Patents Examined by John N. Greaves
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Patent number: 5441818Abstract: An electro-deposition coated member comprises a substrate having thereon an electro-deposition coating film. The electro-deposition film contains a powder comprising a ceramic powder having an average particle diameter of from 0.1 to 5 .mu.m, the particle surfaces of which are coated with a metal, in an amount of from 5 to 50 parts by weight based on 100 parts by weight of the electro-deposition coating film. The electro-deposition coated member can be produced by a process comprising the steps of; subjecting a substrate to electro-deposition coating in a coating composition containing a resin feasible for electro-deposition and a powder comprising a ceramic powder having an average particle diameter of from 0.1 to 5 m, the particle surfaces of which are coated with a metal, the powder being contained in an amount of from 0.2 to 30 parts by weight based on from 100 to 150 parts by weight of the resin feasible for electro-deposition; and subsequently carrying out low-temperature curing.Type: GrantFiled: January 10, 1995Date of Patent: August 15, 1995Assignee: Canon Kabushiki KaishaInventor: Susumu Kadokura
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Patent number: 5441694Abstract: In a method for preparing a high .alpha.-type silicon nitride powder by adding to and mixing with metallic silicon powder a copper catalyst and nitriding the mixture in a non-oxidizing gas atmosphere containing nitrogen or ammonia at 1,000.degree. to 1,500.degree. C., the amount of copper catalyst is limited to from 0.05 % to less than 0.5 % by weight of copper based on the weight of the metallic silicon. There is obtained silicon nitride powder of high purity at low cost and high efficiency since the copper catalyst can be efficiently removed from the silicon nitride powder through conventional acid treatment.Type: GrantFiled: June 10, 1994Date of Patent: August 15, 1995Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Masanori Fukuhira, Hirofumi Fukuoka, Yoshiharu Konya, Masaki Watanabe
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Patent number: 5439712Abstract: A method for making a composite aluminum article comprises the steps of electrochemically or chemically adsorbing fine particles of a polytetrafluoroethylene to the surface of a hard anodic oxide film of an aluminum material or an aluminum alloy material, and drying the aluminum material or the aluminum alloy material. Thereafter, the aluminum material or the aluminum alloy material and an opposite member which slides along the aluminum material or the aluminum alloy material are rubbed together, and a lubricating film is thereby formed.Type: GrantFiled: March 1, 1994Date of Patent: August 8, 1995Assignees: Mitsubishi Jukogyo Kabushiki Kaisha, Okuno Chemical Industries Co., Ltd.Inventors: Takeshi Hattori, Kazuhiko Inogutt, Yukio Ohyama, Yutaka Nakagishi, Masaaki Sakaguchi
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Patent number: 5437834Abstract: A porous living body repairing member obtained by compression-molding a metal fiber material into a desired shape, sintering the fiber mesh body or thereafter, and imparting a compressive stress of not more than 4.00 to 40.0 MPa to provide a porous living body repairing member having a compressive elasticity of not more than 2000 MPa and a permanent deformation of not more than 1% under a stress below a compressive yield stress.The compressive yield stress becomes approximately equal to the above compressive stress, and almost complete elasticity of a permanent deformation rate of not more than 0.1% is shown with respect to a compressive stress below this compressive yield stress. Accordingly, even when the porous living body repairing member is used at a high compressive load site such as man's lumbar body, permanent deformation hardly occurs.Type: GrantFiled: October 7, 1993Date of Patent: August 1, 1995Assignee: Kyocera CorporationInventors: Hideaki Okimatsu, Yasunori Tamura
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Patent number: 5433917Abstract: Process for producing novel fluxed PZT dielectric ceramic compositions having sintering temperatures below about 1000.degree., so as to be non-reactive with electrode layers when co-fired therewith. The PZT is sintered with an effective amount of an eutectic mixture of CuO and an oxide of an alkaline earth metal, preferably barium oxide and/or strontium oxide, to reduce the sintering temperature of the PZT composition below about 1000.degree. C. Dopant such as manganese oxide may be added to reduce the dielectric losses.Type: GrantFiled: September 16, 1993Date of Patent: July 18, 1995Assignee: The Penn State Research FoundationInventors: Ashvin Srivastava, Amar Bhalla, L. Eric Cross
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Patent number: 5432011Abstract: The present invention relates to alloys in which the essential constituent is aluminum, metal deposits produced from these alloys, substrates coated with these alloys and the applications of these alloys. The alloys of the present invention are characterized in that they have the following atomic composition: Al.sub.a Cu.sub.b Co.sub.b, (B,C).sub.c M.sub.d N.sub.e I.sub.f, a+b+b'+c+d+e+f=100, expressed as number of atoms, a.gtoreq.50, 0.ltoreq.b<14, 0.ltoreq.b'.ltoreq.22, 0<b+b'.ltoreq.30, 0.ltoreq.c.ltoreq.5, 8.ltoreq.d.ltoreq.30, 0.ltoreq.e.ltoreq.4, f.ltoreq.2, where M represents one of more elements chosen from Fe, Cr, Mn, Ni, Ru, Os, Mo, V Mg, Zn and Pd; N represents one or more elements chosen from W, Ti, Zr, Hf, Rh, Nb, Ta, Y, Si, Ge and the rare earths; I represents the inevitable production impurities; and they contain at least 30% by mass of one or more quasicrystalline phases.Type: GrantFiled: September 8, 1994Date of Patent: July 11, 1995Assignee: Centre National de la Recherche ScientifiqueInventors: Jean-Marie DuBois, Antoine Pianelli
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Patent number: 5429791Abstract: An article and method of manufacture of a (Bi,Pb)--Sr--Ca--Cu--O superconductor comprisingcalcinating powders of superconductor precursors of PbO, Bi.sub.2 O.sub.3, SrCO.sub.3 or SrO, CaCO.sub.3 or CaO in air to obtain a 2223 superconductor lump and second phases;crushing the lump into powder;molding the powder into a superconductor body;disposing the body within silver powder to form a composite;molding the composite;heat treating the composite to increase the bond strength of the silver powder; andworking the composite into a useable shape by rolling and drawing while applying intermediate and final heat treatments to obtain a final product.Type: GrantFiled: June 23, 1994Date of Patent: July 4, 1995Assignees: Korea Atomic Energy Research Institute, Korea Electric Power CorporationInventors: Hee-Gyun Lee, Seon-Chil Kweon, Dong-Yeon Won, Gye-Won Hong
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Patent number: 5429876Abstract: Disclosed is a copper-lead based bearing material having excellent corrosion resistance, comprising a steel back metal and a bearing layer of a copper-lead based bearing alloy, the latter consisting essentially, by weight, 0.5 to 10% Bi, 0.5 to 8% Sn, 15 to 30% Pb, 2 to 10% Ni, not greater than 0.2% P, the balance Cu and incidental impurities.By adding Bi in a copper-lead based bearing alloy it becomes possible to obtain excellent corrosion resistance without impairing the conformability and seizure resistance of the bearing material in comparison with the conventional copper-lead based bearing alloys.Type: GrantFiled: April 12, 1994Date of Patent: July 4, 1995Assignee: Daido Metal Company Ltd.Inventors: Tadashi Tanaka, Masaaki Sakamoto, Koichi Yamamoto, Tsukimitsu Higuchi
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Patent number: 5429793Abstract: A process for producing metal oxide dispersion-strengthened anodes for use in fuel cells in which a metal alloy powder comprising at least one metal powder and at least one metal oxide forming phase is formed into a "green" cohesive structure. The "green" cohesive structure is heated in a sintering furnace resulting in simultaneous sintering and internal oxidizing of the oxide forming phase within the "green" cohesive structure, forming an oxide dispersion-strengthened structure. To promote simultaneous sintering of the "green" cohesive structure and internal oxidation of the oxide forming phase within the "green" cohesive structure, an oxidizing agent is disposed within the "green" cohesive structure or is applied to the exterior of the cohesive structure.Type: GrantFiled: May 17, 1994Date of Patent: July 4, 1995Assignee: Institute of Gas TechnologyInventors: Estela T. Ong, Nellie Burton-Gorman
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Patent number: 5427865Abstract: A solder preform (250) has solder particles of one alloy (210) arranged within a matrix of a second solder alloy (200). This arrangement forms a structure having the desired predetermined shape of the solder preform. The solder particles comprise one or more of the following elements: tin, lead, bismuth, indium, copper, antimony, cadmium, arsenic, aluminum, gallium, gold, silver. The particles have a predetermined melting temperature. The second solder alloy is compositionally distinct from the solder particles, and has a melting temperature that is lower than the melting temperature of the solder particles. The solder particles may comprise about 88% by weight of the solder preform, and the second solder alloy comprises about 12% by weight of the preform.Type: GrantFiled: May 2, 1994Date of Patent: June 27, 1995Assignee: Motorola, Inc.Inventors: William B. Mullen, III, Kingshuk Banerji, Edwin L. Bradley, III, Vahid Kazem-Goudarzi
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Patent number: 5425973Abstract: An integral overwrap protective system for a vehicle, e.g., a missile. Includes a filament wound fiber reinforced rubber matrix over a fiber-reinforced composite laminate which forms the vehicle inner skin and a final elastomeric outer coating. The integral overwrap avoids the bonding between vehicle skin and the protective system as in the present systems.Type: GrantFiled: December 27, 1985Date of Patent: June 20, 1995Assignee: McDonnell Douglas CorporationInventors: John R. Frangipane, Steven F. Stone, Robert F. Reizer
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Patent number: 5424027Abstract: A method for producing hot worked gamma titanium aluminide alloy articles which comprises the steps of:(a) providing a prealloyed gamma titanium aluminide alloy powder;(b) filling a suitable die or mold with the powder;(c) hot isostatic press (HIP) consolidating the powder in the filled mold at a pressure of 30 Ksi or greater and at a temperature below the alpha-two+gamma eutectoid temperature of the alloy to produce a preform;(d) hot working the preform at a temperature at or below the alpha-two+gamma eutectoid temperature of the alloy; and(e) optionally, heat treating the hot worked article.By hot working the preform at or below the alpha-two+gamma eutectoid temperature, the fine, uniform, isotropic microstructure of the preform is maintained, allowing a large metal flow and good shape definition with no edge cracking.Type: GrantFiled: December 6, 1993Date of Patent: June 13, 1995Assignee: The United States of America as represented by the Secretary of the Air ForceInventor: Daniel Eylon
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Patent number: 5424138Abstract: A copper-alloy slide bearing for a low-rigidity housing having a three-layer structure of a steel back-metal, a copper-alloy layer and an overlay, the back metal containing 0.03 to 0.26% by weight of carbon. During the production of the slide bearing, a bimetal is prepared in such a manner that a back-metal portion is rolled at a total rolling reduction of 10 to 35%, and the resultant bimetal is heat-treated at a relatively low temperature, so that the slide bearing includes a back metal having a 0.01% elastic limit of not less than 300 N/mm.sup.2. When the copper-alloy slide bearing is used in a low-rigidity housing of an internal combustion engine, the slide bearing is capable of more excellently following the deformation of the housing, as well as capable of providing more excellent intimate contact and more excellent fretting resistance, than a conventional multi-layer slide bearing.Type: GrantFiled: October 26, 1993Date of Patent: June 13, 1995Assignee: Daido Metal Co., Ltd.Inventors: Tadashi Tanaka, Masaaki Sakamoto, Koichi Yamamoto, Tsukimitsu Higuchi
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Patent number: 5419970Abstract: A method for making a composite aluminum article comprises the steps of electrochemically or chemically adsorbing fine particles of a polytetrafluoroethylene to the surface of a hard anodic oxide film of an aluminum material or an aluminum alloy material, and drying the aluminum material or the aluminum alloy material. Thereafter, the aluminum material or the aluminum alloy material and an opposite member which slides along the aluminum material or the aluminum alloy material are rubbed together, and a lubricating film is thereby formed.Type: GrantFiled: July 30, 1992Date of Patent: May 30, 1995Assignees: Mitsubishi Jukogyo Kabushiki Kaisha, Okuno Chemical Industries Co., Ltd.Inventors: Takeshi Hattori, Kazuhiko Inoguti, Yukio Ohyama, Yutaka Nakagishi, Masaaki Sakaguchi
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Patent number: 5418069Abstract: A formable composite magnetic flux concentrator is composed of about 65 to 90 percent ferromagnetic material, such as iron powder, and about 35 to 10 percent binder, the binder being a mixture of an epoxy and one or more catalysts. The concentrator is provided in a formable state as a putty-like body which can be worked into any desired shape dictated by the configuration of the induction heating coil used in a particular application.Type: GrantFiled: November 10, 1993Date of Patent: May 23, 1995Inventor: Thomas J. Learman
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Patent number: 5418070Abstract: An impregnated cathode comprising three layers: a very thin emitting surface layer of metal such as an alloy of tungsten with a high fraction of an activating metal of the platinum group to provide low workfunction; an underlying, thin buffer layer of porous tungsten alloyed with a fraction of activating metal, to retard diffusion loss of activating metal from the emitting layer; and a substrate of porous tungsten impregnated with barium aluminate.Type: GrantFiled: April 28, 1988Date of Patent: May 23, 1995Assignee: Varian Associates, Inc.Inventor: Michael C. Green
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Patent number: 5418071Abstract: In the present invention, metal silicide grains form an interlinked structure of a metal silicide phase, and Si grains which form a Si phase are discontinuously dispersed between the metal silicide phase to provide a sputtering target having a high density two-phased structure and having an aluminum content of 1 ppm or less. Because of the high density and high strength of the target, the generation of particles from the target during sputtering is reduced, and due to the reduced carbon content of the target, the mixing of carbon into the thin film during sputtering can be prevented.Type: GrantFiled: February 4, 1993Date of Patent: May 23, 1995Assignee: Kabushiki Kaisha ToshibaInventors: Michio Satou, Takashi Yamanobe, Takashi Ishigami, Mituo Kawai, Noriaki Yagi, Toshihiro Maki, Minoru Obata, Shigeru Ando
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Patent number: 5418072Abstract: A consumable brazing encapsulate is used for joining aluminum to metal surfaces, e.g. aluminum, copper, brass or steel surfaces, by brazing. The encapsulate comprises a mixture of particles of an eutectic forming metal selected from the group consisting of silicon, germanium, copper and zinc and particles of a brazing flux encapsulated in a layer or layers of aluminum or its alloys, said eutectic forming metal and flux being present in the following parts by weight per 100 parts by weight of the total aluminum in the encapsulate: (a) 7 to 15 parts of silicon and 7 to 45 parts of flux; (b) 25 to 120 parts of germanium and 100 to 250 parts of flux; (c) 40 to 70 parts of copper and 20 to 100 parts of flux; (d) 1300 to 2400 parts of zinc and 1000 to 2000 parts of flux; such that when the encapsulate is placed between aluminum surfaces to be joined and is heated, the eutectic forming metal and the encapsulating aluminum are totally converted in situ into an eutectic filler metal for joining the aluminum surfaces.Type: GrantFiled: September 20, 1993Date of Patent: May 23, 1995Assignee: Alcan International LimitedInventors: Antonio Baldantoni, Roland S. Timsit
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Patent number: 5415833Abstract: A method for forming molten carbonate fuel cell (MCFC) anodes by adjusting the reaction condition of pack cementation is disclosed. The method includes the steps of embedding a base metal sheet containing at least Ni in a pack containing alloy metal powder, an activator and a filler, pre-heating the pack to remove the organic material included in the base metal sheet, and maintaining the pack under a H.sub.2 /N.sub.2 atmosphere at a temperature of 500.degree. C. to 800.degree. C. for one to eight hours to form a Ni alloy. The method has a simplified procedure and is very useful to manufacture MCFC anodes having a very low creep deformation rate while porosity is in an appropriate range.Type: GrantFiled: March 31, 1994Date of Patent: May 16, 1995Assignee: Samsung Electronics Co., Ltd.Inventors: Ho-jin Kweon, Hai-soo Chun, Ha-chull Chung, Je-hong Youn, Gwun-pil Park
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Patent number: 5415944Abstract: A solder-clad printed circuit board (100) has solder particles of one alloy (120) arranged within a matrix of a second solder alloy (115). This arrangement forms a flat structure that is alloyed to the solder pads (105) on the substrate. The solder particles (120) have a predetermined melting temperature and are made from one or more of the following elements: tin, lead, bismuth, indium, copper, antimony, cadmium, arsenic, aluminum, gallium, gold, silver. The second solder alloy (115) is compositionally distinct from the solder particles, and has a melting temperature that is lower than the melting temperature of the solder particles. The solder particles may comprise about 88% by weight, and the second solder alloy may comprise about 12% by weight of the solder cladding.Type: GrantFiled: May 2, 1994Date of Patent: May 16, 1995Assignee: Motorola, Inc.Inventors: Vahid Kazem-Goudarzi, Edwin L. Bradley, III, Kingshuk Banerji, Henry F. Liebman