Abstract: This disclosure provides systems, methods, and apparatuses, for producing an electrical apparatus. In one aspect of the disclosure, a method includes identifying a first electrical apparatus including a first winding configured to receive a first voltage, the first winding including a first electrical coil and a second coil coupled in series. The method also includes determining, based on a reduction rate, one or more characteristics of a second electrical apparatus including a second winding configured to receive the first voltage, the second winding including a third electrical coil and a fourth coil coupled in parallel. Each of the first coil and the second coil including a first number of turns and each of the third coil and the fourth coil including a second number of turns. The reduction rate is associated with a ratio based on a reducing number of turns and the first number of turns.

Abstract: A method for manufacturing a shaker device using 3D-printing (i.e., additive manufacturing). An electromagnet is formed by producing a bobbin body and winding an electrical conductor on the bobbin body to form an electromagnet coil. A cylindrical body is 3D-printed and the bobbin body with the electromagnet coil is coupled within an interior of the cylindrical body. A piston assembly is then positioned within the bobbin assembly. The shaker device is operated by controllably applying a magnetic field through the electromagnet coil that impinges a permanent magnet of the piston assembly to cause movement of the cylindrical body relative to the piston. By using these 3D printing techniques, the composition of materials can be varied within a single component part, fine structural details can be included in the components, and components can be 3D printed directly on each other to eliminate tolerance issues relating to small variations in component size.

Abstract: Cold-sprayed aluminum capacitors on lead frame metal foils are provided for applications in 3D power package integration. This additive manufacturing process allows pre-patterned low-temperature processing of aluminum electrodes on metal lead frames, insulated metal substrates or even heat-spreaders and cold-plates. Cold-sprayed capacitors can eliminate several process integration and reliability issues that are associated with traditional discrete surface-assembled capacitors.

Abstract: An acoustic resonator device is formed using a wafer-to-wafer bonding process by etching recesses into a first surface of a piezoelectric substrate, a depth of the recesses greater than a target piezoelectric membrane thickness; then wafer-to-wafer bonding the first surface of the piezoelectric substrate to a handle wafer using a releasable bonding method. The piezoelectric substrate is then thinned to the target piezoelectric membrane thickness to form a piezoelectric plate and at least one conductor pattern is formed on the thinned piezoelectric plate. The side of the thinned piezoelectric plate having the conductor pattern is bonded to a carrier wafer using a metal-to-metal wafer bonding process and the handle wafer is removed.

Abstract: Methods of fabricating resonator and filter devices. A first conductor pattern formed on a front surface of a piezoelectric plate includes a first plurality of contact pads and an interdigital transducer (IDT). The IDT and the piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. An acoustic Bragg reflector is between a substrate and a back surface of the piezoelectric plate, the acoustic Bragg reflector configured to reflect the shear primary acoustic mode. A second conductor pattern including a second plurality of contact pads is formed on a back surface of the interposer. The first plurality of contact pads is directly connected to respective contact pads of the second plurality of contact pads. A perimeter of the acoustic resonator chip is sealed to a perimeter of the interposer.

Abstract: Resonator and filter devices and methods of fabrication. A resonator chip includes a substrate, a piezoelectric plate, and an acoustic Bragg reflector between the substrate and a back surface of the piezoelectric plate. A conductor pattern on a front surface of the piezoelectric plate includes a first plurality of contact pads and an interdigital transducer (IDT). The IDT and the piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. The acoustic Bragg reflector is configured to reflect the shear primary acoustic mode. An interposer has a second plurality of contact pads on a back surface. A seal connects a perimeter of the piezoelectric plate to a perimeter of the interposer. Each contact pad of the first plurality of contact pads is directly connected to a respective contact pad of the second plurality of contact pads.

Abstract: A device for adhering magnetic pole shoes on a rotor includes a soleplate, wherein a support seat is arranged on the soleplate; a magnet positioning seat is arranged above the support seat; the magnet positioning seat has a support frame, which includes an upper plate and a lower plate, with the lower plate having a first evading groove for evading a rotor core, and the upper plate having a second evading groove for evading an upper end of a rotor shaft; and fixation units and a plurality of positioning plates being provided between the upper and lower plates, each fixation unit including a push rod in sliding fit with the support frame and the push rod can move axially, a magnet positioning block being fixed at an inner end of the push rod, each positioning plate being located between two adjacent fixation units.

Abstract: A method of manufacturing a plurality of conductor elements includes providing the plurality of conductor elements, each conductor element includes a conductor end section having an electrically insulating surface coating; securing the conductor end sections of the conductor elements with respect to each other; and simultaneously removing at least a portion of the electrically insulating surface coatings of the conductor end sections using a machining surface of a stripping tool being moved along the conductor end sections.

Abstract: In an embodiment a method includes cutting a material coil by a predetermined length, forming a vertex and inclined portions on the material coil, loading the vertex and the inclined portion so as to be interposed between an upper mold and a lower mold, forming the vertex into a front/rear bent portion so that the inclined portions are positioned on different lines based on the vertex by combining the upper and lower molds, loading ends of the inclined portions so as to be interposed between clamping pins and rotating a clamping part so that the inclined portions are rounded in front and rear directions.

Abstract: Systems and methods to form concentrated motor windings may include bending wires into a U-shape, inserting the wires onto a stator pole, bending ends of the wires around the stator pole, and welding respective pairs of the ends of the bent wires. In some example embodiments, the U-shape may include a twist along a central portion thereof. In other example embodiments, a twist may be introduced along the respective pairs of bent ends of the wires that are then welded. In addition, the wires may be stacked and laterally inserted onto the stator pole. Further, the wire bending, twisting, insertion, welding, and other forming processes may be performed by automated or robotic machinery or equipment.

Abstract: A method for assembling a generator rotor carrying permanent magnets defining a magnetic field and a generator stator defining an armature having a plurality of coils includes moving one or both of the generator rotor and the generator stator towards the other of the generator stator and the generator rotor to generate relative movement between the generator rotor and the generator stator. Simultaneously with the relative movement, the coils of the armature are electrically feed such that circulating currents along the armature create a magnetic field in an opposite direction of the magnetic field created by the permanent magnets to reduce a magnetic attraction between the generator rotor and the generator stator.

Abstract: Solid-state devices including a layer of a superconductor material epitaxially grown on a crystalline high thermal conductivity substrate, the superconductor material being one of TiNx, ZrNx, HfNx, VNx, NbNx, TaNx, MoNx, WNx, or alloys thereof, and one or more layers of a semiconducting or insulating or metallic material epitaxially grown on the layer of superconductor material, the semiconducting or insulating material being one of a Group III N material or alloys thereof or a Group 4b N material or SiC or ScN or alloys thereof.

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

Abstract: Cold-sprayed aluminum capacitors on lead frame metal foils are provided for applications in 3D power package integration. This additive manufacturing process allows pre-patterned low-temperature processing of aluminum electrodes on metal lead frames, insulated metal substrates or even heat-spreaders and cold-plates. Cold-sprayed capacitors can eliminate several process integration and reliability issues that are associated with traditional discrete surface-assembled capacitors.

Abstract: Methods and systems for a dielectric material coated busbar are provided. In one example, a conductive material may be formed into a shape of a busbar and portions of the busbar may be selectively coated with a dielectric material which may be both electrically insulating and thermally conductive. The dielectric coated portions of the busbar may dissipate heat to a heat sink via a thermal interface material compressed on the busbar.

Abstract: A placement head for automatically placing electronic components on a component carrier. The placement head has a chassis; a first rotor assembly that is mounted so that it is rotatable relative to the chassis about a first axis of rotation and that has a first quantity of first handling devices; and a second rotor assembly that is mounted so that it is rotatable relative to the chassis about a second axis of rotation and that has a second quantity of second handling devices. Each handling device includes a sleeve to which a component holding device for temporarily picking up a component can be attached, and a drive device with a linear drive for moving the sleeve along its longitudinal axis, and a rotary drive for rotating the sleeve about its longitudinal axis. Furthermore, a placement machine with such a placement head and a method for automatic assembly of a component carrier using such a placement head.

Abstract: A method of manufacturing a motor assembly comprising a motor and an impeller coupled to a rotation shaft of the motor, the method includes disposing a plurality of balls in a ring-shaped groove formed in a surface of the impeller; rotating the impeller at a speed greater than a resonant rotation speed to move the balls to a compensation position for compensating for an eccentricity in the motor assembly; and fixing the balls at the compensation position in the groove.

Abstract: The present disclosure generally relates to a method and apparatus for forming a substrate having a graduated refractive index. A method of forming a waveguide structure includes expelling plasma from an applicator having a head toward a plurality of grating structures formed on a substrate. The plasma is formed in the head at atmospheric pressure. The method further includes changing a depth of the plurality of grating structures with the plasma by removing grating material from the plurality of grating structures.

Abstract: A circuit board including an adhesive part, a ceramic board part with the adhesive part, and a printed circuit board part with the adhesive part. The ceramic board and printed circuit board parts are made of different materials. The adhesive part includes: an adhesive layer including an adhesive material, an adhesive part opening, and a conductive paste filled in an inside of the adhesive part opening. A method including providing a ceramic board part, providing a printed circuit board part, and producing an adhesive part. Batch-bonding the printed circuit board part, the adhesive part, and the ceramic board part with one another. Producing the adhesive part includes: bonding a protection layer on two surfaces of an adhesive layer, forming an adhesive part opening penetrating the adhesive layer and the protection layer, filling the adhesive part opening with a conductive paste, and removing the protection layer.

Abstract: First receiving recesses for receiving distal end portions of slot insertion portions of normal coil segments, and second receiving recesses for receiving distal end portions of long slot insertion portions of variant coil segments are formed at circumferential intervals on outer peripheral surface of an inner twisting jig corresponding to the innermost layer. In a state where the distal end portions of the long slot insertion portions before being twisted are inserted into the second receiving recesses, the first receiving recesses are at positions displaced in the circumferential direction with respect to the distal end portions to be housed therein. Primary twisting is performed by rotating the inner twisting jig in this state, and then the distal end portions of the normal coil segments are inserted into the first receiving recesses and the secondary twisting is performed with a rotational amount larger than that of the primary twisting.