Patents Examined by Jon T. Schermerhorn, Jr.
  • Patent number: 11674757
    Abstract: The present disclosure is directed to systems and methods that transfer heat directly from hot particles to a cold fluid, such as sCO2, by bringing the hot particles and cold fluid into direct contact at the operating pressure of the cold fluid. These systems and methods can both stand-off large pressure differentials while allowing particles to pass through and limiting cold fluid leakage either continuously or through a batch process.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: June 13, 2023
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventor: Matthew D. Carlson
  • Patent number: 11639828
    Abstract: A heat exchanger for a gas turbine engine comprising a compressor, a combustor and a turbine. The heat exchanger comprising alternating hot and cold channels. Compressed air from the compressor flows through the cold channels and exhaust gas from the turbine flows through the hot channels. Each cold channel comprises first and second opposing surfaces conveying compressed air along a first path. Each cold channel comprises rows of vortex generators and pin fins extending from the first or second surfaces along the first path. The rows extend substantially perpendicular to the first path. Each hot channel is defined by a first and second opposing surfaces conveying exhaust gas along a second path substantially perpendicular to the first path. Each hot channel comprises rows of vortex generators and pin fins extending from the first or second surfaces along the second path. The rows extend substantially perpendicularly to the second path.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 2, 2023
    Assignee: Turbine Aeronautics IP Pty Ltd
    Inventors: Alex Wright, Ali Mahallati
  • Patent number: 11614285
    Abstract: Embodiments of the present disclosure are directed to a climate management system that includes a heat exchanger having a first set of microchannel coils fluidly coupled to a first circuit of the climate management system and a second set of microchannel coils fluidly coupled to a second circuit of the climate management system, where the first circuit and the second circuit are fluidly separate from one another, and where the first set of microchannel coils and the second set of microchannel coils are disposed in an alternating arrangement along a length of the heat exchanger such that the first set of microchannel coils and the second set of microchannel coils are interlaced in the heat exchanger.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: March 28, 2023
    Assignee: Johnson Controls Technology Company
    Inventors: Zhiwei Huang, Neelkanth S. Gupte
  • Patent number: 11612082
    Abstract: A cooling system for a data center includes an evaporative condenser, a pump cabinet and a heat exchange terminal. The pump cabinet has a first branch and a second branch, the first branch including a liquid storage tank and a fluorine pump. An input end of the liquid storage tank is connected to an output end of the evaporative condenser, an output end of the liquid storage tank is connected to an input end of the fluorine pump, and an output end of the fluorine pump is connected to an input end of the heat exchange terminal. The second branch includes a compressor with an input end connected to an output end of the heat exchange terminal and an output end connected to an input end of the evaporative condenser.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 21, 2023
    Assignee: Beijing Baidu Netcom Science Technology Co., Ltd.
    Inventors: Zhiming Luo, Yiyi Duan, Bin Yi, Xiaozhong Li
  • Patent number: 11611192
    Abstract: A device and method are provided for more efficient thermal management of optoelectronic devices. A microfluidic distribution apparatus embedded with the optoelectronic device uses a working fluid in phase change to passively remove heat from an optoelectronic device. The working fluid undergoes phase change through various conversions between a liquid state and a two-phase liquid-vapor state to facilitate evaporation and condensation processes as the working fluid is distributed through micro-structures in the embedded microfluidic distribution apparatus. Passive two-phase cooling provides high thermal performance due to the use of the latent heat of a fluid in phase change, as well as the presence of favorable two-phase flow regimes at micro-scale dimensions.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: March 21, 2023
    Assignee: Accelsius, LLC
    Inventors: Raffaele Luca Amalfi, Stefano Grillanda
  • Patent number: 11598591
    Abstract: The invention relates to a heat exchanger comprising first fluid inlets, first fluid outlets, second fluid inlets and second fluid outlets. Each of the first fluid inlets, the first fluid outlets, the second fluid inlets and the second fluid outlets are arranged on four different sides of a heat exchanger core. A manifold covers one of the four different sides of the heat exchanger core, wherein a first sidewall of the manifold is arranged at an angle smaller than 90 degree to the one side of the heat exchanger core which is covered by the manifold. An edge of the heat exchanger core between the one side of the heat exchanger core which is covered by the manifold and a neighbouring side of the four different sides of the heat exchanger core forms a common weld line with a connecting edge of the first sidewall of the manifold. The invention also relates to a method for manufacturing a heat exchanger comprising a heat exchanger core and a manifold.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: March 7, 2023
    Assignee: BOSAL EMISSION CONTROL SYSTEMS NV
    Inventor: Martijn Luyck
  • Patent number: 11578926
    Abstract: A tube sheet for a shell and tube heat exchanger. The tube sheet includes a substrate having a plurality of through holes; a plug made of a plug material located in each through hole, each plug having a through passage shaped to receive an end of a corresponding tube from the heat exchanger; and a lining made of a lining material, the lining encapsulates the substrate and fills a gap between each plug and the substrate.
    Type: Grant
    Filed: July 10, 2021
    Date of Patent: February 14, 2023
    Assignee: CG THERMAL, LLC
    Inventor: Ido Shimon
  • Patent number: 11578880
    Abstract: An HVAC system is provided. Embodiments of the present disclosure generally relate to heat exchangers having tubing with a reduced diameter compared to traditional systems. In one embodiment, a ducted HVAC system comprises an outdoor heat exchanger with tubing that has an outer diameter of eight millimeters (8 mm) or less and an indoor heat exchanger with tubing that has an outer diameter of nine millimeters (9 mm) or less. Additional systems, devices, and methods are also disclosed.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: February 14, 2023
    Assignee: Daikin Industries, Ltd.
    Inventors: Miki Yamada, Junichi Shimoda, Takamune Okui, Yuko Ishida, Joseph Kelly Hearnsberger, David Palazzolo, Sriram Venkat
  • Patent number: 11581236
    Abstract: Systems for cooling semiconductor devices that can comprise a heatsink and a cleaning element for the heatsink. The heatsink can have fins spaced apart from each other by channels. The cleaning element can have a base and one or more arms extending from the base. The cleaning element can be positioned with respect to the heatsink such that each arm is aligned with a corresponding channel between the fins, and the arms are moveable between a flow configuration in which the arms are in the channels and a cleaning configuration in which the arms are outside of the channels.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: February 14, 2023
    Assignee: Micron Technology, Inc.
    Inventor: Maksim Kuzmenka
  • Patent number: 11573057
    Abstract: Heat exchanger comprising at least a first plate (11) and at least a second plate (12) overlapping and reciprocally joined to each other in correspondence with respective coupling surfaces (13). Between the coupling surfaces (13), at least one passage channel (14) for a heat-carrying fluid is made, by deforming at least one of the two plates (11, 12).
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: February 7, 2023
    Assignee: C.G.A. TECHNOLOGIES S.R.L.
    Inventor: Giorgio Colugnati
  • Patent number: 11570936
    Abstract: A cooling system configured to remove heat from a chimney of a server cabinet. The system includes a first heat exchanger unit in the chimney of the server cabinet. The first heat exchanger has a fluid inlet for receiving a working fluid and a fluid outlet for discharging the working fluid. The first heat exchanger also has an upstream surface receiving waste heat generated by one or more servers and a downstream surface that discharges air cooled by the first heat exchanger. The upstream surface is generally perpendicular to the downstream surface.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: January 31, 2023
    Assignee: United Services Automobile Association (USAA)
    Inventors: John Andrew Weems, Raymond F. Martin
  • Patent number: 11566591
    Abstract: Disclosed is an air intake manifold including a heat exchanger built into its body and including at least two ducts for supplying and removing heat-exchange liquid, the ducts extending through the wall of the body of the manifold with a liquid-tight seal and an airtight seal, which are distinct and mutually offset along the longitudinal axis of the relevant duct being created on each of the ducts. The unit creating the liquid tight seal is arranged between the relevant duct and a circulation pipe connected to the free end of the duct. The unit creating the airtight seal is positioned between the relevant duct and the body of the distributor. A leakage path associated with the liquid-tight seal is created between the latter and the airtight seal.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: January 31, 2023
    Assignee: SOGEFI AIR & COOLING
    Inventors: François Burckel, Nicolas Becker, Benoît Ancel, Michel Andres
  • Patent number: 11555659
    Abstract: A heat exchanger core includes a first side, a second side, a third side, and a fourth side. A first layer includes a first width extending in a first direction, a first length extending in a second direction, a first height extending in a third direction, and a first plurality of passages, which extend from an inlet to an outlet. A second layer includes a second width extending in the first direction, a second length extending in the second direction, a second height extending in the third direction, and a second plurality of passages extending from the first side to the second side. The first and second plurality of passages are adjacent to one another. The first and second plurality of passages include a sinusoidal profile in the third direction and a sinusoidal profile in the first direction.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: January 17, 2023
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Matthew E. Lynch, Evan J. Butcher, Lawrence A. Binek
  • Patent number: 11549760
    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: January 10, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Li-Kuang Tan
  • Patent number: 11549761
    Abstract: A system or method for thermal storage includes a recess or containment unit having a first storage layer and a second storage layer comprising a permeable filler material. An intermediate layer is disposed between the storage layers. A primary well traverses the layer in the recess. The primary well is in thermal communication with the first permeable filler material and the second permeable filler material. A heat source is provided for heating an inlet fluid. An input pump is in fluid communication with the primary well and the heat source. The primary well receives heated inlet fluid from the inlet pump and injects the fluid into the second layers. The heated inlet fluid transfers heat to the respective permeable filler material radially from the primary well toward an outer periphery of the thermocline recess.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: January 10, 2023
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Clifford K. Ho, Paul Gauche, Hendrik F. Laubscher
  • Patent number: 11553621
    Abstract: A heat dissipation base includes a fixing plate and a metal heat conduction block. The fixing plate includes a plurality of heat pipe partitions and a plurality of heat pipe fixing openings, and the heat pipe fixing openings are formed between the heat pipe partitions. The metal heat conduction block is fixed to the fixing plate, and the fixing plate further includes a plurality of supporting portions to support shear surfaces at two ends of the heat conduction block.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: January 10, 2023
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Cheng-Ju Chang, Ming-Yuan Lo, Ching-An Liu
  • Patent number: 11542440
    Abstract: A tube for a steam cracking furnace comprising: at least one downstream tubular segment of circular section having a main diameter; at least one twisted tubular segment having a length less than a quarter of the length of the tube, and comprising: a central part with an elliptical or lobed section, having a helical pitch between one times and ten times the main diameter, and an aspect ratio of the elliptical or lobed section between 0.5 and 0.8; an upstream transition part establishing a geometric transition between the central part and a tubular segment of circular section; a downstream transition part establishing a geometric transition between the central part and the downstream tubular segment, with a fluid being intended to flow from the upstream transition part to the downstream transition part.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: January 3, 2023
    Assignees: Centre National de la Recherche Scientifique
    Inventors: Bruce Indurain Y Urricelqui, Sylvain Lalot, Mathieu Couvrat, François Beaubert, David Uystepruyst
  • Patent number: 11543189
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: January 3, 2023
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
  • Patent number: 11530879
    Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: December 20, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia Yu Lin, Shan-Yin Cheng
  • Patent number: 11525633
    Abstract: A heat exchanger with a monocoque structure transfers heat between a first fluid and a second fluid. The heat exchanger in has a plurality of tubes through which the first fluid may flow in a direction, each of the plurality of tubes has a first mouth end, an N opposing second mouth end and a waist region between the first mouth end and the second mouth end. The heat exchanger also has one or more interconnected fluid channels through which the second fluid may flow, the one or more fluid channels lay generally in a plane, the plurality of tubes and the one or more fluid channels interleave such that heat may be transferred between the plurality of tubes and the one or more fluid channels, and the direction of flow of the first fluid is generally perpendicular to the plane of the one or more fluid channels.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: December 13, 2022
    Assignee: The Penn State Research Foundation
    Inventors: Robert M. Keolian, Kevin J. Bastyr, Ray Scott Wakeland, John Feurman Brady