Patents Examined by Jon T. Schermerhorn, Jr.
  • Patent number: 11754343
    Abstract: Embodiments of the disclosure relate to an electronic assembly including a substrate having a first surface and a second surface opposite to the first surface and one or more electronic devices bonded to the first surface of the substrate. A first heat-storing region is embedded within the substrate and proximate to the second surface. The first heat-storing region comprises a phase change material encapsulated by an encapsulating layer. A melting temperature of the encapsulating layer is higher than a melting temperature of the phase change material and a maximum operating temperature of the one or more electronic devices. A heat transfer layer is embedded within the substrate and thermally connects the first heat-storing region to the one or more electronic devices.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: September 12, 2023
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Ercan M. Dede
  • Patent number: 11754340
    Abstract: The invention deals with a heat exchanger tube (1) for use in a heat exchanger tube (1) of a motor vehicle, the heat exchanger tube (1) comprising a pair (2) of plates (3) elongating along a longitudinal plan (A), the pair (2) of plates (3) comprising a first plate (3) and a second plate (4) joined to each other to form an inner area (5) dedicated to refrigerant fluid (RF) circulation and divided in at least six channels (6), at least one channel (6) is defined by a cross section area (S) that has a length (L), at least one of the plate is defined by a thickness (T) measured between an internal wall (7) of the plate and an external wall (8) of the plate opposed to the internal wall (7), wherein said thickness (T) is between 0.190 mm and 0.300 mm and said length (L) is between 2 mm and 5 mm.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: September 12, 2023
    Assignee: VALEO VYMENIKY TEPLA S. r. o.
    Inventors: Jakub Jirsa, Jan Forst, Florencio Gonzalez
  • Patent number: 11737238
    Abstract: A cooling system configured to remove heat from a chimney of a server cabinet. The chimney has an extending portion extending above the server rack including a chimney heat exchanger in the extending portion above the server rack. The chimney heat exchanger has a fluid inlet for receiving a working fluid and a fluid outlet for discharging the working fluid. The chimney heat exchanger also has an upstream surface receiving warm waste heat generated by one or more servers and a downstream surface that discharges cooled air cooled by the chimney heat exchanger. The server rack may be accessed through the chimney without requiring movement of the chimney heat exchanger.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: August 22, 2023
    Assignee: United Services Automobile Association (USAA)
    Inventors: John Andrew Weems, Raymond F. Martin
  • Patent number: 11725885
    Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: August 15, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia Yu Lin, Shan-Yin Cheng
  • Patent number: 11725883
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: August 15, 2023
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
  • Patent number: 11725890
    Abstract: In some respects, concepts disclosed herein generally concern systems, methods and components to detect a presence of a liquid externally of a desired primary flow path through a segment of a fluid circuit, e.g., throughout a cooling loop. Some disclosed concepts pertain to systems, methods, and components to direct seepage or leakage of a liquid coolant toward a lead-detection sensor. As but one example, some disclosed liquid-cooled heat exchangers incorporate a leak-detection sensor, which, in turn, can couple with a computing environment that monitors for detected leaks, and, responsive to an indication of a detected leak, invokes a task to control or to mitigate the detected leak.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: August 15, 2023
    Assignee: CoolIT Systems, Inc.
    Inventors: Mike Holden, Seyed Kamaleddin Mostafavi Yazdi, Randy Kubik
  • Patent number: 11719141
    Abstract: A system may include a turbine and a recuperative heat exchanger system. The recuperative heat exchanger system is configured to receive exhaust gases from the turbine. The recuperative heat exchanger system may include a precool section to cool the exhaust gases, a major heating section to receive the cooled the exhaust gases, and a minor heating section to receive the cooled the exhaust gases.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: August 8, 2023
    Assignee: LUMMUS TECHNOLOGY LLC
    Inventors: Richard John Jibb, David Guymon, Ron Herbanek, Vincenzo Marco Brignone, Roberto Groppi
  • Patent number: 11718423
    Abstract: An insert for a condensing heat exchanger, having: a body extending aft from a forward end to an aft end, and defining: a body exterior surface; a forward segment that extends aft from the forward end of the insert to a first axial location between the forward and aft ends of the insert, along the forward segment the body exterior surface is without openings; a middle segment that extends aft from the first axial location to a second axial location, along the middle segment the body exterior surface is cylindrical; and an aft segment that extends aft from the second axial location to the aft end of the insert, along the aft segment the body exterior surface of the body is cylindrical and defines axially extending grooves, and the grooves are spaced apart from each other and extend forward from the aft end of the insert to the middle segment.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: August 8, 2023
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventor: Wei-Lin Cho
  • Patent number: 11709021
    Abstract: A thermal management system and method includes a body having an inlet and an outlet configured to direct a first fluid into and out of the body. The body incudes a channel that is fluidly separate from the inlet and the outlet. A second fluid is directed through the channel. A conduit assembly is fluidly coupled with the inlet and the outlet. The conduit assembly includes plural fluidly separate conduits. Each of the plural conduits extend between a corresponding first end and a corresponding second end along a corresponding tortuous path. The plural conduits are intertwined with each other between the first ends and the second ends. The plural conduits are positioned such that the second fluid flowing through the channel passes over the plural conduits and exchanges thermal energy with the first fluid that moves within each of the plural conduits.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: July 25, 2023
    Assignee: TRANSPORTATION IP HOLDINGS, LLC
    Inventor: Balaji Hosadurgam Ravindranath
  • Patent number: 11692777
    Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: July 4, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia Yu Lin, Shan-Yin Cheng
  • Patent number: 11674757
    Abstract: The present disclosure is directed to systems and methods that transfer heat directly from hot particles to a cold fluid, such as sCO2, by bringing the hot particles and cold fluid into direct contact at the operating pressure of the cold fluid. These systems and methods can both stand-off large pressure differentials while allowing particles to pass through and limiting cold fluid leakage either continuously or through a batch process.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: June 13, 2023
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventor: Matthew D. Carlson
  • Patent number: 11639828
    Abstract: A heat exchanger for a gas turbine engine comprising a compressor, a combustor and a turbine. The heat exchanger comprising alternating hot and cold channels. Compressed air from the compressor flows through the cold channels and exhaust gas from the turbine flows through the hot channels. Each cold channel comprises first and second opposing surfaces conveying compressed air along a first path. Each cold channel comprises rows of vortex generators and pin fins extending from the first or second surfaces along the first path. The rows extend substantially perpendicular to the first path. Each hot channel is defined by a first and second opposing surfaces conveying exhaust gas along a second path substantially perpendicular to the first path. Each hot channel comprises rows of vortex generators and pin fins extending from the first or second surfaces along the second path. The rows extend substantially perpendicularly to the second path.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 2, 2023
    Assignee: Turbine Aeronautics IP Pty Ltd
    Inventors: Alex Wright, Ali Mahallati
  • Patent number: 11614285
    Abstract: Embodiments of the present disclosure are directed to a climate management system that includes a heat exchanger having a first set of microchannel coils fluidly coupled to a first circuit of the climate management system and a second set of microchannel coils fluidly coupled to a second circuit of the climate management system, where the first circuit and the second circuit are fluidly separate from one another, and where the first set of microchannel coils and the second set of microchannel coils are disposed in an alternating arrangement along a length of the heat exchanger such that the first set of microchannel coils and the second set of microchannel coils are interlaced in the heat exchanger.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: March 28, 2023
    Assignee: Johnson Controls Technology Company
    Inventors: Zhiwei Huang, Neelkanth S. Gupte
  • Patent number: 11611192
    Abstract: A device and method are provided for more efficient thermal management of optoelectronic devices. A microfluidic distribution apparatus embedded with the optoelectronic device uses a working fluid in phase change to passively remove heat from an optoelectronic device. The working fluid undergoes phase change through various conversions between a liquid state and a two-phase liquid-vapor state to facilitate evaporation and condensation processes as the working fluid is distributed through micro-structures in the embedded microfluidic distribution apparatus. Passive two-phase cooling provides high thermal performance due to the use of the latent heat of a fluid in phase change, as well as the presence of favorable two-phase flow regimes at micro-scale dimensions.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: March 21, 2023
    Assignee: Accelsius, LLC
    Inventors: Raffaele Luca Amalfi, Stefano Grillanda
  • Patent number: 11612082
    Abstract: A cooling system for a data center includes an evaporative condenser, a pump cabinet and a heat exchange terminal. The pump cabinet has a first branch and a second branch, the first branch including a liquid storage tank and a fluorine pump. An input end of the liquid storage tank is connected to an output end of the evaporative condenser, an output end of the liquid storage tank is connected to an input end of the fluorine pump, and an output end of the fluorine pump is connected to an input end of the heat exchange terminal. The second branch includes a compressor with an input end connected to an output end of the heat exchange terminal and an output end connected to an input end of the evaporative condenser.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 21, 2023
    Assignee: Beijing Baidu Netcom Science Technology Co., Ltd.
    Inventors: Zhiming Luo, Yiyi Duan, Bin Yi, Xiaozhong Li
  • Patent number: 11598591
    Abstract: The invention relates to a heat exchanger comprising first fluid inlets, first fluid outlets, second fluid inlets and second fluid outlets. Each of the first fluid inlets, the first fluid outlets, the second fluid inlets and the second fluid outlets are arranged on four different sides of a heat exchanger core. A manifold covers one of the four different sides of the heat exchanger core, wherein a first sidewall of the manifold is arranged at an angle smaller than 90 degree to the one side of the heat exchanger core which is covered by the manifold. An edge of the heat exchanger core between the one side of the heat exchanger core which is covered by the manifold and a neighbouring side of the four different sides of the heat exchanger core forms a common weld line with a connecting edge of the first sidewall of the manifold. The invention also relates to a method for manufacturing a heat exchanger comprising a heat exchanger core and a manifold.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: March 7, 2023
    Assignee: BOSAL EMISSION CONTROL SYSTEMS NV
    Inventor: Martijn Luyck
  • Patent number: 11578880
    Abstract: An HVAC system is provided. Embodiments of the present disclosure generally relate to heat exchangers having tubing with a reduced diameter compared to traditional systems. In one embodiment, a ducted HVAC system comprises an outdoor heat exchanger with tubing that has an outer diameter of eight millimeters (8 mm) or less and an indoor heat exchanger with tubing that has an outer diameter of nine millimeters (9 mm) or less. Additional systems, devices, and methods are also disclosed.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: February 14, 2023
    Assignee: Daikin Industries, Ltd.
    Inventors: Miki Yamada, Junichi Shimoda, Takamune Okui, Yuko Ishida, Joseph Kelly Hearnsberger, David Palazzolo, Sriram Venkat
  • Patent number: 11581236
    Abstract: Systems for cooling semiconductor devices that can comprise a heatsink and a cleaning element for the heatsink. The heatsink can have fins spaced apart from each other by channels. The cleaning element can have a base and one or more arms extending from the base. The cleaning element can be positioned with respect to the heatsink such that each arm is aligned with a corresponding channel between the fins, and the arms are moveable between a flow configuration in which the arms are in the channels and a cleaning configuration in which the arms are outside of the channels.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: February 14, 2023
    Assignee: Micron Technology, Inc.
    Inventor: Maksim Kuzmenka
  • Patent number: 11578926
    Abstract: A tube sheet for a shell and tube heat exchanger. The tube sheet includes a substrate having a plurality of through holes; a plug made of a plug material located in each through hole, each plug having a through passage shaped to receive an end of a corresponding tube from the heat exchanger; and a lining made of a lining material, the lining encapsulates the substrate and fills a gap between each plug and the substrate.
    Type: Grant
    Filed: July 10, 2021
    Date of Patent: February 14, 2023
    Assignee: CG THERMAL, LLC
    Inventor: Ido Shimon
  • Patent number: 11573057
    Abstract: Heat exchanger comprising at least a first plate (11) and at least a second plate (12) overlapping and reciprocally joined to each other in correspondence with respective coupling surfaces (13). Between the coupling surfaces (13), at least one passage channel (14) for a heat-carrying fluid is made, by deforming at least one of the two plates (11, 12).
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: February 7, 2023
    Assignee: C.G.A. TECHNOLOGIES S.R.L.
    Inventor: Giorgio Colugnati