Patents Examined by John Kight, III
  • Patent number: 5371167
    Abstract: A coating composition is described comprising two components that are reactable with each other to cure the coating. The two components are:(a) a carboxyl-functional polyurethane component that is the reaction product of:(i) a polyisocyanate compound, and(ii) a compound comprising at least one acid group and at least one isocyanate-reactive group,(b) a component comprising at least two groups that are reactive with the epoxy groups on the polyurethane compound.
    Type: Grant
    Filed: October 29, 1992
    Date of Patent: December 6, 1994
    Assignee: BASF Corporation
    Inventors: John W. Rehfuss, Walter H. Ohrbom
  • Patent number: 5371168
    Abstract: Amorphous polyimide powder which has recurring structural units of the formula (I): ##STR1## as a fundamental skeleton, is blocked at the polymer chain end with dicarboxylic anhydride represented by the formula (II) ##STR2## wherein Z is a divalent radical having from 6 to 27 carbon atoms and selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected to each other with a direct bond or a bridge member, and essentially has no reactive radical at the polymer chain end, preparation process of the amorphous polyimide powder, heat-resistant adhesive comprising the polyimide, and bonding method using the adhesive.
    Type: Grant
    Filed: June 5, 1992
    Date of Patent: December 6, 1994
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Wataru Yamashita, Shoji Tamai, Akihiro Yamaguchi
  • Patent number: 5370974
    Abstract: A method of patterning a preimidized benzophenone photoactive polymer used as a photoresist with a laser light source improves its crosslinking efficiency and reduces swelling, thereby enabling the formation of lines on the order of microns.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: December 6, 1994
    Assignee: International Business Machines Corporation
    Inventors: Peter A. Agostino, Ajay P. Giri, John R. Lankard, Sr., Ron J. McDonald
  • Patent number: 5371175
    Abstract: An epoxy-terminated polyamide having the following structure: ##STR1## where each of R.sub.1, R.sub.2, and R.sub.3 is a divalent organic group, and each of n and m is a natural number, and an adhesive containing the above epoxy-terminated polyamide, an epoxy resin and a curing agent. The epoxy-terminate polyamide is well compatible with epoxy resins and an adhesive containing the same is excellent in adhesiveness and thermal resistance.
    Type: Grant
    Filed: February 23, 1993
    Date of Patent: December 6, 1994
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hitoshi Nojiri, Katsunori Yabuta
  • Patent number: 5371178
    Abstract: Described is a rapidly curing adhesive formulation and a method of reducing the curing time of an adhesive formulation containing cyanate ester.
    Type: Grant
    Filed: December 3, 1993
    Date of Patent: December 6, 1994
    Assignee: Johnson Matthey Inc.
    Inventor: My N. Nguyen
  • Patent number: 5370971
    Abstract: A photopolymerizable composition comprising:(a) an aromatic epoxy resin derivative containing, per kilogram of the resin, 0.3 to 10 mole equivalents of a polymerizable unsaturated group and 0.1 to 3 mole equivalents of a specific aprotic onium salt-containing group,(b) a polysiloxane having a specific polysiloxane chain in a molecule, and containing 0.01 to 5 mole equivalents, per kilogram of the polysiloxane, of the aprotic onium salt-containing group, and(c) a photopolymerization initiator.Said photopolymerizable composition can form a resist film excellent in adhesion to a substrate, heat resistance, chemical resistance, impact resistance and solder plating property, and is suitable as a solder resist in particular.
    Type: Grant
    Filed: October 29, 1992
    Date of Patent: December 6, 1994
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Tetsuo Ogawa, Kenji Seko, Tetsu Maki, Naozumi Iwasawa
  • Patent number: 5369179
    Abstract: Disclosed is a thermoplastic flexible film suitable for wrapping static sensitive devices such as electronic circuit boards. The film is made of an inherently hydrophilic polyether block amide copolymer in blend with a compatible polymer. Compatible polymers typically are amide polymers or are acid copolymers, such as the nylons or ionomers. The film does not have a degree of hydrophilicity unsuitable for packaging static sensitive devices. Yet the film is antistatic without requiring the addition of an antistatic agent.
    Type: Grant
    Filed: May 3, 1991
    Date of Patent: November 29, 1994
    Assignee: W. R. Grace & Co.-Conn.
    Inventor: Marvin R. Havens
  • Patent number: 5368945
    Abstract: The invention relates to a coating composition based on a polyester resin, an amino resin and an epoxy resin.The polyester resin is a carboxyl-functional polyester with a molecular weight of between 12000 and 25000.
    Type: Grant
    Filed: January 12, 1993
    Date of Patent: November 29, 1994
    Assignee: Stamicarbon B.V.
    Inventors: Gerard Hardeman, Wilhelmina Westerhof, Anthonie J. Plak, Anneke Beens-Onstenk
  • Patent number: 5369209
    Abstract: The invention relates to amorphous polyesterimides which comprises 50 to 100 mole-% of units of formula II ##STR1## and from 0 to 50 mole-% of units of formula ##STR2## in which units R.sub.1 and R.sub.2, independentlyof one another, are H, branched or unbranched alkyl radicals having 1 to 6 carbon atoms, branched or unbranched alkoxy radicals having 1 to 6 carbon atoms, or F, Cl or Br.The polyesterimides according to the invention are suitable for the production of molding compositions, moldings, fibers and films.
    Type: Grant
    Filed: August 3, 1993
    Date of Patent: November 29, 1994
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Horst-Tore Land, Michaela Gedan, Manfred Ratzsch, Frank Bohme
  • Patent number: 5369135
    Abstract: Controlled foams of crystalline amorphous polymers include a second phase polymeric material having a transition temperature below that of the matrix polymeric material. The second phase material provides nucleating sites for the growth of gas formed cells which are limited in size by the particle size of the second phase polymeric material.
    Type: Grant
    Filed: May 13, 1992
    Date of Patent: November 29, 1994
    Assignee: Mobil Oil Corporation
    Inventors: Gregory A. Campbell, Don H. Rasmussen
  • Patent number: 5368850
    Abstract: An aqueous cosmetic or dermatological dispersion for treatment of hair or skin contains the following in an aqueous medium:a) at least one sugar or (C.sub.1 -C.sub.4)alkylsugar, C.sub.4 -C.sub.22 fatty acid mono and/or diester which may be oxyethylenated if necessary; andb) at least one reticulated copolymer of acrylamide and a monomer selected from:(i) ammonium acrylate;(ii) partially or completely neutralized 2-acrylamido 2-methylpropane sulfonic acid;(iii) methacryloyl oxyethyl trimethylammonium chloride.
    Type: Grant
    Filed: November 15, 1993
    Date of Patent: November 29, 1994
    Assignee: L'Oreal
    Inventors: Daniele Cauwet, Claude Dubief
  • Patent number: 5367042
    Abstract: Films containing polybenzazole polymer dissolved in a solvent can be mechanically stretched to provide biaxial orientation. The resulting dope film can be coagulated. The polymer film has improved properties in the direction in which stretching occurs.
    Type: Grant
    Filed: August 27, 1992
    Date of Patent: November 22, 1994
    Assignee: The Dow Chemical Company
    Inventors: Peter E. Pierini, Robbert M. Vermeulen, Susan E. Dollinger
  • Patent number: 5367044
    Abstract: A composition comprising a randomly branched aromatic polycarbonate polymer wherein the branching agent 1,1,1-tris-(4-hydroxyphenol)ethane is present in the polymer in quantities ranging from about 0.28 to about 0.36 mole percent compound based on the percent of dihydric phenol present in the polymer.
    Type: Grant
    Filed: August 12, 1992
    Date of Patent: November 22, 1994
    Assignee: General Electric Company
    Inventor: Niles R. Rosenquist
  • Patent number: 5367046
    Abstract: A high temperature resistant fiber, especially a polyimide fiber, having a dielectric constant less than 3 is prepared by first reacting 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane with 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride in an aprotic solvent to form a polyamic acid resin solution. The polyamic acid resin solution is then extruded into a coagulation medium to form polyamic acid fibers, which are thermally cured to their polyimide form. Alternatively, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane with 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride to form a polyamic acid, and the polyamic acid is chemically converted to its polyimide form. The polyimide is then dissolved in a solvent to form a polyimide resin solution, and the polyimide resin is extruded into a coagulation medium to form a polyimide wet gel filament. In order to obtain polyimide fibers of increased tensile properties, the polyimide wet gel filaments are stretched at elevated temperatures.
    Type: Grant
    Filed: April 10, 1992
    Date of Patent: November 22, 1994
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: William E. Dorogy, Jr., Anne K. St. Clair
  • Patent number: 5367049
    Abstract: Process for the manufacture of poly(arylene sulphide) consisting in polymerizing, in one stage, a reaction mixture comprising the following constituents:an alkali metal sulphide (a);a polar organic solvent (b);an alkali metal carboxylate (c);water (d);a dihalogenated aromatic compound (e); characterized by the combination, in the said mixture, of a molar ratio (R.sub.H.sbsb.2.sub.O) of the water (d) to the sulphide (a) used such that:2.6.ltoreq.R.sub.H.sbsb.2.sub.O .ltoreq.3.8and of a molar ratio (R.sub.ADD) of the carboxylate (c) to the sulphide (a) used such that:0.20.ltoreq.R.sub.ADD .ltoreq.0.
    Type: Grant
    Filed: August 16, 1993
    Date of Patent: November 22, 1994
    Assignee: Solvay (Societe Anonyme)
    Inventors: Danny Van Hoyweghen, Jean-Marc Coisne
  • Patent number: 5367024
    Abstract: A light weight resinous plastic co-polymer comprised of styrene and acryltrile is ground to various sizes, especially 20 mesh and 40 mesh, and is used as an anti-slip grit, as a texturizer, and/or as a filler in coatings and plastic resins. The co-polymer, having a specific gravity of around 1.08 (water=1.0), is dispersed in or broadcast upon a liquid resin or resin system. The co-polymer disperses clear and stays suspended without adjustment or with minor adjustments to the colloidal matrix of the system.
    Type: Grant
    Filed: July 17, 1992
    Date of Patent: November 22, 1994
    Assignee: American Fillers & Abrasives Co., Inc. a corporation of Michigan
    Inventor: Edwin F. Neckermann
  • Patent number: 5367040
    Abstract: A process for the production of modified phenol-formaldehyde resins includes the use of a difunctional phenolic compound as the phenolic component of the resins. The inventive resins resist pre-curing and are useful in the production of molded wood composites produced, for example, by wet-dry forming processes.
    Type: Grant
    Filed: December 29, 1992
    Date of Patent: November 22, 1994
    Assignee: Masonite Corporation
    Inventor: Zygmunt Teodorczyk
  • Patent number: 5367043
    Abstract: A curable formaldehyde-free phenolic resin having formula (I): ##STR1## wherein a and b each represent an integer equal to or greater than 1, a+b multiplied by n is an integer of about 3 to 100; ##STR2## m is 0 or 1; and R is hydrogen, halogen, alkyl having about 1 to 12 carbon atoms, aryl having about 6 to 12 carbon atoms, allyl having 3 or 4 carbon atoms, aralkyl having about 7 to 13 carbon atoms, alkaryl having about 7 to 13 carbon atoms, alkoxy having about 1 to 4 carbon atoms, aryloxy having about 6 to 12 carbon atoms, or ##STR3## and methods for preparing such resin are described.
    Type: Grant
    Filed: November 6, 1991
    Date of Patent: November 22, 1994
    Assignee: Enzymol International, Inc.
    Inventors: John M. Butler, Richard L. Brandon
  • Patent number: 5366837
    Abstract: An image receiving sheet of the present invention for receiving a desired image thereon includes a support layer and an absorbing layer containing heat-meltable or thermoplastic particles. A desired image can be formed in the absorbing layer of the image receiving sheet. Through heating the image receiving sheet formed with the desired image, the heat-meltable or thermoplastic particles are thermally melted or softened to attain a glossy and transparent surface formed with the desired image. As a result, an image bearing product coated with a glossy and transparent surface formed with the desired image is obtained. Through thermally pressing the image receiving sheet formed with the visible image toward an article of arbitrary type, on the other hand, the heat-meltable or thermoplastic particles are thermally melted or softened to be adhered to a surface of the article, so that the desired image is transferred onto the surface of the article.
    Type: Grant
    Filed: July 10, 1992
    Date of Patent: November 22, 1994
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Jun Sakai
  • Patent number: 5367047
    Abstract: Polyaspartate, useful for inhibition of incrustations due to materials causing hardness in water and of value in detergent formulations, can be prepared by reacting maleic acid or fumaric acid in a molar ratio of 1:1-2.1 at temperatures greater than 190.degree. C., followed by conversion of the polymer formed in this reaction to a salt of polyaspartic acid by basic hydrolysis.
    Type: Grant
    Filed: February 22, 1994
    Date of Patent: November 22, 1994
    Assignee: Srchem Incorporated
    Inventor: Louis L. Wood