Patents Examined by K. Lau
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Patent number: 4685031Abstract: An edgeboard connector having a large number of contacts accommodated in a housing cavity is adapted to mount one or more printed circuit boards having lesser numbers of contacts pads and to assure that the contact pads on the boards are electrically engaged with predetermined ones of the connector contacts by attaching one or more detachable members to the housing within the cavity to engage lateral edges of the printed circuit boards as they are inserted into the connector cavity to position the boards in the cavity.Type: GrantFiled: February 24, 1986Date of Patent: August 4, 1987Assignee: Texas Instruments IncorporatedInventors: Robert M. Fife, Dennis Ross, Richard F. Shaw
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Patent number: 4685033Abstract: A multilayer wiring substrate is described wherein a plurality of power supply wiring layers for supplying different voltages is arranged in a first group and interlayered with insulation layers and an additional plurality of power supply wiring layers arranged in a second group, each for providing the same voltage as a layer in the first group, is disposed within the same substrate and interlayered with insulation layers. Corresponding wiring layers of the first and second group are interconnected with via-hole wirings. A signal wiring section is disposed on the power supply wiring section. Polyimide layers of insulation separate the wiring layers of the signal wiring section and via-hole wirings include a mixture of gold and polyimide.Type: GrantFiled: August 23, 1985Date of Patent: August 4, 1987Assignee: NEC CorporationInventor: Tatsuo Inoue
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Patent number: 4685030Abstract: A surface mounted circuit is disclosed. The circuit includes an insulating substrate, a chemical vapor deposited interconnect layer of conductive metal, as Cr, Fe, Co, Ni, W, Mo, Mn or mixtures thereof, and at least one circuit element. The surface mounted circuit includes an interfacial layer of W, Mo, Mn, or a mixtures thereof, chemical vapor deposition of an interconnect layer of Cr, Fe, Ni, Co, Mn, W, Mo, or mixtures thereof, and bonding of a circuit element atop the interconnect layer. Also disclosed is a support, adapted for use as a circuit board for a surface mounted circuit.Type: GrantFiled: April 29, 1985Date of Patent: August 4, 1987Assignee: Energy Conversion Devices, Inc.Inventors: Jaime Reyes, David Allred
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Patent number: 4685032Abstract: An electronic system is packaged to provide a single etched backplane. Bus bars are physically fastened to bushings which are soldered to the backplane power etch lines to provide power to the system.Printed circuit boards are plugged into connectors mounted on the backplane for receiving power and transferring logic signals between printed circuit boards. A number of power supplies are plugged into connectors mounted on the bus bars for transmitting power, and plugged into connectors for transferring logic signals.Type: GrantFiled: July 1, 1985Date of Patent: August 4, 1987Assignee: Honeywell Information Systems Inc.Inventors: John W. Blomstedt, Paul S. Yoshida, Wesley F. Irving, Vladimir Roudenko
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Patent number: 4682271Abstract: A printed circuit board having a circuit pattern formed on at least one of the first and second faces of a substrate and having characters and symbols representing components to be mounted on said substrate printed on the first face and the second face of the substrate, wherein the characters printed on the first face have been printed in the reversed images in about the corresponding positions of the back face. Since the characters printed on the first face of the printed circuit board are also printed in the reversed images in the immediately corresponding positions of the second face of the board, these characters can be used as indexes to find a particular position on the printed circuit board, and the first or second face can be instantly distinguished from the second or first face.Type: GrantFiled: March 27, 1986Date of Patent: July 21, 1987Assignee: Kabushiki Kaisha ToshibaInventor: Kazuhiko Yamada
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Patent number: 4682270Abstract: A chip carrier includes a body (1) having a central region and sidewalls (31) connected to the central region by an elastically deformable region (33), in order to reduce thermal strains.Also for the same reason a heat sink (41) may be attached underneath the carrier below the carrier's die attachment site (8) and thermally conductive material (40,42) may connect them together. The heat sink may be used for mechanical anchorage.The chip carrier may be produced by injection moulding from an aromatic thermoplastic polymer.A carrier may be moulded with more than one die attachment site or a circuit board with die attachment sites could be moulded, preferably with the die attachment site recessed so that the surface of the die 9 is co-planar with conductive tracks on the board.Type: GrantFiled: May 16, 1985Date of Patent: July 21, 1987Assignee: British Telecommunications public limited companyInventors: Graham K. Whitehead, Kenneth Taylor
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Patent number: 4680675Abstract: A printed circuit terminal device which includes a terminal array having very fine pitch between lead lines from a circuit portion including a flexible printed circuit board having a terminal array pattern which corresponds to the terminal array and wiring pattern and which are arranged to alternately extend from two sides of the terminal array pattern thus changing the pitch of the wiring pattern on the flexible printed circuit board to be twice that of the pitch of the wiring pattern of the terminal array. This allows a circuit to be easily and reliably coupled to the electrical terminals having very fine pitch and the formation of the wiring pattern of a coupling portion with the circuit portion can be easily performed and results in an arrangement of very small size. The flexible printed circuit board can be manufactured at low cost and the yield can be increased. Also, circuit elements such as resistors can be mounted on the wiring pattern without changing the wiring pitch.Type: GrantFiled: April 22, 1985Date of Patent: July 14, 1987Assignee: Sony CorporationInventor: Hideo Sato
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Patent number: 4679016Abstract: An interchangeable operating mechanism assembly for molded case circuit breakers having a detachable movable contact arm and trip unit assembly allows the same mechanism assembly to be employed across a wide range of breaker ratings. A snap-on common trip bar attachment further allows multiple-pole facility off the common interrupter mechanism assembly. The mechanism assembly is designed to maintain the operating handle in the "on" position upon the occurrence of a welded contact and prevents the mechanism from being reset.Type: GrantFiled: January 8, 1986Date of Patent: July 7, 1987Assignee: General Electric CompanyInventors: Ronald D. Ciarcia, Gregory T. DiVincenzo, Richard E. Bernier, Joseph G. Nagy
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Patent number: 4679018Abstract: A circuit breaker apparatus characterized by a molded case containing a circuit breaker structure for opening and closing a circuit which structure comprises a releasable lever operable between latched and unlatched positions corresponding to open and closed circuit conditions, latch means including a latch lever for the releasable lever, interconnected toggle connected to the latch lever and that are biased to the unlatched position of the lever, and a movable trip bar responsive to predetermined overcurrents and having a projection contacting the toggle links for holding the links in the unbiased position.Type: GrantFiled: January 15, 1986Date of Patent: July 7, 1987Assignee: Westinghouse Electric Corp.Inventors: Jere L. McKee, Glenn R. Thomas
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Patent number: 4677406Abstract: A protective switching apparatus is provided comprising in an insulating case an interruptible current path in which cooperating contacts are disposed, one of which is fixed and the other is mobile in response to the actuation of a tripping member. The mobile contact is disposed at a first end of a contact holder arm whose second end is associated with a retractable fulcrum forming the output member of the lock, the contact holder arm being subjected to the action of a resilient quick opening means and to the action of a resilient closure means. The contact holder arm is mounted without fixed fulcrum, so as to pivot either by bearing against a bearing surface of the toggle joint during tripping on a fault, or against a bearing surface of the retractable fulcrum of the lock during voluntary manual or automatic tripping.Type: GrantFiled: December 12, 1985Date of Patent: June 30, 1987Assignee: La Telemecanique ElectriqueInventors: Jacques Landron, Christian Pichard
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Patent number: 4675786Abstract: A flexible circuit board and method of making the same is presented wherein the circuit board includes conductive through-holes for installation of components and includes a sloping electrolytic plating portion between the through-hole portions and remaining flexible portions of the circuit board.Type: GrantFiled: June 21, 1985Date of Patent: June 23, 1987Assignee: Nippon Mektron, Ltd.Inventors: Tsutomu Mizuko, Toshiyuki Tsukahara, Masahiro Yoshida, Koji Nemoto
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Patent number: 4674007Abstract: In order to be able to adapt an electronic circuit board apparatus designed for a particular IC chip configuration to accept other chips to perform the same function, the socket for the IC chip is provided with a set of jumper terminals coupled to selected ones of the socket so that in the event the IC chip for which the IC chip was designed is not available, the circuit board can use other IC chips by connecting the jumpers to in effect redefine the socket. In addition, redundant parallel circuitry and IC chip sockets can be provided on the circuit board with each IC socket being wired to accept a variety of functionally identical IC chips.Type: GrantFiled: July 29, 1985Date of Patent: June 16, 1987Assignee: Microscience CorporationInventor: Barry J. Tragen
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Patent number: 4670725Abstract: In a relay tongue unit intended to be included in an electric relay the unit comprises at least one tongue unit in the form of a resilient sheet consisting of an attaching member, which comprises a main portion (1), a fuse portion (2) and a transition portion (3), and a tongue portion (4). This has at its free end a contact (5) and a resistance portion.Type: GrantFiled: November 8, 1985Date of Patent: June 2, 1987Assignee: Tocksfors Verkstads ABInventor: Wilgot Ahs
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Patent number: 4665377Abstract: A method of adjusting the values of resistors is described wherein regions of a resistive layer provided on a substrate are removed by means of a laser in dependence on the resistance that is required and/or by cutting marks of a specific shape into the resistive layer. In order to obtain resistors with values which are defined as accurately as possible, and which are free of disturbing inductivity, a point raster is formed in the resistive layer by means of single shots of the laser, with the extent and position of the raster, and/or the spacing between its individual points, and/or the size of the individual points being chosen in relation to the total area of the resistive layer in dependence on the required resistance and further physical values.Type: GrantFiled: September 18, 1984Date of Patent: May 12, 1987Assignees: Roederstein Spezialfabriken fur Bauelemente der Elektronik, Kondensatoren der Starkstromtechnik GmbHInventor: Alfons Harpaintner
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Patent number: 4665468Abstract: A multi-layer comprising a multi-layer glass ceramic substrate and a multi-layer wire line matrix. The multi-layer wired line matrix includes an insulating layer made from a photosensitive insulating layer, amenable to time geometry processing. The insulating layer of the multi-layer wire line matrix has a pad for accommodating variations of the locations of the through holes. The metal is plated in and fills the through holes so that the metal is not cut off at the corners. The wire line matrix is composed of a plurality of layers of a photo-lithographically formed fine conductive pattern. The glass ceramic insulating layer is also formed photo-lithographically, and is formed of the source material of the insulating layers.Type: GrantFiled: July 10, 1985Date of Patent: May 12, 1987Assignee: NEC CorporationInventor: Akihiro Dohya
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Patent number: 4656446Abstract: A current limiting circuit breaker characterized by pairs of stationary and movable contacts with the movable contacts connected in series; an arc-extinguishing chamber including arc guide rails associated with each pair of contacts and in side-by-side relationship; manually operable means for opening and closing the circuit through the contacts; current-limiting electromagnetic means for opening the contact; and linkage means between the manually operable and electromagnetic means for enabling opening of the contacts by the electromagnetic means without tripping the manually operable means.Type: GrantFiled: December 17, 1985Date of Patent: April 7, 1987Assignee: Westinghouse Electric Corp.Inventors: Yun-Ko N. Chien, John A. Wafer
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Patent number: 4649358Abstract: A reset mechanism for a rotary switch, which is manually switchable from a rest position into any desired switch position, for resetting the switch in response to a drop of the electric power supply grid voltage below a predetermined minimum voltage, which includes an electromagnet with an armature, a switching drive shaft including a hand grip section for manually turning the drive shaft into any desired switch position, and a further section having a pinion, shaft sections being freely rotatable relative to each other. A reset device is displaceable transversely to the shaft axis, the reset device including a rack arranged to mesh with the drive shaft pinion and biased by a return spring. A blocking ram is resiliently supported on the armature for displacement in the direction of the shaft axis.Type: GrantFiled: December 9, 1985Date of Patent: March 10, 1987Inventor: Hubert L. Naimer
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Patent number: 4646204Abstract: The printed circuit board (PCB) is provided with a plurality of square connector stakes, which are pressed into the respective holes disposed in the PCB. The connector stake holes are arranged on the PCB such that a conductive pad encircles each of the connector holes. The connector holes have a cross-section that provides the required mechanical interference between the connector stakes and the connector holes to hold the stakes in place prior to soldering. At the same time, the walls of the holes are configured to limit the flux from migrating to the upper portions of the connector stakes during the wave soldering operation.Type: GrantFiled: February 10, 1986Date of Patent: February 24, 1987Assignee: RCA CorporationInventor: Eric A. Brauer
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Patent number: 4644308Abstract: A variable composition switching device realizable by the assembling of modular elements and including at least one circuit breaker module i.e. switch module and at least one control and/or protection module. The circuit breaker module consists of a case with two opposing junction sides allowing for assembly by juxtaposition of several circuit breaker modules, one assembly side comprising a duct orifice of the thruster of the curcuit breaker device and two assembly areas of a control and/or protection module. The control modules include suitable means for activating the thruster.Type: GrantFiled: September 27, 1985Date of Patent: February 17, 1987Assignee: La Telemecanique ElectriqueInventors: Jean-Pierre Guery, Gerald Gashet, Jacques Olifant, Raymond Plumeret
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Patent number: 4640866Abstract: A printed circuit board is provided comprising at least one layer of metal firmly bonded in laminar contact with at least one layer of solid, sintered polytetrafluoroethylene (PTFE). In one embodiment, the solid PTFE layer contains fibers of porous, expanded, sintered PTFE mixed within it. In another embodiment, the solid PTFE layer is firmly bonded to the metal layer on one side and is firmly bonded on the other side to a layer of porous, expanded, sintered PTFE.Type: GrantFiled: April 1, 1985Date of Patent: February 3, 1987Assignee: Junkosha Company Ltd.Inventor: Hirosuke Suzuki