Patents Examined by Joshua D Anderson
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Patent number: 12377455Abstract: A shear assisted extrusion process for producing cladded materials wherein a cladding material and a material to be cladded are placed in sequence with the cladded material positioned to contact a rotating scroll face first and the material to be cladded second. The two materials are fed through a shear assisted extrusion device at a preselected feed rate and impacted by a rotating scroll face to generate a cladded extrusion product. This process allows for increased through wall strength and decreases the brittleness in formed structures as compared to the prior art.Type: GrantFiled: November 9, 2022Date of Patent: August 5, 2025Assignee: Battelle Memorial InstituteInventors: Vineet V. Joshi, Glenn J. Grant, Curt A. Lavender, Scott A. Whalen, Saumyadeep Jana, David Catalini, Jens T. Darsell
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Patent number: 12374969Abstract: In a method for producing stacks of laminations, in which at least one adhesive is applied onto annular laminations with at least one application head and laminations are stacked into a stack of laminations, the lamination is rotated about its axis in the application area of the application head and/or the application head is moved about the axis of the lamination in order to apply the adhesive onto the lamination. A system for carrying out the method features at least one punching tool, with which laminations are punched out of a sheet metal material, wherein at least one station for cleaning and/or for activating and/or for applying an adhesive onto the laminations is arranged downstream of the punching tool.Type: GrantFiled: August 23, 2021Date of Patent: July 29, 2025Assignee: Feintool International Holding AGInventor: Björn Böker
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Patent number: 12365027Abstract: A method for preparing a shear-assisted extruded material from a powder billet is provided, the method comprising providing a billet of material in substantially powder form; applying both axial and rotational pressure to the material to deform at least some of the contacted material; and extruding the material to form an extruded material. A method for preparing shear-assisted extruded material is provided, the method comprising applying both axial and rotational pressure to stock material to form an extruded material at a rate between 2 and 13 m/min. A method for preparing shear-assisted extruded material is provided. The method comprises applying both axial and rotational pressure to stock material to form an extruded material; and aging the extruded material for less than 3 hours. A method for preparing shear-assisted extruded material is provided.Type: GrantFiled: September 13, 2021Date of Patent: July 22, 2025Assignee: Battelle Memorial InstituteInventors: Scott A. Whalen, Jens T. Darsell, Md. Reza-E-Rabby, Brandon Scott Taysom, Tianhao Wang, Darrell R. Herling, Xiao Li
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Patent number: 12368156Abstract: A moisture powder disclosed herein is for forming an electrode active material layer on any of positive and negative electrode current collectors, the moisture powder being configured of aggregated particles including an electrode active material and a non-aqueous electrolytic solution, wherein a solid content ratio is 70% by mass or more when the total amount of the moisture powder is 100% by mass, the non-aqueous electrolytic solution includes a non-aqueous solvent and a support salt, and a viscosity of the non-aqueous electrolytic solution at 25° C. is 25 mPa·S or more and 130 mPa·S or less.Type: GrantFiled: March 29, 2022Date of Patent: July 22, 2025Assignee: PRIME PLANET ENERGY & SOLUTIONS, INC.Inventor: Satoshi Moriyama
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Patent number: 12358035Abstract: The present disclosure provides methods for preparing an extruded product from a solid billet. The methods can include providing an as-cast billet for extrusion; applying a simultaneous rotational shear and axial extrusion force to the as-cast billet to plasticize the as-cast billet; and extruding the plasticized as-cast billet with an extrusion die to form an extruded product. Methods for preparing extruded products from billets can also include: providing a billet for extrusion; while maintaining a majority of the billet below 100° C., applying a simultaneous rotational shear and axial extrusion force to one end of the billet to plasticize the one end of the billet; and extruding the plasticized one end of the billet with an extrusion die to form an extruded product.Type: GrantFiled: September 30, 2022Date of Patent: July 15, 2025Assignee: Battelle Memorial InstituteInventors: Scott A. Whalen, Darrell R. Herling, Xiao Li, Md. Reza-E-Rabby, Brandon Scott Taysom, Glenn J. Grant, Vineet V. Joshi, Rajib Kalsar, Tianhao Wang
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Patent number: 12337366Abstract: Devices and methods for performing shear-assisted extrusion processes for forming extrusions of a desired composition from a feedstock material are provided. The processes can use a device having a scroll face having an inner diameter portion bounded by an outer diameter portion, and a member extending from the inner diameter portion beyond a surface of the outer diameter portion. Extrusion feedstocks and extrusion processes are provided for forming extrusions of a desired composition from a feedstock. The processes can include providing a feedstock having at least two different materials and engaging the materials with one another within a feedstock container. Methods for preparing metal sheets are provided that can include preparing a metal tube via shear assisted processing and extrusion; opening the metal tube to form a sheet having a first thickness; and rolling the sheet to a second thickness that is less than the first thickness.Type: GrantFiled: May 26, 2022Date of Patent: June 24, 2025Assignee: Battelle Memorial InstituteInventors: Scott A. Whalen, Vineet V. Joshi, Md. Reza-E-Rabby, Jens T. Darsell, Mageshwari Komarasamy, Curt A. Lavender, Glenn J. Grant, Aashish Rohatgi, William E. Frazier, III, Brandon Scott Taysom
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Patent number: 12302505Abstract: There is provided a method of forming a thin film-based microfluidic electronic device. The method includes: providing a first elastomeric thin film layer on a substrate; depositing a first elastomer on the first elastomeric thin film by direct ink writing to form an elastomeric structure configured to define a microfluidic channel on the first elastomeric thin film layer; providing a second elastomeric thin film layer over the elastomeric structure to cover the microfluidic channel; providing a sacrificial layer on the second elastomeric thin film; depositing liquid metal into the microfluidic channel to form a conductor in the microfluidic channel; and electrically connecting the conductor to an electronic component. The thin film-based microfluidic electronic device is a tissue or skin adhesive sensor including a skin adhesive acoustic device.Type: GrantFiled: December 10, 2020Date of Patent: May 13, 2025Assignee: Singapore University Of Technology And DesignInventors: Kento Yamagishi, Tsz Him Ching, Michinao Hashimoto, Hiroto Koshika
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Patent number: 12302503Abstract: A component mounting system includes multiple component mounting devices lined up in a board conveyance direction, with each component mounting device having an imaging device to capture an image of a board. The component mounting system includes a learning device, an inspection device, and a memory device. The learning device captures a post-component-mounting board image after component mounting, acquires training data based on the captured post-component-mounting board image, and creates learning data using machine learning based on the acquired training data. The inspection device captures a post-component-mounting board image, and performs an inspection of the post-component-mounting board under a first inspection condition or under a second inspection condition having inspection accuracy inferior to that of the first inspection condition by performing component recognition image processing on the captured post-component-mounting board image using the learning data.Type: GrantFiled: July 4, 2019Date of Patent: May 13, 2025Assignee: FUJI CORPORATIONInventors: Mitsutaka Inagaki, Shigeto Oyama, Haruna Narita
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Patent number: 12285874Abstract: The component mounter includes a mounting control section that controls a mounting operation for a component by the mounting head based on a control program to execute a mounting process. In a recovery process of attempting to mount a component anew with a mounting position related to the mounting operation as a target position in a case where an error has occurred in the mounting operation, the mounting control section executes the mounting operation for the component by using a designated holder that is one of the multiple holders allocated to the target position in the mounting process as the designated holder.Type: GrantFiled: September 11, 2019Date of Patent: April 29, 2025Assignee: FUJI CORPORATIONInventors: Satoshi Iwashima, Koji Kawaguchi
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Patent number: 12284765Abstract: A component mounting machine includes a head having a holding member configured to hold the component, and a control device. The control device performs a pre-mounting inspection for inspecting a state of a component held in the holding member, and controls the head so that the component held in the holding member is mounted on the board in a case where a determination of normality is made in the pre-mounting inspection. In addition, the control device performs a post-mounting inspection for inspecting a state of the component already mounted on the board by the head in a case where a determination of abnormality is made in the pre-mounting inspection or in a case where a determination of abnormality suspicion is made which is within an allowable range determined to be normal but is suspected to be abnormal in the pre-mounting inspection.Type: GrantFiled: September 11, 2019Date of Patent: April 22, 2025Assignee: FUJI CORPORATIONInventors: Kazuya Kotani, Yuta Yokoi, Mikiya Suzuki
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Patent number: 12278528Abstract: A method for manufacturing a laminated body includes: laminating an electromagnetic steel plate to form the laminated body; performing an annealing process on the laminated body; acquiring a before-annealing lamination thickness information on a thickness of the laminated body before performing the annealing process on the laminated body; and when the before-annealing lamination thickness information does not satisfy a before-annealing criterion which is predetermined, adjusting a lamination condition of the electromagnetic steel plate such that the before-annealing lamination thickness information satisfies the before-annealing criterion.Type: GrantFiled: April 12, 2019Date of Patent: April 15, 2025Assignee: MITSUI HIGH-TEC, INC.Inventors: Shigeru Nagasugi, Takashi Fukumoto, Jin Oda
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Patent number: 12261403Abstract: A crimp tool calibration system for crimping a prepared wire into a corresponding contact wire barrel includes a computer, a positioner having a memory chip storing positioner data, and a tool frame. The tool frame includes a head having a receiving port therethrough, and configured for the positioner to be removably engaged with the receiving port during a crimping operation. The tool frame also includes a plurality of crimping dies positioned around a periphery of the receiving port, an adjustment device to adjust a crimp depth, and a positioner interface coupled to the tool frame. The positioner interface includes a tool memory for storing tool data, a reader, and a transmitter, where the reader is configured to read the positioner data stored on the memory chip or the positioner, and the transmitter is configured to transmit the positioner data and the tool data to the computer.Type: GrantFiled: March 22, 2022Date of Patent: March 25, 2025Assignee: DANIELS MANUFACTURING CORPORATIONInventors: William David Kelly, Aron Bacs, Jr., Walt Simmons
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Patent number: 12261586Abstract: A surface acoustic wave resonator device, and method for manufacturing the same and filter, the method includes: forming an interdigital transducer including interdigital electrodes on the piezoelectric substrate; forming the interdigital transducer includes: forming initial interdigital electrodes on the piezoelectric substrate, wherein each initial interdigital electrode has a first width, and every two adjacent initial interdigital electrodes have an initial interdigital gap with a first spacing therebetween; and forming additional interdigital electrodes on the piezoelectric substrate, wherein each initial interdigital gap has a portion filled by one of additional interdigital electrodes; each interdigital electrode includes an initial interdigital electrode and an additional interdigital electrode connected to each other; each interdigital electrode has a second width, and every two adjacent interdigital electrodes have a second spacing therebetween; the second width is greater than the first width, andType: GrantFiled: January 22, 2024Date of Patent: March 25, 2025Assignee: Shenzhen Newsonic Technologies Co., Ltd.Inventors: Chencheng Zhou, Jie Zou, Gongbin Tang
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Patent number: 12250778Abstract: In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided.Type: GrantFiled: June 18, 2019Date of Patent: March 11, 2025Assignee: FUJI CORPORATIONInventor: Kenji Tsukada
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Patent number: 12237635Abstract: A pair of crimping pliers is provided. The crimping pliers include a large handle, a small handle, a connecting rod, and a clamp fixing plate that form a hinged four-rod mechanism. Two ends of the connecting rod are connected between a rear part of the large handle and a rear part of the small handle. The clamp fixing plate is connected between a front part of the large handle and a front part of the small handle. A rear part of the connecting rod is bent and extends towards a tail end of the large handle, thereby extending a force arm. A first returning spring is connected between a back side of a bent part of the clamp fixing plate and the large handle. A pawl is rotatable and installed at the large handle. The pawl matches and meshes with outer pawl teeth of the clamp fixing plate.Type: GrantFiled: May 31, 2024Date of Patent: February 25, 2025Inventor: Mao Lin
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Patent number: 12232271Abstract: A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.Type: GrantFiled: February 9, 2023Date of Patent: February 18, 2025Assignee: Kulicke and Soffa Industries, Inc.Inventors: Roy Brewel, Rudolphus Hendrikus Hoefs, Wilhelmus Gijsbertus Leonardus Van Sprang
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Patent number: 12225658Abstract: A multilayer printed circuit board having a stackup including an upper half of the stackup and a lower half of the stackup, the multilayer printed circuit board having a top exposed surface and a bottom exposed surface, a first trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, a second trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, and first electrical components and second electrical components disposed on the top exposed surface of the multilayer printed circuit board and associated, respectively, with the first trace and via structure and the second trace and via structure, wherein the first electrical components are mounted orthogonally with respect to the second electrical components.Type: GrantFiled: July 24, 2023Date of Patent: February 11, 2025Assignee: CISCO TECHNOLOGY, INC.Inventors: Shadi Ebrahimi Asl, Stephen Aubrey Scearce, Quinn Gaumer, Linda W. Scott
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Patent number: 12208435Abstract: A modified lug press and use thereof is described. The modified lug press includes a press and a cartridge. The press includes a drive which, when activated, crimps a lug, positioned on a die, to a wire. A cartridge holds the given lug and at least one additional lug, and successively aligns the given lug and the at least one next lug for insertion onto the die for crimping by the press. The cartridge includes a left rail, with a track therein, at least one middle rail, and a right rail. Distances between the rails may be adjustable. A drive motor, when activated, successively pushes lugs onto the die. A lug separator permits one lug to be pushed on the die at any given time. A lug placement device inhibit lateral lug movement during wire insertion and crimping operations.Type: GrantFiled: December 15, 2022Date of Patent: January 28, 2025Assignee: DISH Wireless L.L.C.Inventor: Jimmy A. Pollard, Jr.
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Patent number: 12201161Abstract: A manufacturing machine and method for the production of a cartridge for an electronic cigarette can include a first assembling drum which is mounted rotatable around a first rotation axis and has at least one first seat which is designed to house a tube and a second seat which is axially aligned with the first seat and is designed to house a support of a heating device; a first feeding station in which a tube is fed into the first seat; a second feeding station in which a support of a heating device is fed into the second seat; and a first welding station which is arranged downstream of the first feeding station and of the second feeding station and is provided with a first welding device, which, through a welded joint, connects a tube carried by the first seat to a support carried by the second seat.Type: GrantFiled: January 21, 2020Date of Patent: January 21, 2025Assignee: G.D SOCIETA' PER AZIONIInventor: Fulvio Boldrini
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Patent number: 12200870Abstract: A component mounting system includes a component mounting device (15) configured to mount a component (E) on a board (S), a component storage (20) configured to store a component containing member (200) configured to contain a plurality of the components to be mounted on the board by the component mounting device, and a controller (22) configured to control an order in which the component containing member is unloaded from the component storage. The controller is configured to control the order in which the component containing member is unloaded based on an unloading priority when a plurality of the component containing members are scheduled to be unloaded.Type: GrantFiled: March 29, 2019Date of Patent: January 14, 2025Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHAInventor: Hiroaki Nitta