Abstract: High-resolution intravascular ultrasound (H-IVUS) operates under a large acoustic bandwidth, provides high resolution while maintaining good depth penetration, and exhibits other favorable characteristics like focused imaging. A H-IVUS transducer assembly can be manufactured at a low cost using conventional methods commonly utilized in the microelectronics industry. The H-IVUS transducer assembly can include a printed circuit having one or more electrical signal conditioners. One or more convertors made of a polymer and configured to convert electrical energy to acoustic energy and acoustic energy to electrical energy can be formed in place away from the printed circuit. After construction, the one or more formed in place convertors are interfaced to the printed circuit with at least a conductive material.

Abstract: A method for assembling and/or disassembling alkaline electrolyzer units of a hydrogen producing plant. The method includes: providing an industrial robot system including a controller having robot functionality, and a plurality of robots; transporting the plurality of robots to a plurality of electrolyzer unit sites, assembling the alkaline electrolyzer units at the electrolyzer unit sites by the plurality of robots executing assembly instructions included in the controller, and/or disassembling at least one of the alkaline electrolyzer units at an electrolyzer unit site by at least one of the plurality of robots executing disassembly instructions included in the controller.

Abstract: An electrode body producing apparatus is provided with a rotary base body, stacking table portions provided on its outer peripheral end portion, and a workpiece transferring section to transfer an unplaced workpiece on an object placement surface of a post-placed laminated body and others. A height adjusting portion of the stacking table portion changes a radial height of a table surface so that a radial height of the object placement surface becomes a predetermined radial height at least at a workpiece transferring angular position, and the workpiece transferring section transfers and places the unplaced workpiece on the object placement surface in synchronization with rotation movement of the object placement surface at the workpiece transferring angular position.

Abstract: A packaged acoustic wave component has a device substrate and a metal layer disposed over the device substrate. An acoustic wave device is disposed over at least a portion of the metal layer so that the metal layer is interposed between the device substrate and at least a portion of the acoustic wave device. A cap substrate is spaced above the device substrate, and peripheral wall that is attached to and extends between the device substrate and the cap substrate, the peripheral wall surrounding the acoustic wave device. One or more vias extend through the device substrate and are disposed under the metal layer.

Abstract: A method of forming an acoustic wave device is disclosed. The method can include providing a structure having a support substrate that includes a first substrate portion, a second substrate portion, and a third substrate portion between the first portion and the second portion, a piezoelectric layer that includes a first portion over the first substrate portion and a second portion over the second substrate portion, a first interdigital transducer electrode on the first portion of the piezoelectric layer, and a second interdigital transducer electrode on the second portion of the piezoelectric layer. the method can also include etching at least a portion of the piezoelectric layer such that a region over the third substrate portion is free from the piezoelectric layer.

Abstract: A disclosed apparatus includes a housing for an assembly of an axial flux machine, the assembly including at least a stator, a rotor, and bearings attached to the rotor. The housing is configured to support and locate the bearings and the stator within pockets that are open on one side to allow the assembly to be inserted into the housing in a direction perpendicular to a rotational axis of the rotor.

Abstract: An apparatus (200) for deforming conductors of at least one winding assembly (100), protruding from a side of a stator or of a rotor (114) of an electric machine. The at least one winding assembly (100) comprises a plurality of basic conductors (102) comprising at least one leg inserted into cavities (115) of stator or rotor (114), each having at least one respective free or terminal end (108, 110). The apparatus (200) comprises at least one twisting matrix (202, 203) adapted to rotate about an axis (X), comprising at least one gripping element (204) adapted to grip at least one free end (108, 110) and adapted to be moved in radial direction with respect to said axis (X). The apparatus comprises at least one guide (206, 207) adapted to guide the at least one gripping element (204) along the radial direction with respect to the axis (X); and a radial actuator (208), adapted to put in motion the at least one gripping element (204) along the radial direction with respect to the axis (X).

Abstract: A method of manufacturing a base winding assembly of a stator. The base winding assembly includes a plurality of conductor loop groups each formed of a plurality of conductor loops that are open on one side, wherein the closed ends of the conductor loops that are open on one side can be arranged at one face of the base assembly and the open ends can be arranged at the opposite face side of the base assembly, wherein the manufacturing of the base winding assembly is done by an additive manufacturing process in which a layer-by-layer application and local solidification of build-up material takes place. Furthermore, a method for manufacturing a stator for an electric machine, as well as a base winding group of a stator and a stator are proposed.

Abstract: The device includes an acoustic wave filter element, and a first resonator. The acoustic wave filter element includes interdigitated input electrodes and output electrodes located on a top surface of a piezoelectric layer and a counter-electrode on a bottom surface of the piezoelectric layer. The acoustic wave filter element provides a response with a sideband at a sideband frequency range. The first resonator includes a first resonator electrode on the top surface of the piezoelectric layer and a first resonator counter-electrode on the bottom surface of the piezoelectric layer. The first resonator has a first notch in resonator impedance at a first frequency. The first resonance frequency is tuned to fall within the sideband frequency range to suppress the sideband by depositing a first mass load on top of the first resonator electrode to reduce the first resonance frequency, or partly removing the first resonator electrode to increase the first resonance frequency.

Abstract: A method for fabricating a multi-layer resonator assembly includes sequentially fabricating a plurality of vertically-stacked resonator layers including, for each resonator layer of the plurality of resonator layers, depositing a dielectric layer, forming at least one film bulk acoustic resonator (FBAR) cavity in the deposited dielectric layer, filling each FBAR cavity of the at least one FBAR cavity with a sacrificial material block, and depositing a FBAR material stack over the at least one FBAR cavity. The deposited FBAR material stack is in contact with the sacrificial material block and the dielectric layer. The method further includes removing the sacrificial material block from the at least one FBAR cavity for each resonator layer of the plurality of resonator layers subsequent to sequentially fabricating the plurality of resonator layers.

Abstract: A piezoelectric material having a large electromechanical coupling coefficient is provided. The material is manufactured by a method including the steps of: heating a piezoelectric material having a low-temperature side ferroelectric phase A and a high-temperature side ferroelectric phase B between which the phase of the piezoelectric material transitions according to a temperature change, from room temperature to a temperature range higher than T(B?A) at which temperature a change from the ferroelectric phase B to the ferroelectric phase A occurs in a temperature lowering process and lower than T(A?B) at which temperature a change from the ferroelectric phase A to the ferroelectric phase B occurs in a temperature rising process; starting application of an electric field to the piezoelectric material in a state where it is held within this temperature range; and continuing and finishing the electric field application at a temperature lower than T(A?B).

Abstract: A method of manufacturing a multilayer capacitor includes preparing a guide frame, forming at least one dielectric layer between at least two surfaces of the guide frame such that at least a portion of each side surface of the at least one dielectric layer is in contact with the at least two surfaces, forming at least one internal electrode on an upper surface of the at least one dielectric layer between at least two surfaces of the guide frame using an inkjet printing method, and separating at least two surfaces of the guide frame from the at least one dielectric layer.

Abstract: There is provided a novel substrate support pin installation jig used when installing a substrate support pin for supporting a circuit substrate. The substrate support pin installation jig (hereinafter, may be simply referred to as a jig) according to the present disclosure includes a main body configured to move relative to a support base, multiple pin accommodating portions provided in the main body, and a positioned portion used for positioning on the support base. The substrate support pin is accommodated and held in at least one of multiple pin accommodating portions in the jig. The jig is placed on the support base in a state where a relative position is specified by the positioned portion. By releasing holding of the substrate support pin, the substrate support pin is installed on the support base, and then the jig is removed.

Abstract: A method of manufacturing a pre-mold substrate includes preparing an electrically conductive substrate, forming a groove on one surface of the substrate, arranging a resin to cover one surface of the substrate and the groove, removing a portion of the resin so that at least a portion of one surface of the substrate protrudes higher than a surface of the resin covering the groove, and forming a circuit pattern on another surface of the substrate.

Abstract: The disclosure relates to a machining station for machining platelike workpieces (1) by means of at least one tool (10, 13, 14). The machining station has a measuring device (16) for acquiring data relating to the position of bores, a drill (10, 13, 14) for generating bores in the workpiece (1), and a data processor (17) for processing data of the at least one measuring device (16) and/or for controlling the at least one drill (10, 13, 14). The data processor (17) is here suitable and set up for performing an adjustment between a desired drilling position and/or a desired bore depth and an actual position and/or actual depth as determined by the at least one measuring device (16) for a bore present in the workpiece (1), and adapting the drilling position and/or bore depth for generating bores by means of the at least one drill (10, 13, 14).

Abstract: Systems and methods for manufacturing stators for electric submersible pumps, where a stator core having an inner portion and an outer portion is formed. The inner portion has a plurality of teeth and outward-facing slots. Magnet wire coils are formed on the inner portion by holding the inner portion in a stationary position and using a linearly movable robotic arm to position the magnet wire in each slot while preventing the wire from sliding axially with respect to the stator and adjacent turns of the coil. After forming the magnet wire coils on the inner portion of the stator core, the outer portion of the stator core is press-fit onto the inner portion to close the slots. The magnet wire can thereby be positioned to maximize the fill factor of each slot and increase power density for a given temperature rise.

Abstract: One aspect of a method of manufacturing a rotor of the present invention is the method of manufacturing the rotor, which includes a rotor core rotatable about a central axis and a rotor magnet fixed to an outer peripheral surface of the rotor core, the method including a magnetization step of magnetizing a first magnetic member fixed to the outer peripheral surface of the rotor core to form the rotor magnet. The rotor core has a hole recessed from a surface on one side in an axial direction of the rotor core to the other side in the axial direction. In the magnetization step, the first magnetic member is magnetized in a state where a second magnetic member made of a magnetic material is inserted into the hole.

Abstract: The method includes producing a stack of coil loops from a continuous electrical conductor, the coil loops having two parallel straight side portions and two opposite curved end portions connecting the ends of the side portions. A length of each coil loop in the stack of coil loops decreases, whereby a staggered end portion is formed at each end of the stack of coil elements. The end portion of the stack of coil loops is bent into a predetermined bending angle, whereby the staggering has been determined so that an outer end of the end portion of the stack of coil loops is substantially straight when the stack of coil loops is bent into the predetermined bending angle.

Abstract: A conductive wire includes an angled protrusion having a tapered shape being integrated with a wire-shaped main body and configured to generate an arc between itself and an arc welding electrode. At least one of the pair of conductive members comprises an angled protrusion having a tapered shape. Welding of the conductive members is performed by melting the angled protrusion by generating an arc between the angled protrusion and an electrode.

Abstract: A packaged acoustic wave component is disclosed. The packaged acoustic wave component can include a first acoustic wave resonator that includes a first interdigital transducer electrode that is positioned over a first piezoelectric layer. The packaged acoustic wave component can also include a second acoustic wave resonator including a second interdigital transducer electrode positioned over a second piezoelectric layer. The second piezoelectric layer is bonded to the first piezoelectric layer. The packaged acoustic wave component can further include a stopper structure that is positioned over the first piezoelectric layer. The first stopper structure is positioned above a via and extends through the first piezoelectric layer. The stopper structure is in electrical communication with the first interdigital transducer electrode and includes a material which reflects at least fifty percent of light having a wavelength of 355 nanometers.