Abstract: The present disclosure provides a flexible integrated array sensor and manufacturing methods thereof. The array sensor includes a silicon wafer, a readout circuit layer, a sensing array layer, and a polymer substrate layer disposed on the silicon wafer. The manufacturing method includes: preparing a silicon wafer; fabricating a plurality of function arrays, each including m*n function units, on a surface of the silicon wafer; etching one or more deep grooves on the surface of the silicon wafer between the arrays; fabricating a thinning support; and thinning a bottom surface of the silicon wafer to a target thickness so that the arrays are separated from each other. The etching depth for etching the one or more deep grooves is equal to or greater than the thickness of the silicon wafer after thinning.

Abstract: The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.

Abstract: A robotic system for laying out a specified wiring harness. A robotic arm is configured to arrange a plurality of wire segments along the harness support surface. A system controller is configured to direct the robotic arm to arrange each of the plurality of wire segments on the harness support surface along a specified wire route. A preparation device can label one or both ends of each wire segment as they are being laid out on the support surface. The labeler can automatically apply adhesive labels as flags at selected locations along the length of the wire segment. In a method of making a wiring harness, the robotic arm positions pins on a harness support surface to define wire routes and then arranges at least one wire segment on the harness support surface along each of the wire routes.

Abstract: A method of manufacturing a piezoelectric actuator includes preparing a laminate including a substrate, a first electrode layer disposed on the substrate, a piezoelectric layer disposed on the first electrode layer, and a second electrode layer disposed on the piezoelectric layer, and forming a contour shape of the piezoelectric layer. The forming of the contour shape includes dry etching the piezoelectric layer from the second electrode layer side to dig the piezoelectric layer halfway in a thickness direction, covering, with a resist film, a dry etched surface formed on a side surface of the piezoelectric layer by the dry etching, and wet etching the piezoelectric layer from the second electrode layer side to dig the piezoelectric layer until the first electrode layer is reached.

Abstract: There is provided a wiring harness assembly comprising a main trunk cable assembly, a branch cable assembly and at least one connector. The main trunk assembly defines opposite terminal ends and comprises main trunk wires. The branch cable assembly defines opposite terminal ends and comprises branch wires. The connector connects the main trunk cable assembly and the branch cable assembly. The connector comprises an outer housing with an inner wiring harness positioned therein. The wiring harness comprises main trunk wire segments and branch wire segments interconnected at mutual connecting points. The main trunk wire segments define terminal ends connected to the main trunk wires at one of the terminal ends of the main trunk cable assembly. The branch wire segments define terminal ends connected to the branch wires at one of the terminal ends of the branch cable assembly.

Abstract: An electrical contact part comprising, a carrier substrate of a metallic material, a metallic coating applied to the carrier substrate, and a coating barrier material applied to the carrier substrate in a partial area of the carrier substrate, wherein the coating barrier material substantially prevents coating of the carrier substrate in the portion.

Abstract: Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway.

Abstract: Embodiments disclosed herein include electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first substrate and a plurality of first conductive pads on the first substrate. In an embodiment, the electronics package further comprises a second substrate and a plurality of second conductive pads on the second substrate. In an embodiment, the electronics package further comprises a plurality of interconnects between the first and second substrate. In an embodiment, each interconnect electrically couples one of the first conductive pads to one of the second conductive pads. In an embodiment, the interconnects comprise strands of conductive material that are woven on themselves to form a mesh-like structure.

Abstract: An apparatus for assembling a coil includes a blade inserted into a slot of a stator core in a state where insulating paper is inserted into the slot. In a method for assembling the coil, the insulating paper is inserted into the slot of the stator core, the blade is inserted into the slot into which the insulating paper is inserted, the coil is inserted into the slot into which the blade is inserted, the coil being inserted in a direction opposite to a direction in which the blade is inserted. When the coil is inserted into the slot, the blade is pulled out from the slot along with the insertion of the coil into the slot.

Abstract: A method of producing an electrically conductive line, the method including providing a substrate, printing a first layer on the substrate, applying a powdered conductive material to the first layer, and bonding the powdered conductive material to the first layer.

Abstract: A method of manufacturing an inductor element includes preparing an insert member including a winding portion where a conductor is wound in a coil shape. A plurality of preliminary green compacts is obtained by conducting a preliminary compression molding of a granule containing a magnetic powder and a resin at a pressure of 2.5×102 to 1×103 MPa. The insert member and the plurality of preliminary green compacts are integrated so that a joint interface of the plurality of preliminary green compacts is formed intermittently.

Abstract: A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.

Abstract: The present invention provides a method for manufacturing a variable speed accelerator including: a preparation step of preparing a variable speed electric motor 71 including a variable speed rotor 72 in which a shaft insertion hole 74 extending in a horizontal direction is formed, a first variable speed rotor bearing 85i and a second variable speed rotor bearing 85o that rotatably support the variable speed rotor 72 by aligning an axial direction of the variable speed rotor 72 in the horizontal direction, and a variable speed stator 86 that surrounds the variable speed rotor 72 from an outer circumferential side; and a shaft insertion step of inserting a constant speed shaft 77 into the shaft insertion hole 74 of the variable speed rotor 72 in the horizontal direction so as to penetrate the variable speed rotor 72 after the preparation step.

Abstract: An information processing device configured to determine a mounting position of a tape feeder to any one of multiple feeder mounting sections formed in a work machine, in which mounting positions of two or more tape feeders configured to supply components of holding target held by two or more holding tools of a work head disposed in the work machine are determined to any one of the multiple feeder mounting sections based on position information indicating supply positions of the two or more tape feeders, so that a difference in an amount of deviation of the supply positions of the two or more tape feeders is within a predetermined range.

Abstract: A wire harness manufacturing system including a plurality of processing zones and configured to manufacture a wire harness by using a subassembly including a plurality of electrical lines to each of which a connection component is attached includes a conveyance device provided along the plurality of processing zones and including: work boards in a number at least corresponding to the number of the plurality of processing zones; a circulation conveyer configured to sequentially convey each work board in a horizontal state from an upstream side to a downstream side on a downstream conveyance path along the plurality of processing zones and then return the work board from the downstream side to the upstream side on an upstream conveyance path; and a raiser configured to set the work board to a stand-up state in which one of edge parts extending in a conveyance direction of the work board is positioned on an upper side of the other edge part in the work board, and to set the work board in the stand-up state to th

Abstract: The embodiment of the disclosure provides a composite layer circuit element and a manufacturing method thereof. The manufacturing method of the composite layer circuit element includes the following. A carrier is provided. A first dielectric layer is formed on the carrier, and the first dielectric layer is patterned. The carrier on which the first dielectric layer is formed is disposed on a first curved-surface mold, and the first dielectric layer is cured. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer is patterned. The carrier on which the first dielectric layer and the second dielectric layer are formed is disposed on a second curved-surface mold, and the second dielectric layer is cured. A thickness of a projection of the first curved-surface mold is smaller than a thickness of a projection of the second curved-surface mold.

Abstract: Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.

Abstract: In accordance with embodiments of the present disclosure, a tool may include a main body and a plurality of fingers extending from one side of the main body, the fingers arranged in a plurality of rows and a plurality of columns such that in each of the plurality of rows, each pair of adjacent fingers in a row may have a gap formed in between such pair of adjacent fingers such that each gap may receive a component for insertion or removal from a system and such that the adjacent fingers apply a force to the component to retain the component within the tool. The tool may also include a receptacle formed at one end of the main body and configured to receive a removable arm, and wherein the removable arm is configured to receive a plurality of removable fingers.

Abstract: An apparatus includes an extruding device configured to dispense a dielectric material though an orifice, a wire feed device configured to feed a conductive wire through the orifice, and a cutting device configured to sever the wire. It also includes an electronic controller configured to control the extruding device, the wire feed device, and the cutting device. The electronic controller commands the extruding device to dispense the dielectric material though the orifice, the wire feed device to feed the wire through the orifice, and the cutting device to sever the wire, thereby forming a dielectric substrate encasing a plurality of wires. The electronic controller further commands the extruding device to form an opening defined in the substrate in which plurality of electrically conductive wires is exposed and a location feature on the substrate located with a positional tolerance less than or equal to 1 mm relative to the opening.

Abstract: A method for preparing a piezoelectric film includes: coating a solution containing a piezoelectric polymer and a solvent on a substrate to obtain a film, wherein the piezoelectric polymer is a copolymer of vinylidene fluoride and trifluoroethylene; and annealing the film at a temperature ranging from 122° C. to 133° C., to obtain the piezoelectric film.