Abstract: A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate with a metal structure, depositing a mono-layer of a selected silane composition on a surface of the metal structure with a vapor of the selected silane composition, and coating the treated surface with an organic material.

Abstract: An acoustic resonator is fabricated by forming a patterned first photoresist mask on a piezoelectric plate at locations of a desired interdigital transducer (IDT) pattern. An etch-stop layer is then deposited on the plate and first photoresist mask. The first photoresist mask is removed to remove parts of the etch-stop and expose the plate. An IDT conductor material is deposited on the etch stop and the exposed plate. A patterned second photoresist mask is then formed on the conductor material at locations of the IDT pattern. The conductor material is then etched over and to the etch-stop to form the IDT pattern which has interleaved fingers on a diaphragm to span a substrate cavity. A portion of the plate and the etch-stop form the diaphragm. The etch-stop and photoresist mask are impervious to this etch. The second photoresist mask is removed to leave the IDT pattern.

Abstract: A hydrostatic/hydrodynamic fluid bearing assembly for a can bodymaker is provided. The hydrostatic/hydrodynamic fluid bearing assembly is separate from the ram body. The outboard guide bearing assembly includes a carriage assembly and a number of elongated journals. The carriage assembly includes a ram coupling, a crank coupling, and body defining a number of journal passages. The ram body is coupled to a ram coupling. The crank coupling is structured to be coupled to a crank arm. Each journal extends through a carriage assembly body journal passage. In this configuration, the ram body may form a can body in a traditional manner, but fluid bearing assembly fluid is not applied to the ram body. Instead, the fluid bearing assembly fluid is applied to the journals.

Abstract: A method and structure for single crystal acoustic electronic device. The device includes a substrate having an enhancement layer formed overlying its surface region, a support layer formed overlying the enhancement layer, and an air cavity formed through a portion of the support layer. Single crystal piezoelectric material is formed overlying the air cavity and a portion of the enhancement layer. Also, a first electrode material coupled to the backside surface region of the crystal piezoelectric material and spatially configured within the cavity. A second electrode material is formed overlying the topside of the piezoelectric material, and a dielectric layer formed overlying the second electrode material. Further, one or more shunt layers can be formed around the perimeter of a resonator region of the device to connect the piezoelectric material to the enhancement layer.

Abstract: An apparatus for bending ends, arranged in annular layers, of bar conductors for an electrical machine are arranged in a stator main body having multiple coaxially arranged coupling elements with coupling recesses, by which the ends of the bar conductors can be taken layer by layer and plastically deformed. Each coupling element has a driving platform, which can be moved in the axial direction together with the coupling element. The coupling element belonging to a driving platform can be rotated on the driving platform. All of the driving platforms move axially on a common climbing linkage. Each driving platform has a dedicated first driving device for axially moving the driving platform and a dedicated second driving device for rotating the coupling element on the driving platform, wherein the two driving devices are moved axially, together with the driving platform. The apparatus is of a simple construction requiring little installation space.

Abstract: A method for replacing an element of a display device includes: forming a structure with a first liquid layer between a first micro device and a conductive pad of a substrate in which the first micro device is gripped by a sticking force produced by the first liquid layer; evaporating the first liquid layer such that the first micro device is bound to the substrate; determining if the first micro device is malfunctioned or misplaced; removing the first micro device when the first micro device is malfunctioned or misplaced; forming another structure with a second liquid layer between a second micro device and the conductive pad of the substrate in which the second micro device is gripped by a sticking force produced by the second liquid layer; and evaporating the second liquid layer such that the second micro device is bound to the substrate.

Abstract: An article management apparatus allocates articles necessary for a board working machine out of the articles stored in a storage based on a production plan of the board working machine that performs a predetermined board work on the board to produce the board product. The article management apparatus includes a first setting section, a second setting section, and a selecting section. The first setting section allows a user of the board working machine to set a restriction condition for each production plan of the board product. The second setting section allows the user to set a priority among multiple priority elements when allocating the articles for the articles needed in a case of producing the board product under the restriction condition set by the first setting section. The selecting section allocates the articles based on the priority of the priority element set by the second setting section.

Abstract: A component mounting device includes a control device configured to execute a recognition data creation process and a pickup process. In the recognition data creation process, the control device creates the recognition data by obtaining the angle information of the component, causing the imaging device to operate so as to image the component, and rotating the captured image so obtained to the reference angle based on the angle information. In the pickup process, the control device causes the head to operate so as to pick up the component after the supply state of the component is determined based on the captured image obtained by causing the imaging device to operate so as to image the component, the recognition data created in the recognition data creation process, and the angle information.

Abstract: Provided is a coil insertion device for inserting a wound coil into slots formed in a stator core and opening to a through-hole of the stator core, by placing the coil in the through-hole, and by expanding the coil to move the coil from inside toward outside with respect to the stator core. The coil insertion device includes a coil expander having a plurality of piece members arranged in an annular shape. The plurality of piece members are movable between a first position where the plurality of piece members are reduced in diameter so as to be insertable inside the wound coil, and a second position where the plurality of piece members are expanded in diameter from the first position to press the wound coil from inside toward outside, thereby inserting the wound coil into the slots at once.

Abstract: A coil forming apparatus includes: a coil winding jig including a plurality of comb-shaped grooves; a coil conveying mechanism that pivotally conveys the belt-shaped coil along at least a portion of the outer periphery of the coil winding jig; and guide members guide the belt-shaped coil in an arc shape along an outer periphery of the coil winding jig while being in contact with the side ends, and allow the plurality of straight portions to be inserted into a respective one of the plurality of comb-shaped grooves in a second half portion of the belt-shaped coil upon pivot conveyance. The guide members include a reforming portion in a first half portion of the belt-shaped coil upon pivot conveyance, and the reforming portion deforms and reforms the belt-shaped coil in an arc shape in a state sandwiching the side ends of the belt-shaped coil.

Abstract: A system for mounting an electrical terminal applicator to a cassette containing a plurality of terminals is provided. The system includes a support plate for fixedly attaching to the applicator, and a yoke releasably attached to the support plate. The yoke and support plate define an attachment therebetween providing at least one degree of freedom of motion of the support plate relative to the yoke in an attached state. The yoke is further configured to be movably mounted to the cassette with at least one additional degree of freedom of motion.

Abstract: A coil insertion device includes: a pair of delivery jigs respectively formed with slits into which a pair of side portions of a coil that are parallel with each other can be inserted; and a side portion inserting mechanism configured to push out the side portions inserted into the slits from the slits to insert the side portions into slots of a stator core, the slots facing the slits, the side portion inserting mechanism has: pushing blocks inserted into the slits; and a pushing block moving mechanism configured to move the pushing blocks in a depth direction of the slits.

Abstract: Aspects and techniques of the present disclosure relate to a tool capable of terminating two different jack types (i.e. communication modules). That is, two different jack types can be arranged and configured to sit in the tool with a termination device. The tool can be a dual-purpose tool that has a configuration that allows a user to terminate different style jacks by adding termination device that becomes a lacing fixture.

Abstract: A fabrication method of a bulk acoustic wave (BAW) resonator includes: sequentially forming a buffer layer, a piezoelectric layer, and a first electrode on a temporary substrate; forming a first dielectric layer on the piezoelectric layer and covering the first electrode; forming a trench in the first dielectric layer; forming a second dielectric layer on the first dielectric layer and in the trench; forming a third dielectric layer on the second dielectric layer and filling in the trench; forming a bonding layer on the third dielectric layer; bonding a resonator substrate to the third dielectric layer via the bonding layer; removing the temporary substrate and the buffer layer to expose a surface layer of the piezoelectric layer; removing the surface layer of the piezoelectric layer; forming a second electrode on the piezoelectric layer; and removing a portion of the first dielectric layer surrounded by the trench to form a cavity.

Abstract: Devices and methods for performing shear-assisted extrusion processes for forming extrusions of a desired composition from a feedstock material are provided. The processes can use a device having a scroll face having an inner diameter portion bounded by an outer diameter portion, and a member extending from the inner diameter portion beyond a surface of the outer diameter portion. Extrusion feedstocks and extrusion processes are provided for forming extrusions of a desired composition from a feedstock. The processes can include providing a feedstock having at least two different materials and engaging the materials with one another within a feedstock container. Methods for preparing metal sheets are provided that can include preparing a metal tube via shear assisted processing and extrusion; opening the metal tube to form a sheet having a first thickness; and rolling the sheet to a second thickness that is less than the first thickness.

Abstract: A coil insertion guide device includes a positioning jig that positions a stator core; and a guide member that is provided in the positioning jig so as to be able to contact an end face of the stator core in an axial direction. A coil inserted into the slots along the radial direction of the stator core is guided by the guide members. The guide member includes a guide groove. The guide groove includes, on a side close to the end face of the stator core, a cuff support groove that houses and supports a cuff of one of the insulating members that protrudes from the end face of the stator core, and on a side far from the end face, a coil guide groove that protrudes toward an inside of the slot more than the cuff support groove and contacts the coil to guide movement of the coil.

Abstract: An insertion tool for assisting in the insertion of an OCP 3.0 type expansion card in an expansion card slot of a computer system is disclosed. The expansion card may be a pull tab type form factor that does not have a mechanism such as an ejector latch to assist in applying force to insert the card. The expansion card has a front panel opposite a distal edge connector. The tool has a handle and a head coupled to the handle. The head has two contact areas that contact different areas of the front panel of the expansion card. For example, one of the contact areas may be an extended side arm and the other area may be a lateral rib extending from the head.

Abstract: A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. Patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the electrodes and a planarized support layer is deposited over the sacrificial layer. The device can include a dielectric protection layer (DPL) that protects the piezoelectric layer from etching processes that can produce rough surfaces and reduces parasitic capacitance around the perimeter of the resonator when the DPL's dielectric constant is lower than that of the piezoelectric layer. The DPL can be configured between the top electrode and the piezoelectric layer, between the bottom electrode and the piezoelectric layer, or both.

Abstract: A machine that is used to automate the assembly of a circuit board assembly is provided. The machine includes a rotating indexer, at least one anvil holder, a punch, and an activation switch. The at least one anvil holder is carried by the rotating indexer and is configured to receive a connector pin. The anvil holder is rotatable relative to the punch, such that the at least one anvil holder may be aligned with the punch. A circuit board may be located about the connector pin, after which the activation switch may be activated to cause movement of the punch towards the anvil holder. When this occurs, the connector pin is compressed, which causes the connector pin to be secured to the circuit board. More specifically, a top section of the connector pin is compressed to form a top lip, where the circuit board is located between the top lip and a shoulder of the connector pin.

Abstract: Provided is a method of manufacturing a bulk acoustic wave resonator, which includes: providing a piezoelectric substrate for forming a piezoelectric layer; forming a first electrode structure on the portion of the piezoelectric substrate for forming the piezoelectric layer; forming a dielectric layer on the first electrode structure, and performing a patterning process on the dielectric layer to form a patterned dielectric layer comprising a sacrificial dielectric part and a periphery dielectric part; forming a boundary layer on the patterned dielectric layer, the boundary layer covering a surface of the patterned dielectric layer and surrounding the sacrificial dielectric part; thinning the piezoelectric substrate to form the piezoelectric layer, the first electrode structure being located at a first side of the piezoelectric layer; forming a second electrode structure on a second side of the piezoelectric layer; and removing the sacrificial dielectric part to form a resonant cavity.