Abstract: A coating system includes a coating robot and an operation robot. The coating robot has a height and is mounted in a coating booth to coat a workpiece while the workpiece is conveyed in the coating booth in a conveyance direction substantially perpendicular to a height direction. The workpiece including a body and a movable part movable with respect to the body. The operation robot is disposed in the coating booth below the coating robot in the height direction. The operation robot is movable in the coating booth in the conveyance direction and is configured to move the movable part of the workpiece.

Abstract: A coating system includes coating robots configured to coat a vehicle, and an operation robot. The operation robot includes a first arm configured to turn around a first axis; a second arm configured to turn around a second axis parallel to the first axis; a third arm configured to turn around a third axis parallel to the first axis; a fourth arm configured to turn around a fourth axis perpendicular to the first axis; a fifth arm configured to turn around a fifth axis parallel to the fourth axis; and a tip jig is supported at the fifth arm and is configured to turn around a sixth axis. The sixth axis is selectively parallel to the fifth axis or perpendicular to a plane which includes the fourth axis and the fifth axis.

Abstract: An embodiment of a line-of-sight coating fixture includes a support structure, a spindle, and a shadow structure. The support structure includes a plurality of compartments disposed below a platter, each compartment having an opening on a periphery of the support structure. Each compartment is adapted to receive and secure a base of a workpiece such that a body of each workpiece to be coated is disposed about a periphery of the support structure and extends above the platter. The spindle is disposed through a center of the platter or support structure for rotating the workpieces thereabout. The shadow structure is disposed about the spindle, inside of the periphery, the shadow structure sized and adapted to shield a portion of each workpiece from line-of-sight coating material.

Abstract: A gas wiping nozzle configured to blow wiping gas onto a metal strip includes a first nozzle member and a second nozzle member provided to face each other, in which a slit as a gas blowing port is formed to extend in a length direction between end portions of the first nozzle member and the second nozzle member on the metal strip side; and a shim member configured to adjust a gap of the slit in a width direction orthogonal to the length direction, wherein the shim member is made of a ceramic material or a carbon material, each of the first nozzle member and the second nozzle member has a groove portion, and the shim member is fitted into both of the groove portions of the first nozzle member and the second nozzle member and fixes the first nozzle member and the second nozzle member.

Abstract: Disclosed herein is a tool for holding a spray painting instrument, such as a painting gun for painting an internal surface of a pipe. In particular, the inventive tool is ideal for painting the interior of curves and angles in a pipe and is capable of moving through and uniformly painting up to 90 degree angles of pipes or hollow tubes. The tool has a hollow central tube for carrying a spray-painting gun and at least two projections extending outwardly from an outer surface of the hollow tube. A retracting arm assembly is provided on each projection. Each retracting arm assembly includes first and second retracting arms and a corresponding force exertion mechanism. In operation, when the tool is inserted inside the pipe, each retracting arm touches the internal surface of the pipe due to an outward force exerted thereon. The tool is movable inside the pipe and adjusts automatically to different pipe diameters.

Abstract: A substrate processing apparatus 1 is configured to supply a processing liquid to a peripheral portion of a wafer W being rotated. The substrate processing apparatus 1 includes a rotating/holding unit 21 configured to rotate and hold the wafer W; a processing liquid discharging unit 73 configured to discharge the processing liquid toward the peripheral portion of the wafer W held by the rotating/holding unit 21; a variation acquiring unit configured to acquire information upon a variation amount of a deformation of the peripheral portion of the wafer W; and a discharge controller 7 configured to control a discharge angle and a discharge position of the processing liquid from the processing liquid discharging unit 73 onto the peripheral portion based on the information upon the variation amount of the deformation of the peripheral portion acquired by the variation acquiring unit.

Abstract: A control unit obtains a captured image of a reference workpiece by a second image capturing unit after a droplet ejected from a droplet ejecting head lands toward a reference mark formed on an upper surface of the reference workpiece, detects a positional deviation amount of a position of the reference mark and a landing position of the droplet based on the captured image, and calculates the correction amounts of the relative positions of a workpiece table and a droplet ejecting head based on the positional deviation amount.

Abstract: A semiconductor processing apparatus is disclosed. The apparatus may include a multiple chamber module comprising at least a first reaction chamber and a second reaction chamber, and a first substrate support structure disposed within the first reaction chamber and a second substrate support structure disposed within the second reaction chamber. The apparatus may also include a wafer handling chamber comprising a transfer robot configured for transferring two or more substrates along a first transfer path between the wafer handling chamber and the first substrate support structure and a second transfer path between the wafer handling chamber and the second substrate support structure. The apparatus may also include at least a first pyrometer and a second pyrometer, wherein a first optical path of the first pyrometer intersects the first transfer path and a second optical path of the second pyrometer intersect the second transfer path.

Abstract: Disclosed is droplet ejecting apparatus that ejects droplets of a functional liquid onto a workpiece to draw a pattern. The droplet ejecting apparatus includes: a workpiece table; a droplet ejecting head configured to eject the droplets onto the workpiece placed on the workpiece table; a movement mechanism configured to relatively move the workpiece table and the droplet ejecting head in a main scanning direction and a sub-scanning direction; and a control unit configured to: detect a position of the workpiece or a position of the workpiece table while relatively moving the workpiece table and the droplet ejecting head along a plurality of scanning lines extending in the main scanning direction and set side by side in the sub-scanning direction; and create, based on a detection result, a correction table that indicates a correlation between a position of the movement mechanism and a positional correction amount of the workpiece table.

Abstract: Systems for creating electrodes for polymer electrolyte membrane fuel cells include an XY stage having a heated vacuum table physically coupled to the XY stage. The vacuum table has a working face with a plurality of channels formed therein to communicate vacuum pressure from a port coupled to a vacuum source to the channels. A sheet of perforated heat-conductive material has staggered holes configured to evenly distribute the vacuum pressure from the channels through the perforated sheet. A heat-conductive wire mesh is placed over the perforated sheet, and has openings smaller than the staggered holes such that a membrane material placed on the wire mesh is not deformed by the vacuum pressure. A nanopipette or micropipette coupled to a pump is configured to deposit electrode ink onto an exposed surface of the membrane material as the controller device causes the XY stage to move the vacuum table to control deposition of the electrode ink onto the surface of the membrane material.

Abstract: The fine metal mask provided in the present disclosure includes at least one mask pattern portion, and at least one protective portion that is disposed on and connected with at least one side edge of the at least one mask pattern portion, wherein a thickness of the at least one protective portion is less than a thickness of the at least one mask pattern portion.

Abstract: Disclosed is a workpiece processing apparatus that performs a predetermined processing on a workpiece. The workpiece processing apparatus includes: a workpiece table configured to place the workpiece thereon; a processor configured to process the workpiece placed on the workpiece table; a movement mechanism configured to relatively move the workpiece table and the processor; a position measuring device configured to measure a position of the movement mechanism; a detector configured to detect a position of the workpiece placed on the workpiece table; and a corrector configured to calculate a positional correction amount of the workpiece table based on a measurement result of the position measuring device and a detection result of the detector.

Abstract: A droplet ejecting apparatus includes a workpiece table configured to place a workpiece thereon, a droplet ejecting head configured to eject droplets onto the workpiece placed on the workpiece table, a Y-axis linear motor configured to move the workpiece table in a main scanning direction (Y-axis direction), a position detector configured to detect a position of a carriage mark, and a control unit configured to calculate the positional deviation amount in the main scanning direction between a detection position detected by the position detector and a reference position of the carriage mark and correct a droplet ejecting timing of the droplet ejecting head based on the positional deviation amount.

Abstract: A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means including a rotatable spinner table for coating the workpiece with a resin, cleaning means, a grinding unit, and a transfer unit. The transfer unit includes a first transfer unit transferring the workpiece from the positioning means to the spinner table and from the spinner table to the chuck table, a second transfer unit transferring the workpiece from the chuck table to the cleaning means, and a front/back surface inversion transfer unit taking over the workpiece from the cleaning means to the second transfer unit.

Abstract: An apparatus for treating a metal strip after it has exited from a coating container with a liquid coating material, for example zinc is provided. The apparatus includes a blow-off device arranged above the coating container having an air outlet gap for blowing off excess parts of the still liquid coating material from the surface of the metal strip after the passing of the metal strip through the coating container. An electromagnetic stabilizer is arranged above the blow-off device and has a plurality of individual magnets for stabilizing the metal strip after leaving the coating container and the blow-off device. In order to further increase the efficiency of the apparatus, at least some of the magnets of the stabilizer are formed as pot magnets with pot coils.

Abstract: A coating apparatus and a method are disclosed for coating tablets in a rotating drilled container at the outlet of which a rotating annular element operates that is coaxial with the container, in which in an initial transition phase the annular element rotates in a direction that is opposite the rotation direction of the container to retain the tablets inside the container, forming a bed of tablets until a desired level is reached, and in a stationary phase the annular element rotates in a direction that is the same as the rotation of the container to permit the exit of the tablets, until the quantity of tablets entering the container is the same that the quantity exiting.

Abstract: A drying assembly comprises a plurality of electromagnetic energy sources arranged to dry printing fluid deposited onto a surface of a substrate, by evaporation of a solvent fluid therefrom. The drying assembly further comprises a conveyor system configured to move the substrate in a conveying direction, and a focusing system configured to focus electromagnetic energy from the plurality of electromagnetic energy sources to form a non-uniform heating pattern on the surface of the substrate. The non-uniform heating pattern comprises a plurality of spatially separated higher and lower intensity regions distributed along the conveying direction.

Abstract: When a portion for measuring the plating adhesion amount reaches an upstream side position, plating adhesion amount estimation values are calculated by using a plating adhesion amount estimation expression at positions away from a position that faces the distance sensors, that is, the upstream side position, by strip-width direction distances, of the surfaces of the steel strip. When the portion for measuring the plating adhesion amount reaches a downstream side position, the strip-width direction distances of the plating adhesion amount meters are matched to the strip-width direction distances, and the plating adhesion amount actual measurement values are obtained. The plating adhesion amount estimation expression is corrected on the basis of the differences between the plating adhesion amount estimation values and the plating adhesion amount actual measurement values. Accordingly, the control accuracy of the plating adhesion amount is improved.

Abstract: A substrate processing apparatus 1 is configured to supply a processing liquid to a peripheral portion of a wafer W being rotated. The substrate processing apparatus 1 includes a rotating/holding unit 21 configured to rotate and hold the wafer W; a processing liquid discharging unit 73 configured to discharge the processing liquid toward the peripheral portion of the wafer W held by the rotating/holding unit 21; a variation width acquiring unit configured to acquire information upon a variation width of a deformation amount of the peripheral portion of the wafer W; and a discharge controller 7 configured to control a discharge angle and a discharge position of the processing liquid from the processing liquid discharging unit 73 onto the peripheral portion based on the information upon the variation width of the deformation amount of the peripheral portion acquired by the variation width acquiring unit.

Abstract: A method and device for laser cladding by independently heating the cladding material and the surface of the workpiece consist in formation of the series of parallel annular laser beams, possibly different wavelengths, with an adjustable distribution of laser radiation power across the annular beams. The annular beams are transformed into a series of conical beams which are separately focused along a single optical axis, along which the cladding material is fed. The device can be supplemented with a cylindrical mirror for the multipass laser radiation through the stream of cladding material with the possibility of the laser radiation return to the laser resonator.