Abstract: Method for welding fine wires to connecting terminations born by the base of a semiconductor device, using a tool for welding and cutting the wire in the form of a tube (9) which acts by its end face (11) containing the wire (12) to be welded, of which the outer strand (13) is to be welded to the termination (6), an incipient rupture (16) being formed by the inner angle (17) of the tube, and a limited flattening (H) being obtained by contact (40) between part of the end face of the tube and the termination, the value (H) being determined by the choice of an angle (P) created between the termination (6) and the end face (11) of the tube.

Abstract: A method of applying a duplex sheet cladding to a structural substrate is disclosed. The method utilizes hot isostatic pressure with molten glass as a pressure transmitting medium. An inner sheet cladding of aluminum is formed over the substrate and then an outer MCrAlY sheet cladding is assembled thereon which completely envelops and seals the inner cladding. Thereafter the duplex cladding is diffusion bonded to the substrate at elevated pressures and temperatures in accordance with a programmed time-temperature hot isostatic pressure cycle.

Abstract: Apparatus that is assembled quickly inside a channel head of a steam generator and is capable of performing various repair and inspection techniques remotely in order to reduce radiation exposure and facilitate rapid repair of the tubes.

Abstract: Four carriers are disposed at 90.degree. intervals about the axis of rotation. A wound core formed on a mandrel is shifted to one of the carriers contacted with the mandrel. The carrier with the core is rotated through 90.degree. to reach a compression unit and the core is compressed through the movement of the carrier toward the unit, after which the compressed core is welded. When the carrier with the completed core faces a discharge channel through its intermittent rotation, the carrier moves into the channel. Then the carrier ascends to leave the core in the channel and is then rotated to oppose to the mandrel to repeat the above process. The remaining carriers are similarly operated.

Abstract: An expandable band is employed to provide a mold on the interior of the joint into which the weld puddle is flowed which may be made of any appropriate material, but preferably is copper. The back-up band is carried on a set of rounding jacks which engage the facing pipe ends and exert a circumferentially uniform radial force on the pipes. This serves to round the ends equally and bring them into coaxial alignment with each other in the vicinity of the joint. The back-up band bridges the joint and expands to form a closed or semi-sealed chamber around the joint.

Abstract: In accordance with the present invention, there is provided a non-fusible web for supporting a plurality of individual solder rings in a predetermined pattern homologous with that of a plurality of solder tails or terminals on which the rings are disposed during a soldering operation. The invention finds particular application in vapor phase condensation soldering. Use of the non-fusible web provides for the simultaneous placement of a large number of individual solder rings, while eliminating the erratic and often detrimental flow characteristics occurring during the instantaneous fusion of patterned chains or strings of solder rings during a condensation soldering operation.

Abstract: In the welding of tubes with bevelled ends without heels or root-faces, all the weldings beads are made from the outside of the tubes with the tubes being in contact with local gap not exceeding 2 mm. The first and second welding beads are made both by the up-hill method and the down-hill method with the axis of the welding torches at the same inclination to the normal or the radius of the pipe and the accuracy of welding is improved by the use of mechanical guiding means for the welding means comprising at least one roller which bears on the bevelled ends of the tubes adjacent the welding zone.

Abstract: An apparatus for surfacing valves by fusing in a high-frequency current field refractory alloy rings applied to the seating surfaces of the valves. The apparatus comprises a tubular body provided with chutes adjoining thereto. The chutes are adapted respectively to feed valves and rings to be fused. After a valve and a ring is assembled under the action of gravity inside the tubular body, the valve with the ring to be fused is delivered by a pusher to a mechanism fixing the valve in a heater. The pusher is mounted for reversible movement in the hozizontal plane.

Abstract: A method and apparatus for continuously producing clad metal plate employing a continuous casting apparatus. Sheet metal cladding is fed onto one or both faces of the hot solidified continuously cast strip being withdrawn from the casting means and the assembly is then passed to a hot roll bonding system for cladding. A method of producing clad aluminum or aluminum alloy according to the above process is further disclosed.

Abstract: A wire bonder for making electrical connections from semiconductor chips to conductors on a lead frame includes a fault sensing system to detect a failure of the ball bond at the chip pad as well as the lead bond. Pad bond failure is detected by providing a wire feed sensor and a logic element for determining whether the wire is being fed when the bonding tip is moved from the chip to the lead. There is no wire feed if the pad bond fails. Lead bond failure is detected by clamping the wire after the lead bond is made and pulling on the wire to either break off the tail at the bond or pull the bond loose from the lead. Then the clamp is released momentarily so that if the tail has not broken free, an extra length of wire will be pulled from the tip. The extra length of wire is sensed by an electronic flame off torch monitor.

Abstract: A method for producing a highly precise and inherently stable analyzer system for a multipole mass filter, wherein a tube of material that is electrically poorly conductive and thermally softenable is put over a core which is precise in size, has a higher expansion coefficient and has parallel grooves. The tube material is joined to the grooves of the core by heating and, subsequently, after cooling for the purposes of solidifying, is removed from the core with the impressed tube indentations. Before the tube is heated, layers of electrically higher conductive metallic components, which can be easily connected to the softenable tube material, are applied between the core and the tube in the region of the grooves. The layer material is connected to the tube material when the tube is softened and joined to the grooves of the tube. When removing the tube that has been shaped in this manner, the layers connected to the impressed tube indentations are also removed from the core.

Abstract: Machine for friction welding two parts comprising a first non-rotatable means for clamping the first of the two parts and a second rotatable means for clamping the second part. The machine is characterized in that the first non-rotatable clamping means is movable along the axis of rotation of the second means and in that the second rotatable clamping means is made up of a motorized mandril and a headstock clamping between them the second part, this headstock being movable along the axis of rotation and being provided with means for the support of the two pieces co-axially.

Abstract: A method and apparatus is disclosed for monitoring the parameters of a rock bit which utilizes electronic sensing principles. The use of these sensing devices will provide continuous measurement of the rock bit through remote monitoring equipment. The sensing devices monitor the rock bit parameters during the electron beam welding process to assure that both the height and the gage of the rock bit remains within set tolerances while the welding process is taking place.

Abstract: A solder pack consists of a thin heat resistant carrier board having spaced holes therethrough in which are held solder rings. The solder pack is, for example, placed over pins supported in correspondingly spaced holes in a printed circuit board so that each pin protrudes through an associated solder ring in the solder pack. Heat is applied to melt the solder rings to solder the pins to the printed circuit board. Two representative means for manufacturing solder packs are disclosed.

Abstract: A method and apparatus is disclosed for monitoring the gage diameter of a rock bit which utilizes electronic sensing principles. The use of electronic sensing devices provides continuous measurement of the rock bit gage through remote monitoring equipment. The sensing devices monitor the gage of the rock bit during the electron beam welding process to assure that the gage of the rock bit remains within tolerance.

Abstract: A process for joining together parent parts made from wrought austenitic stainless steel without sensitization of the parent material, and the product produced by this process. Each wrought workpiece has welded thereto an appendage made from cast (not wrought) austenitic stainless steel which is equal to or better in corrosion resistance and mechanical properties, and is compatible with the solution heat treatment requirements of the parent austenitic stainless steels. The resulting workpiece is solution heat treated at in-process stages of manufacture to dissolve the carbides which have been formed in the heat affected zone created by the welding operation. Then two of said workpieces are welded together at the abutment of the appendages, there being no formation of precipitated carbides in the parent material, because the heat affected zone does not extend into the wrought parent material, but instead is restricted to the appendage which by definition is not sensitizable.

Abstract: A mass wave soldering apparatus is described. The apparatus comprises a sump having upwardly diagonally extending front and rear walls, and a pair of vertical end walls which cooperate to form an upwardly extending open ended nozzle chamber of increasing plan area. A Z-shaped baffle screen is positioned within the nozzle chamber and distributes the molten solder pumped upwardly in the sump as a wide, smooth substantially unidirectional solder wave ideally contoured for high-speed production soldering.

Abstract: An auger manufacturing apparatus comprising an adjustable former mechanism including a plurality of linearly adjustable die roller members and an associated movable chuck assembly. A conveyor carries a metal ribbon to the adjustable former mechanism which bends the ribbon around a pipe. The pipe is supported in part by the chuck assembly which includes a rotatable ring with a ribbon holding mechanism and an adjustable pipe seat. The cylindrical pipe is mounted in the seat and the leading edge of incoming metal ribbon is securely held by said ribbon holding mechanism.

Abstract: Apparatus for use with an ultrasonic plastic welder in which an ultrasonic horn on a movable welding head produces sonic vibrations along a first axis generally normal to the contacting surfaces of the workpieces to be welded together, the apparatus rendering the welder suitable for welding metals. The apparatus includes a coupling member removably connected to the distal end of the horn and extending transversely thereof and having coupled thereto a workpiece-engaging member capable of adjustment along a second axis parallel to the first axis. A force-applying member is connected to the welding head and extends therefrom toward the workpieces, with the workpiece-engaging member being adjusted to contact the lower end of the force-applying member at a fulcrum point so that axial vibration of the coupling means by the horn serves to pivot the workpiece-engaging member about the fulcrum point to effect a vibration transverse to the first axis at the contacted workpiece.

Abstract: A solder preform for hermetically sealing a cover to a container for a semiconductor package comprises a relatively thick flat ring of an alloy consisting of substantially 95% lead, 2.5% tin, and 2.5% silver, which alloy has the characteristic that it solidifies from the fluid state as a homogeneous mixture without substantial separation of the minority element crystals. The solder preform further comprises a relatively thin coating clad on each surface of the flat ring of an oxidation-resistant alloy, preferably an alloy consisting of substantially 96.5% tin and 3.5% silver.