Patents Examined by Jose K Abraham
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Patent number: 11811279Abstract: An apparatus for assembling a coil includes a blade inserted into a slot of a stator core in a state where insulating paper is inserted into the slot. In a method for assembling the coil, the insulating paper is inserted into the slot of the stator core, the blade is inserted into the slot into which the insulating paper is inserted, the coil is inserted into the slot into which the blade is inserted, the coil being inserted in a direction opposite to a direction in which the blade is inserted. When the coil is inserted into the slot, the blade is pulled out from the slot along with the insertion of the coil into the slot.Type: GrantFiled: February 25, 2022Date of Patent: November 7, 2023Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Ken Noda
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Patent number: 11799183Abstract: A method of producing an electrically conductive line, the method including providing a substrate, printing a first layer on the substrate, applying a powdered conductive material to the first layer, and bonding the powdered conductive material to the first layer.Type: GrantFiled: July 17, 2019Date of Patent: October 24, 2023Assignee: Xerox CorporationInventors: David C. Craig, Eliud Robles Flores
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Patent number: 11783988Abstract: A method of manufacturing an inductor element includes preparing an insert member including a winding portion where a conductor is wound in a coil shape. A plurality of preliminary green compacts is obtained by conducting a preliminary compression molding of a granule containing a magnetic powder and a resin at a pressure of 2.5×102 to 1×103 MPa. The insert member and the plurality of preliminary green compacts are integrated so that a joint interface of the plurality of preliminary green compacts is formed intermittently.Type: GrantFiled: September 11, 2020Date of Patent: October 10, 2023Assignee: TDK CORPORATIONInventors: Yasuhide Yamashita, Katsushi Yasuhara, Chiomi Sato
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Patent number: 11785723Abstract: A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.Type: GrantFiled: November 22, 2021Date of Patent: October 10, 2023Assignee: PRIMAX ELECTRONICS LTD.Inventors: Sheng-Hsiang Chiu, Ching-Hui Chang
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Patent number: 11776713Abstract: A wire harness manufacturing system including a plurality of processing zones and configured to manufacture a wire harness by using a subassembly including a plurality of electrical lines to each of which a connection component is attached includes a conveyance device provided along the plurality of processing zones and including: work boards in a number at least corresponding to the number of the plurality of processing zones; a circulation conveyer configured to sequentially convey each work board in a horizontal state from an upstream side to a downstream side on a downstream conveyance path along the plurality of processing zones and then return the work board from the downstream side to the upstream side on an upstream conveyance path; and a raiser configured to set the work board to a stand-up state in which one of edge parts extending in a conveyance direction of the work board is positioned on an upper side of the other edge part in the work board, and to set the work board in the stand-up state to thType: GrantFiled: December 21, 2020Date of Patent: October 3, 2023Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.Inventors: Eiji Aramaki, Koji Kato, Mitsuyuki Akai, Takayuki Okubo, Nobuyuki Minami
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Patent number: 11778798Abstract: An information processing device configured to determine a mounting position of a tape feeder to any one of multiple feeder mounting sections formed in a work machine, in which mounting positions of two or more tape feeders configured to supply components of holding target held by two or more holding tools of a work head disposed in the work machine are determined to any one of the multiple feeder mounting sections based on position information indicating supply positions of the two or more tape feeders, so that a difference in an amount of deviation of the supply positions of the two or more tape feeders is within a predetermined range.Type: GrantFiled: July 24, 2018Date of Patent: October 3, 2023Assignee: FUJI CORPORATIONInventor: Takeshi Sakurayama
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Patent number: 11777383Abstract: The present invention provides a method for manufacturing a variable speed accelerator including: a preparation step of preparing a variable speed electric motor 71 including a variable speed rotor 72 in which a shaft insertion hole 74 extending in a horizontal direction is formed, a first variable speed rotor bearing 85i and a second variable speed rotor bearing 85o that rotatably support the variable speed rotor 72 by aligning an axial direction of the variable speed rotor 72 in the horizontal direction, and a variable speed stator 86 that surrounds the variable speed rotor 72 from an outer circumferential side; and a shaft insertion step of inserting a constant speed shaft 77 into the shaft insertion hole 74 of the variable speed rotor 72 in the horizontal direction so as to penetrate the variable speed rotor 72 after the preparation step.Type: GrantFiled: November 21, 2019Date of Patent: October 3, 2023Assignee: MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATIONInventor: Koichi Mizushita
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Patent number: 11764077Abstract: The embodiment of the disclosure provides a composite layer circuit element and a manufacturing method thereof. The manufacturing method of the composite layer circuit element includes the following. A carrier is provided. A first dielectric layer is formed on the carrier, and the first dielectric layer is patterned. The carrier on which the first dielectric layer is formed is disposed on a first curved-surface mold, and the first dielectric layer is cured. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer is patterned. The carrier on which the first dielectric layer and the second dielectric layer are formed is disposed on a second curved-surface mold, and the second dielectric layer is cured. A thickness of a projection of the first curved-surface mold is smaller than a thickness of a projection of the second curved-surface mold.Type: GrantFiled: November 11, 2021Date of Patent: September 19, 2023Assignee: Innolux CorporationInventors: Chuan-Ming Yeh, Heng-Shen Yeh, Kuo-Jung Fan, Cheng-Chi Wang
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Patent number: 11752608Abstract: In accordance with embodiments of the present disclosure, a tool may include a main body and a plurality of fingers extending from one side of the main body, the fingers arranged in a plurality of rows and a plurality of columns such that in each of the plurality of rows, each pair of adjacent fingers in a row may have a gap formed in between such pair of adjacent fingers such that each gap may receive a component for insertion or removal from a system and such that the adjacent fingers apply a force to the component to retain the component within the tool. The tool may also include a receptacle formed at one end of the main body and configured to receive a removable arm, and wherein the removable arm is configured to receive a plurality of removable fingers.Type: GrantFiled: July 20, 2020Date of Patent: September 12, 2023Assignee: Dell Products L.P.Inventors: Nicholas Adam Kelly, Matthew Dang
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Patent number: 11751847Abstract: Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.Type: GrantFiled: December 4, 2019Date of Patent: September 12, 2023Assignee: GE PRECISION HEALTHCARE LLCInventors: Flavien Daloz, Jason Barrett, Edouard Da Cruz, Jean Pierre Malacrida
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Patent number: 11751477Abstract: A method for preparing a piezoelectric film includes: coating a solution containing a piezoelectric polymer and a solvent on a substrate to obtain a film, wherein the piezoelectric polymer is a copolymer of vinylidene fluoride and trifluoroethylene; and annealing the film at a temperature ranging from 122° C. to 133° C., to obtain the piezoelectric film.Type: GrantFiled: July 15, 2020Date of Patent: September 5, 2023Assignees: Interface Technology (Chengdu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution LimitedInventors: Huan Ding, Weikun Lee, Mengzhu Ma
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Patent number: 11749427Abstract: An apparatus includes an extruding device configured to dispense a dielectric material though an orifice, a wire feed device configured to feed a conductive wire through the orifice, and a cutting device configured to sever the wire. It also includes an electronic controller configured to control the extruding device, the wire feed device, and the cutting device. The electronic controller commands the extruding device to dispense the dielectric material though the orifice, the wire feed device to feed the wire through the orifice, and the cutting device to sever the wire, thereby forming a dielectric substrate encasing a plurality of wires. The electronic controller further commands the extruding device to form an opening defined in the substrate in which plurality of electrically conductive wires is exposed and a location feature on the substrate located with a positional tolerance less than or equal to 1 mm relative to the opening.Type: GrantFiled: May 13, 2021Date of Patent: September 5, 2023Assignee: APTIV TECHNOLOGIES LIMITEDInventors: Jared Bilas, David R. Peterson, Gerald A. Rhinehart, Jr.
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Patent number: 11733154Abstract: An apparatus for thermal interface material detection includes a heatsink stack up with a heatsink, a thermal interface material, a heat generating component, and a printed circuit board. The heatsink is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heatsink is configured for insertion of a compression probe, where a first end of the channel leads to a lower surface of the body of the heatsink and a second end of the channels leads to an upper surface of the body of the heatsink.Type: GrantFiled: August 16, 2021Date of Patent: August 22, 2023Assignee: International Business Machines CorporationInventors: Theron Lee Lewis, John R. Dangler, David J. Braun
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Patent number: 11735983Abstract: A widening apparatus for a hairpin-type stator coil is provided to extend a distance between welding portions of hairpin-type stator coils inserted into slots of a stator core, and the widening apparatus includes, a coil support unit installed on a base frame, a tool driving unit installed on the base frame to be vertically movable below the coil support unit, and including a first gear operation part and a second gear operation part, a plurality of lower widening tools operably connected to the first gear operation part, and reciprocally movable along a layer direction of the stator coils, and a plurality of upper widening tools operably connected to the second gear operation part, and configured to be reciprocally movable above the plurality of lower widening tools.Type: GrantFiled: December 7, 2021Date of Patent: August 22, 2023Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Yeongsu Yu, Myoung Gil Han, Jiwon Yu
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Mounting substrate manufacturing system, component mounting system, and housing body transfer method
Patent number: 11729959Abstract: Disclosed is a mounting substrate manufacturing system including: a component mounting system including: a component mounting device; a housing body stocker that stores a housing body; a component supply device that pulls out a carrier tape from the housing body stored in the housing body stocker and transports the carrier tape to the component mounting device; and a replacement device that includes an end effector for holding the housing body, and replaces the housing body stored in the housing body stocker, wherein the housing body stocker includes at least a pair of partition members that partition a storage space for storing the housing body, at least one of the partition members adjacent to each other includes an assist portion that assists a replacement operation of replacing the housing body, and the replacement device recognizes a position for a replacement operation by bringing the end effector or the housing body held thereby into contact with the assist portion.Type: GrantFiled: April 5, 2021Date of Patent: August 15, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroki Kobayashi, Ryouji Eguchi -
Patent number: 11728630Abstract: A method of electric wire routing includes: routing an electric wire in an electric wire routing path which is provided in a case and has a concave shape in a cross-sectional view; and covering an upper portion of the electric wire routing path with a cover. A pair of guide pins are inserted into a through hole formed in a bottom portion of the electric wire routing path in the case from below to a position above a side wall portion which forms the electric wire routing path. The electric wire is passed between the guide pins. The cover is assembled to the upper portion of the electric wire routing path while the guide pins are pulled out from the through hole.Type: GrantFiled: January 15, 2021Date of Patent: August 15, 2023Assignee: YAZAKI CORPORATIONInventors: Hideki Adachi, Yuji Migimatsu
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Patent number: 11722041Abstract: A one-piece solenoid stator core is provided, comprising: a plurality of outer wall segments; a plurality of inner wall segments; and a lower wall extending between the plurality of outer wall segments and the plurality of inner wall segments; wherein a plurality of outer slots is defined between the plurality of outer wall segments and a plurality of inner slots is defined between the plurality of inner wall segments, each of the outer slots being radially aligned with an inner slot relative to a central axis of the stator core.Type: GrantFiled: July 23, 2020Date of Patent: August 8, 2023Assignee: Cummins Inc.Inventors: Edward B. Manring, Ross A. Phillips, Steven E. Ferdon
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Patent number: 11723184Abstract: In a component supply unit arrangement determination method for a mounter, in which multiple component supply units are exchangeably arranged and which mounts a component on a board based on a job, as the component supply unit to be exchanged for the component supply unit to be newly arranged due to switching of multiple jobs whose execution order is determined, the component supply unit is selected such that a time interval from a job, in which the component supply unit is to be used last, to the switching is long, among the component supply units that are arranged before the switching and are not planned to be used in a job after the switching. In addition, an arrangement position of the selected component supply unit is determined as an arrangement position of the component supply unit to be newly arranged.Type: GrantFiled: June 26, 2018Date of Patent: August 8, 2023Assignee: FUJI CORPORATIONInventors: Yukihiro Yamashita, Yoshihiro Yasui
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Patent number: 11710583Abstract: A superconducting coil comprising an oxide superconducting wire includes: a superconducting laminate comprising a substrate and an oxide superconducting layer; and a stabilization layer made of copper plating formed around the superconducting laminate. A thickness d of the stabilization layer is in the range of 10 to 40 ?m. A ratio Ra/d of the thickness d of the stabilization layer and an arithmetic mean roughness Ra of an outer surface of the stabilization layer is in the range of 0.005 to 0.03. An intermediate layer is arranged between the substrate and the oxide superconducting layer. When a tensile test of pulling the oxide superconducting wire in a longitudinal direction within a stress range of 180 to 600 MPa in liquid nitrogen is performed, a ratio of a critical current when a repeated pulling number reaches 100,000 times and an initial critical current measured before the tensile test is 0.99 or more.Type: GrantFiled: April 6, 2020Date of Patent: July 25, 2023Assignee: Fujikura Ltd.Inventor: Shinji Fujita
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Patent number: 11711885Abstract: A printed circuit board (PCB) having an engineered thermal path and a method of manufacturing are disclosed herein. In one aspect, the PCB includes complementary cavities formed on opposite sides of the PCB. The complementary cavities are in a thermal communication and/or an electrical communication to form the engineered thermal path and each cavity is filled with a thermally conductive material to provide a thermal pathway for circuits and components of the PCB. The method of manufacturing may further include drilling and/or milling each cavity, panel plating the cavities and filling the cavities with a suitable filling material.Type: GrantFiled: January 29, 2021Date of Patent: July 25, 2023Assignee: TTM Technologies, Inc.Inventors: Rick Bauer, Jerrad Martinson, Shane Hoffstatter, Doyle Laudal, Mike Lugert, Mike Len