapping of the glove main body and the sleeve upon bonding. The glove with a sleeve includes: a glove main body compromising rubber or a resin as a principal component; and a cylindrical sleeve comprising a thermoplastic resin as a principal component that is arranged to protrude from a cuff portion of the glove main body, in which the cuff portion of the glove main body is bonded to one end portion of the sleeve through a moisture-curing urethane-based hot melt adhesive. The moisture-curing urethane-based hot melt adhesive is preferably crosslinked. A post-curing thermal deformation temperature of the moisture-curing urethane-based hot melt adhesive is preferably no less than 80° C.

Abstract: Disclosed are improved water-based, polyamide-containing synthetic polymer coating compositions and related products and processes. The coating composition comprises 1 to 40% dry weight of polyamide powder, and can contain higher polyamide content than organic solvent-based coating products containing polyamide and polyurethane. The improved coating compositions are suitable for coating of metal substrates, such as aluminum sheets and panels. The improved coating compositions are also suitable for industrial coil coating processes, forming a thin and uniform coating layer when applied to a metal substrate, such as an aluminum sheet surface. Methods and processes related to production and uses of the coating compositions are described, as well as products produced by the processes using the coating compositions, such as roller shutters and architectural panels.

Abstract: A low dielectric polyimide composition comprises an aliphatic anhydride, a long chain diamine, and an ester diamine. A polyimide made of such low dielectric polyimide composition has low polarizability group, thus the dielectric constant of the polyimide is lower. A polyimide made of the low dielectric polyimide composition, a polyimide film using the polyimide, and a copper clad laminate using the polyimide film are also provided.

Abstract: The present disclosure is directed to a base film having a chemically converted polyimide, a non-carbon black pigment and a particulate polyimide matting agent. The particulate polyimide matting agent is present in an amount from 1.6 to 9 weight percent of the base film.

Abstract: The invention provides a package film, manufacturing method thereof, and packaging method for OLED panel. The package film comprises a polymer substrate, at least two organic buffer layers, and at least two inorganic barrier layers; with a single layer of the organic buffer layer and a single layer of the inorganic barrier layer being alternately stacked on the polymer substrate; the inorganic barrier layer formed with one or more materials from graphene film, mica sheet film, and carbon nanotube film to achieve a package film with transmittance, high barrier, and high flexibility, reduces the device oxygen permeability and reduce the package film thickness, make the device thinner, and meet the packaging requirements for flexible OLED panel; moreover, by disposing water absorption layer and water barrier layer in organic buffer layer at periphery to enhance the package film structure from lateral side to further improve water and oxygen barrier ability.

Abstract: A photosensitive and via-forming circuit board comprising a laminate unit, a conductor unit, and a cover layer unit is provided. The laminate unit includes an insulating layer, a first conductive wiring layer and a second conductive wiring layer formed at two opposite sides of the insulating layer, respectively, and at least one through-hole surface defining a through hole extending from the upper surface of the first conductive wiring layer through the insulating layer to the lower surface of the second conductive wiring layer. The conductor unit is formed on the at least one through-hole surface. The cover layer unit is formed from a photosensitive composition comprising an epoxy group-containing compound and a photosensitive polyimide capable of reacting with the epoxy group of the epoxy group-containing compound, and includes a first cover layer formed on the first conductive wiring layer and extending into and filling the through hole.

Abstract: Various embodiments provide random copolyimides that may possess the mechanical, thermal, chemical and optical properties associated with polyimides yet achieve a low energy surface. In various embodiments, the copolyimides may be prepared using a minor amounts of a diamino terminated fluorinated alkyl ether oligomer and a diamino terminated siloxane oligomer. The various embodiments include processes for making the copolyimides containing fluorine and silicon surface modifying agents and anisotropic coatings and articles of manufacture from them. Thus the coatings and articles of manufacture made with the copolyimides of the various embodiments may be characterized as having an anisotropic fluorine and silicon composition and low surface energy.

Abstract: A polyimide laminated film containing a thermoplastic polyimide layer that includes a block (A) having a storage elastic modulus of 0.15 GPa or more at 380° C. and a block (B) having a storage elastic modulus of 0.10 GPa or less at 380° C. is used as a polyimide laminated film that has high peel strength and can suppress occurrence of a crack in an alkaline environment.

Abstract: A multilayered structure having a liquid layer (5) on a surface of a plastic underlying layer (3), wherein a liquid diffusion prevention layer (1) is provided on the lower side of the underlying layer (3) to suppress or block a diffusion of a liquid that forms the liquid layer (5), and a covering ratio F of the liquid layer (5) is maintained to be not less than 0.5. With this structure, the surface properties of the liquid layer (5) can be stably maintained over long periods of time.

Abstract: Provided is a laminate that excels in adhesion among a plurality of resin layers formed as insulating layers containing polyimide and so forth, a method for manufacturing the laminate, a semiconductor device, and, a method for manufacturing the semiconductor device. The laminate comprises a substrate, and at least two resin layers, each of the resin layers is independently brought into contact, in at least a part of the surface thereof, with other resin layer, and the layers independently has a Young's modulus exceeding 2.8 GPa and not exceeding 5.0 GPa, and, an elongation after fracture exceeding 50% and not exceeding 200%, and further has a three-dimensional radical crosslinked structure, and at least one of the resin layers contains at least either polyimide or polybenzoxazole.

Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted linear alkenyl group and a substituted or unsubstituted linear alkynyl group. Each variable in the above formulas is defined in the specification.

Abstract: The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.

Abstract: A sheet for forming a shoe sole, useful for efficiently joining a crosslinked rubber layer as a stud and a thermoplastic elastomer layer as a sole, is provided. The sheet comprises a resin component (A) containing a polyamide resin (a) and having an amino group concentration of not less than 10 mmol/kg and a flexural modulus of not less than 300 MPa in accordance with ISO178. The polyamide resin (a) may contain a polyamide resin having a melting point of not less than 165° C. at a predetermined concentration (e.g., not less than 30% by weight) in the total polyamide resin (a).

Abstract: A laminated film includes, at least on one side thereof, a layer containing a hardening resin, having a total thickness of 1 to 100 ?m, a light transmittance of 70% or more at a wavelength of 400 nm, a Young's modulus of 5 GPa or more when applying a nanoindenter to make a 1 ?m depression in the thickness direction into the surface of the hardening layer, and undergoing a rate of deformation of 500 ppm or less after applying a stress of 0.5 MPa for 30 minutes.

Abstract: A polyimide resin of the present invention contains at least one kind of an alicyclic acid dianhydride as an acid dianhydride component and contains at least one kind of a sulfonyl group-containing diamine as a diamine component. A film containing the polyimide resin of the present invention preferably has a yellowness of 3.0 or less, a tensile elastic modulus of 3.5 GPa or more, a pencil hardness of 4H or more, and a light transmittance of 60% or more at a wavelength of 400 nm. The polyimide resin of the present invention and the film of the present invention preferably have a glass transition temperature of 300° C. or higher.

Abstract: A poly(amide-imide) copolymer film having a tensile modulus of greater than or equal to 5.4 GPa, and a yellowness index of less than or equal to 3.6, wherein the poly(amide-imide) copolymer film is a reaction product of an aromatic dianhydride including biphenyl tetracarboxylic dianhydride and 4,4?-hexafluoroisopropylidene diphthalic dianhydride, an aliphatic dianhydride including 1,2,3,4-cyclobutane tetracarboxylic dianhydride, an aromatic diamine including 2,2-bis(trifluoromethyl) benzidine, and an aromatic dicarbonyl compound including terephthaloyl dichloride.

Abstract: Described are sealing primer compositions that can be used to reduce paint defects such as pops or vapor boil on painted plastic substrates, as well as related methods for sealing plastic substrates, and sealed plastic substrates. Sealing primer compositions of the invention include a functionalized polydiene polymer such as a hydroxylated or other functional-group-containing polybutadiene polymer.

Abstract: The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.

Abstract: A resin composition is provided that is capable of inhibiting degradation of the organic EL device. The resin composition, includes: (A) an alicyclic epoxy compound; (B) a bisphenol A epoxy resin; (C) a bisphenol F epoxy resin; and (D) a photocationic polymerization initiator. The bisphenol A epoxy resin (B) and the bisphenol F epoxy resin (C) are compounds not having the alicyclic epoxy compound (A) and the resin composition has a moisture content of 1000 ppm or less. Alternatively, the resin composition may further include a filler (H) and may have a moisture content of 50 ppm or more.

Abstract: A polyetherimide composition comprises the polymerization product of a catalyzed imidization product of a 3-substituted phthalic anhydride and a sulfone diamine having improved melt stability and reduced corrosivity, and a method of manufacture thereof.