Abstract: This invention relates to a method of brazing a hard metal insert into a recess in the bit of a rock working tool and to a tool produced by the method. The method includes the steps of shaping both the underside of the insert and the base of the recess to a tapered point with an angle of taper of about 130.degree., placing the insert, which is a loose fit in the recess, so that the base of the bit fits complementally into the tapered base of the recess to centralize the insert in the recess and causing a moulten brazing medium to flow into the recess between its walls and those of the insert.

Abstract: Apparatus for preparing two tubes to be welded together at their ends and for placing the ends in opposed, abutting relationship for welding. The apparatus includes means for annealing a portion or length of each tube, and means for stretching the portion or length of each tube for straightening purposes after it is annealed. In addition, the apparatus includes means for severing an end portion of the annealed length of each tube to provide two annealed tube ends for abutting and welding together. Further, the apparatus includes means for forcing the abutting ends of the tubes together in a manner that will upset the material of the tube ends during welding.

Abstract: A method of assembling a packaged microcircuit with face-mounted leads includes forming a lead frame into a holder with opposed sets of leads turned upward and angular to spaced apart carrier strips, and securing a substrate having a microcircuit thereon within the holder with one set of leads securely held in contact with terminals on a face of the substrate, so that bonded electrical connections between the leads and the terminals can be readily made with conventional soldering techniques.

Abstract: The cylindrical rotating grate of an attrition mill is constructed by welding a group of bars in close spaced parallel relationship, and then rolling this assembly into a cylindrical configuration. The meeting ends of this configuration are then welded, and an opening is preferably cut from the rolled assembly. The area cut out in the process of forming the opening is used as a cover. The grate structure includes solid abutments interengageable with the cover to hold the cover in position against the large forces encountered during the operation of the mill, with relatively light securing means adapted to hold the cover in engagement with these abutments. A housing surrounding the rotating grate is provided with an opening through which the machine is charged with material, and this opening is covered by a curtain preferably provided with battens and a weight to hold it in position. A vacuum is applied to the interior housing for the removal of dust, which assists in holding the curtain in position.

Abstract: A first vessel is mounted within and spaced from a second vessel. A primary heat transfer liquid is introduced into the first vessel and a secondary heat transfer liquid introduced into the second vessel. Heating coils immersed in the secondary heat transfer liquid are energized to boil the secondary liquid to form a body of secondary vapor, a portion of which condenses on the outer surface of the first vessel to heat said vessel and boil the primary liquid therein to form a body of primary vapor. An article having previously applied solder thereon is immersed in said body of primary vapor and the solder caused to melt and flow due to the latent heat of vaporization transferred thereto by the primary vapor condensing thereon. Additionally, a tertiary body of vapor is formed above the primary vapor to substantially preclude the loss of the primary vapor to the atmosphere.

Abstract: An improved metallization system for semiconductor substrates comprising successive layers of at least one barrier metal and tin is disclosed. A semiconductor package comprising a housing of impervious material, a semiconductor device having the metallization system of this invention disposed in the housing and conductor means bonded to the tin on the semiconductor device is also disclosed. The system is of particular usefulness in double stud diode packages.

Abstract: A desoldering system which operates in conjunction with a soldering instrument which may be of the temperature controlled type disclosed and claimed in applicant's prior U.S. Pat. No. 3,883,716. The desoldering tip is specifically designed for simultaneously desoldering dual-in-line integrated circuit packages, having for example 14 or 16 pins, multiple pins for transistors, 8 or 10 pin round integrated circuit packages and the like. Due to the large throughput of air required to the vacuum system the desoldering attachment features large inlet pipes. The desoldering top is directly screwed onto the heating element of a soldering instrument surrounded by an air tight sleeve which includes a filter or trap for the solder. The sleeve of the desoldering instrument in turn is connected to another barrel which may include an additional filter and is provided with a three-way trigger valve.

Abstract: When a welded joint is produced for joining metal components by applying a plurality of layers of deposited metal, the plurality of layers of deposited metal are provided in a groove of a weld preparation formed between the metal components to be joined in such a manner that each layer of deposited metal has a small thickness and a large width crosswise of the groove and the layers are arranged to be superposed one over another. During this process, a coarse metal structure formed when each underlying layer of deposited metal is provided is completely tempered and transformed into a fine metal structure by the heat generated when each overlying layer of deposited metal is provided. Thus the welded joint produced by this method shows an excellent performance in service.

Abstract: A circuit module is mounted on a flexible substrate, forming what is usually referred to as a micropack. This substrate has soldered conducting paths that are provided with solder spots at the sites where they shall be bonded with the conducting paths of a thin-film hybrid circuit. the micropack is inserted onto the hybrid circuit with a pair of vacuum forceps or tweezers, and adjusted and pressed into the conducting paths of the hybrid circuit under the action of the pins of a pressure plate or clamp. At the same time, the conducting paths of the micropack are bonded with the conducting paths of the hybrid circuit through infrared irradiation.

Abstract: A method of and apparatus for joining a small diameter tube to a large diameter tube. An indentation tool is used to inwardly deform the wall of a tube from the outside into the internal bore of the tube. The resulting indentation formed has an open end sized to receive the small diameter tube. The small diameter tube is then located within the indentation and mechanically joined by brazing or soldering such that the axis of the portion of the small diameter tube within the large diameter tube is roughly parallel to the axis of the large diameter tube.

Abstract: The present invention provides a certain improvement in the method for connecting a pipe to a plate by high pressure welding. This basic method is one in which the pipe is inserted a certain distance into a bore provided in the plate and subsequently the material of the pipe is spread out over the wall surface defining the bore of the plate, under the influence of high pressure and with the aid of a mandrel disposed in the pipe.The improvement provided by the invention basically comprises the steps of positioning within a cooperating punch and die set, the plate with an end section of the pipe inserted into the bore of the plate. The punch and die set have opposed aligned bores accommodating the extension therethrough of the pipe and a mandrel respectively. In addition the punch and die set generally confine the plate at the peripheral edge and opposite sides thereof, and are operable to apply compressive forces to the opposite sides of the plate.

Abstract: Welding backup having a train of rigid, heat-resistant tiles, the contiguous ends of which have round surfaces which provide knuckle joints. The round surfaces terminate in matching stops which limit the knuckle motion in either direction to 5-20 degrees.

Abstract: A method is described for attaching sapphire, quartz, Spinel, etc. die to gold pads in a ceramic package. Because sapphire is not directly bondable to or alloyable with gold, while silicon is, silicon is either evaporated or deposited onto the backside of a sapphire or silicon-on-sapphire wafer. After the wafer has been scribed into die, the die are attached to the gold pads in the ceramic package using a gold-silicon preform as an intermediate layer.

Abstract: Rotary internal pipe clamp apparatus for use in welding pipes together end to end, said apparatus having a first set of circularly spaced pipe engagement elements for disposition within the end of one section of pipe, and having a second set of circularly spaced pipe engagement elements for disposition in the end of a second length of pipe abutted end to end with the first length of pipe. Each set of circularly spaced pipe engagement elements is expanded and retracted by rotation of a circular disc to which said pipe engagment elements are linked by toggle elements. In addition, the apparatus includes a welding back up assembly which is expandable and retractable simultaneously with the second set of pipe engagement elements. The welding back up assembly includes plural peripheral bands or strips which are supplemented by shorter peripheral bands or strips which separately retract and expand.

Abstract: Soldering method comprises placing a cadmium-zinc-lead solder on a copper base and exposing the solder joint to about 200.degree. C. for at least one hour to produce a copper-cadmium-zinc ternary interface barrier layer which inhibits migration.

Abstract: Apparatus for aligning and setting the gap between two rail-ends prior to joining these two ends by fish plating or welding and possibly dressing the weld, comprises a rigid horizontal frame of open structure overlapping the two rails and providing an access area around the two ends to be joined. Two main presses and two end presses are mounted in line on the frame and arranged so that the two main presses are located between the end presses. Each combination of a main press and an end press serves to grip one of the two rails to be joined. The gap setting means can be locked on the two rails and has rams for moving the rails together or apart. Weld dressing means for eliminating the weld bead formed after a weld joining operation comprises a dressing tool movable by the aforesaid rams. The apparatus is especially for use in laying or reconditioning railway lines.

Abstract: Failure under stress of brazed aluminum assemblies prepared by fluxless brazing is prevented by controlling the grain size before brazing of the material in contact with the brazing alloy to be at least 60.mu..

Abstract: A method and apparatus for strapping ingot moulds by forcing roughly pre-formed strap sections into pressure contact around the mark of the mould which is to be strapped, and welding the joints between the sections to form a complete strap. The apparatus includes the frame, with two generally C-shaped portions hinged together to form a bar which can be closed around a mould, the frame carrying hydraulic rams at spaced intervals for pressing the strap sections against the mould.

Abstract: An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors.

Abstract: A method of manufacture of an annular seal element comprises the steps of providing an apertured backing ring with closely packed bristles extending radially outwardly from the circumference thereof, clamping the free ends of the bristle between a pair of co-axial rings and welding the rings and the outermost tips of the bristles into a unitary structure and subsequently machining away the original backing ring to leave the rings with radially inwardly extending bristles.The invention also includes a sealing element made by the method.