Abstract: The component mounter includes a mounting control section that controls a mounting operation for a component by the mounting head based on a control program to execute a mounting process. In a recovery process of attempting to mount a component anew with a mounting position related to the mounting operation as a target position in a case where an error has occurred in the mounting operation, the mounting control section executes the mounting operation for the component by using a designated holder that is one of the multiple holders allocated to the target position in the mounting process as the designated holder.

Abstract: A component mounting machine includes a head having a holding member configured to hold the component, and a control device. The control device performs a pre-mounting inspection for inspecting a state of a component held in the holding member, and controls the head so that the component held in the holding member is mounted on the board in a case where a determination of normality is made in the pre-mounting inspection. In addition, the control device performs a post-mounting inspection for inspecting a state of the component already mounted on the board by the head in a case where a determination of abnormality is made in the pre-mounting inspection or in a case where a determination of abnormality suspicion is made which is within an allowable range determined to be normal but is suspected to be abnormal in the pre-mounting inspection.

Abstract: A method for manufacturing a laminated body includes: laminating an electromagnetic steel plate to form the laminated body; performing an annealing process on the laminated body; acquiring a before-annealing lamination thickness information on a thickness of the laminated body before performing the annealing process on the laminated body; and when the before-annealing lamination thickness information does not satisfy a before-annealing criterion which is predetermined, adjusting a lamination condition of the electromagnetic steel plate such that the before-annealing lamination thickness information satisfies the before-annealing criterion.

Abstract: A crimp tool calibration system for crimping a prepared wire into a corresponding contact wire barrel includes a computer, a positioner having a memory chip storing positioner data, and a tool frame. The tool frame includes a head having a receiving port therethrough, and configured for the positioner to be removably engaged with the receiving port during a crimping operation. The tool frame also includes a plurality of crimping dies positioned around a periphery of the receiving port, an adjustment device to adjust a crimp depth, and a positioner interface coupled to the tool frame. The positioner interface includes a tool memory for storing tool data, a reader, and a transmitter, where the reader is configured to read the positioner data stored on the memory chip or the positioner, and the transmitter is configured to transmit the positioner data and the tool data to the computer.

Abstract: A surface acoustic wave resonator device, and method for manufacturing the same and filter, the method includes: forming an interdigital transducer including interdigital electrodes on the piezoelectric substrate; forming the interdigital transducer includes: forming initial interdigital electrodes on the piezoelectric substrate, wherein each initial interdigital electrode has a first width, and every two adjacent initial interdigital electrodes have an initial interdigital gap with a first spacing therebetween; and forming additional interdigital electrodes on the piezoelectric substrate, wherein each initial interdigital gap has a portion filled by one of additional interdigital electrodes; each interdigital electrode includes an initial interdigital electrode and an additional interdigital electrode connected to each other; each interdigital electrode has a second width, and every two adjacent interdigital electrodes have a second spacing therebetween; the second width is greater than the first width, and

Abstract: In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided.

Abstract: A pair of crimping pliers is provided. The crimping pliers include a large handle, a small handle, a connecting rod, and a clamp fixing plate that form a hinged four-rod mechanism. Two ends of the connecting rod are connected between a rear part of the large handle and a rear part of the small handle. The clamp fixing plate is connected between a front part of the large handle and a front part of the small handle. A rear part of the connecting rod is bent and extends towards a tail end of the large handle, thereby extending a force arm. A first returning spring is connected between a back side of a bent part of the clamp fixing plate and the large handle. A pawl is rotatable and installed at the large handle. The pawl matches and meshes with outer pawl teeth of the clamp fixing plate.

Abstract: A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.

Abstract: A multilayer printed circuit board having a stackup including an upper half of the stackup and a lower half of the stackup, the multilayer printed circuit board having a top exposed surface and a bottom exposed surface, a first trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, a second trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, and first electrical components and second electrical components disposed on the top exposed surface of the multilayer printed circuit board and associated, respectively, with the first trace and via structure and the second trace and via structure, wherein the first electrical components are mounted orthogonally with respect to the second electrical components.

Abstract: A modified lug press and use thereof is described. The modified lug press includes a press and a cartridge. The press includes a drive which, when activated, crimps a lug, positioned on a die, to a wire. A cartridge holds the given lug and at least one additional lug, and successively aligns the given lug and the at least one next lug for insertion onto the die for crimping by the press. The cartridge includes a left rail, with a track therein, at least one middle rail, and a right rail. Distances between the rails may be adjustable. A drive motor, when activated, successively pushes lugs onto the die. A lug separator permits one lug to be pushed on the die at any given time. A lug placement device inhibit lateral lug movement during wire insertion and crimping operations.

Abstract: A manufacturing machine and method for the production of a cartridge for an electronic cigarette can include a first assembling drum which is mounted rotatable around a first rotation axis and has at least one first seat which is designed to house a tube and a second seat which is axially aligned with the first seat and is designed to house a support of a heating device; a first feeding station in which a tube is fed into the first seat; a second feeding station in which a support of a heating device is fed into the second seat; and a first welding station which is arranged downstream of the first feeding station and of the second feeding station and is provided with a first welding device, which, through a welded joint, connects a tube carried by the first seat to a support carried by the second seat.

Abstract: A component mounting system includes a component mounting device (15) configured to mount a component (E) on a board (S), a component storage (20) configured to store a component containing member (200) configured to contain a plurality of the components to be mounted on the board by the component mounting device, and a controller (22) configured to control an order in which the component containing member is unloaded from the component storage. The controller is configured to control the order in which the component containing member is unloaded based on an unloading priority when a plurality of the component containing members are scheduled to be unloaded.

Abstract: Shear-assisted extrusion processes for forming extrusions of a desired composition from a feedstock material are provided. The processes can include applying a rotational shearing force and an axial extrusion to the same location on the feedstock material. Devices for this can include a die tool defined by a die face extending from a rim of the die face inwardly at an angle greater than zero in relation to a sidewall of the die tool in at least one cross section; and/or a die tool defining an opening configured to receive feedstock material for extrusion and further defining a die face defining a recess within the die face and contiguous with the opening. Shear-assisted extrusion processes are also provided that can mix different portions of the feedstock material within a recess about the opening prior to feedstock material entering the opening; and extruding the mixed portions.

Abstract: A method for manufacturing a PCB with an embedded thermal conductor and a PCB are provided. A sheet of copper-clad ceramic serves as a thermal conductor. A sheet of copper foil having no opening serves as an outer layer of a laminate. A part of the sheet of copper foil covering the thermal conductor is removed after a lamination process, to expose a conductive layer as the outer layer of the thermal conductor. Finally, the outer layer pattern is formed. The sheet of copper foil has no opening before the lamination process, so that the sheet of copper foil has good flatness during the lamination process, thereby avoiding wrinkles. Moreover, the sheet of copper-clad ceramic serves as the thermal conductor, so that a pattern is manufactured on the outer layer of the thermal conductor based on the exposed conductive layer.

Abstract: There is provided a tape feeder for supplying, using a taped electric component including a carrier tape and multiple electric components held onto the carrier tape, the electric component in a supply position, the tape feeder including a detection sensor configured to detect presence or absence of the electric component in the supply position.

Abstract: A method reduces internal resistance of a battery (204, 300). In the method, a charging current is directed to a battery (204, 300), where the charging current includes spin-polarized and charged electrons. A dedicated spin generator (203) is capable of providing the charging current including spin-polarized and charged electrons. Next, the battery (204, 300) has been manufactured so that the battery includes either ferroelectric or pyroelectric material at least either in an anode (305), in a cathode (302), or in an other element of the battery (204, 300). The material can be selected to be polyvinylidene fluoride (“PVDF”) or modified materials thereof. After at least one cycle of charging of the battery (204, 300), the battery (204, 300) with reduced internal resistance is obtained.

Abstract: A method for manufacturing a ceramic substrate that includes forming a mother multilayer body by positioning a hole in at least one ceramic green sheet among a plurality of laminated ceramic green sheets in a location that does not overlap with a recess formation-planned region in which a recess is to be formed after firing of the mother multilayer body and that overlaps with a singulation-planned line for singulating the mother multilayer body into pieces after firing; and forming the recess in the mother multilayer body before firing by performing press working on the recess formation-planned region of the mother multilayer body.

Abstract: A method for fabricating a film bulk acoustic resonator (FBAR) structure includes: sequentially forming a top electrode material layer, a piezoelectric layer, and a bottom electrode material layer on a substrate; patterning the bottom electrode material layer to form a bottom electrode; forming a sacrificial layer above the bottom electrode; bonding a bottom cap wafer onto the sacrificial layer; removing the substrate; patterning the top electrode material layer to form a top electrode; and removing a portion of the sacrificial layer to form a lower cavity.

Abstract: The invention relates to a method for producing a medical electrode, comprising the following steps: (i) providing a substrate; (ii) applying a composition onto the substrate, wherein the composition comprises (a) a non-aqueous solvent and (b) an organic iridium complex compound dissolved in the solvent; (iii) heating the composition, and thereby forming a noble metal layer on the substrate.

Abstract: A chip-transferring system and a chip-transferring method are provided. The chip-transferring system includes a substrate-carrying module for carrying a chip-carrying structure, a chip-transferring module, and a system control module. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters, and a micro heater control chip. The chip-transferring module is configured for transferring a chip onto two corresponding ones of the conductive materials, and the chip-transferring module includes a motion sensing chip. When chip movement information of the chip that is provided by the motion sensing chip is transmitted to the system control module, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials by control of the system control module according to the chip movement information of the chip.