Abstract: A thin-film device for a wavelength-tunable semiconductor laser. The device includes a cavity between a high-reflectivity facet and an anti-reflection facet designed to emit a laser light of a wavelength in a tunable range determined by two Vernier-ring resonators with a joint-free-spectral-range between a first wavelength and a second wavelength. The device further includes a film including multiple pairs of a first layer and a second layer sequentially stacking to an outer side of the high-reflectivity facet. Each layer in each pair has one unit of respective optical thickness except one first or second layer in one pair having a larger optical thickness. The film is configured to produce inner reflectivity of the laser light from the high-reflectivity facet at least >90% for wavelengths in the tunable range starting from the first wavelength but at least <50% for wavelengths in a 25 nm range around the second wavelength.

Abstract: A quantum communication system that includes a multiphoton entanglement generator, a plurality of photon detector units, and a plurality of optical fiber links. The plurality of photon detector units include a first photon detector unit and a second photon detector unit. The multiphoton entanglement generator is structurally configured to output more than two entangled photons. The plurality of optical fiber links comprise a first optical fiber link optically coupled to the multiphoton entanglement generator and disposed between the multiphoton entanglement generator and the first photon detector unit. The plurality of optical fiber links comprise a second optical fiber link optically coupled to the multiphoton entanglement generator and disposed between the multiphoton entanglement generator and the second photon detector unit. Further, at least one of the plurality of optical fiber links has a core, a cladding, and a scattering region having a plurality of scattering structures.

Abstract: Optical modulators are described having a Mach-Zehnder interferometer and a pair of RF electrodes interfaced with the Mach-Zehnder interferometer in which the Mach-Zehnder interferometer comprises optical waveguides formed from semiconductor material. The optical modulator also comprises a ground plane spaced away in a distinct plane from transmission line electrodes formed from the association of the pair of RF electrodes interfaced with the Mach-Zehnder interferometer. The ground plane can be associated with a submount in which an optical chip comprising the Mach-Zehnder interferometer and the pair of RF electrodes is mounted on the submount with the two semiconductor optical waveguides are oriented toward the submount. Methods for forming the modulators are described.

Abstract: An fiber-optic connector assembly includes a fiber optic ferrule and a connector, which engage an optical transceiver component. The fiber optic ferrule engages a mating plane of a lens array in the optical transceiver component and floats within the connector. The engagement of the assembly and the optical transceiver component may be removable rather than fixed. The fiber optic ferrule also engages a mechanical interface to account for three degrees of freedom, while the engagement of the mating surfaces account for another three degrees of freedom.

Abstract: A fiber splice cassette includes a main chassis, a removable cover, splice sleeve holders, and four cable clamp boots. The main chassis forms a cavity having a plurality of cable organizing tabs for cable management. Splice sleeve holders are located in the cavity of the main chassis, each of the splice sleeve holders being selectively removable from a corresponding splice sleeve holder nest and being configured for specific splicing capabilities while maintaining the structural strength of the holders. The splice sleeve holder nests may be selectively and removably attached to an interior surface of the fiber cable enclosure via a variety of means to allow the splice sleeve holder nests to be easily rotated, relocated, or accessed for maintenance.

Abstract: This optical coupling device couples a plurality of beams to a single fiber. A plurality of light sources is arranged at predetermined intervals and emits the plurality of beams. A plurality of collimating lens is arranged to face the plurality of light sources and collimates the plurality of beams emitted from the plurality of light sources. A reduction optical system reduces the beam diameter of the plurality of beams collimated by the plurality of collimating lens. A focusing lens focuses the plurality of beams reduced by the reduction optical system on a fiber. A first distance between the light source and the collimating lens arranged so as to correspond to a beam passing through the center of the reduction optical system is different from a second distance between the light source and the collimating lens arranged so as to correspond to a beam passing through the end portion of the reduction optical system.

Abstract: Structures for a wavelength-division multiplexing filter and methods of forming a structure for a wavelength-division multiplexing filter. A waveguide core of the wavelength-division multiplexing filter includes a first bend having a first curvature and a second bend having a second curvature different than the first curvature. The structure further includes a waveguide core region having a first end surface, a second end surface, and a bend arranged between the first and second end surfaces. The bend is positioned over the first bend of the waveguide core in an overlapping relationship.

Abstract: Aspects of the present disclosure are directed to process flow to fabricate a waveguide structure with a silicon nitride core having atomic-level smooth sidewalls achieved by wet etching instead of the conventional dry etching process.

Abstract: The present disclosure relates to a fiber optic cable that includes a plurality of internal optical fibers and a fiber optic cable portion. The fiber optic cable portion includes an outer jacket and an inner conduit, the inner conduit containing the plurality of optical fibers disposed therein. The fiber optic cable further includes a flexible conduit portion, wherein the flexible conduit portion has a proximal end and a distal end. The proximal end is secured to the fiber optic cable portion and the distal end has a terminating device. The terminating device at least partially encases the flexible conduit portion, and the plurality of optical fibers passes through the flexible conduit portion and the terminating device.

Abstract: Fiber optic connectors, connector housings, connectorized cable assemblies, and methods for the connectorization of cable assemblies are provided with particular cable adapter features, adapter extensions, multi-diametrical sealing flexures, subcutaneous sealing elements, and combinations thereof, for improved connector and cable performance, integrity, and durability.

Abstract: Use of a sensor read out system with at least one fiber optical sensor, which is connected via at least one signal line to a processing unit as part of an additive manufacturing setup, for in situ and real time quality control of a running additive manufacturing process.

Abstract: Optical beam forming at the inputs/outputs of a photonic chip and to the spectral broadening of the light coupled to the chip. The photonic chip comprises an optical waveguide layer supported on a substrate. The chip includes an optical waveguide structure made of silicon and a coupling surface grating. The photonic chip has a front face on the side facing the coupling surface grating and a rear face on the side facing the substrate. A reflecting collimation structure is integrated in the rear face to modify the mode size of an incident light beam. The coupling surface grating is designed to receive light from the optical waveguide structure and to form a light beam directed to the reflecting collimation structure. The invention further relates to the method for producing such a chip.

Abstract: An optical connection identification assembly includes first and second connectors for conveying optical signals within and away from the optical connection identification assembly, first and second optical filters configured for conveying optical signals to and from the respective first and second connectors and between each other, and first and second photodiodes. The first photodiode is configured for receiving optical signals from the first optical filter to confirm the optical connection identification assembly is receiving optical signals. The second photodiode is configured for receiving optical signals from the second optical filter to confirm the optical connection identification assembly is receiving optical signals. The first and the second connectors are on opposite sides of each of the first and the second optical filters and each of the first and the second photodiodes.

Abstract: The invention provides a light guide element comprising a light guide and a layer element, wherein the light guide comprises a light guide face and wherein the layer element comprises an optical layer, wherein said optical layer is in contact with at least part of the light guide face, wherein the optical layer has a first index of refraction (n1) smaller than the refractive index of seawater, wherein the light guide comprises a UV radiation transmissive light guide material.

Abstract: This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

Abstract: An object is, in a pluggable optical module, to compactly house an optical fiber used for connecting optical components in a housing in which a plurality of optical components are mounted. The pluggable optical module (100) includes: a plurality of optical components, a printed circuit board (51); one or more optical fibers; and optical fiber housing means (14). All or a part of the plurality of optical components are mounted on the printed circuit board (51). One or more optical fibers connect between the plurality of optical components. The optical fiber housing means (14) includes a guide that is disposed on a plate-like member and can wind the one or more optical fibers, and mounted to be stacked with the printed circuit board (51) on which the optical components are mounted and all or a part of optical components other than the optical components mounted on the printed circuit board (51).

Abstract: An optic fiber adaptor includes two flexible engaging members and two positioning walls cooperating with one another to define an insertion slot. Each engaging member has a first inclined surface and a second inclined surface disposed behind the first inclined surface. A distance between the first inclined surfaces of the engaging members decreases rearwardly so as to facilitate pushing of a casing body of a ferrule assembly into the insertion slot. A distance between the second inclined surfaces of the engaging members decreases forwardly so as to facilitate pulling of the casing body out of the insertion slot. An optic fiber connecting device having the optic fiber adaptor is also disclosed.

Abstract: The invention relates to an optical fiber 1 comprising a core 2 and a cladding 3 surrounding the core 2 and having an outer diameter of 125 ?m, the optical fiber 1 comprising a cured primary coating 4 directly surrounding the cladding 3 and a cured secondary coating 5 directly surrounding the cured primary coating 4, said cured primary coating 4 having a thickness t1 between 10 and 18 ?m and an in-situ tensile modulus Emod1 between 0.10 and 0.18 MPa, said cured secondary coating 5 having a thickness t2 between 10 microns and 18 microns and an in-situ tensile modulus Emod2 between 700 and 1200 MPa, wherein said first and second thicknesses and said first and second in-situ tensile moduli satisfy the following equation: 4%<(t1×t2×E mod1×E mod23)/(t1_norm×t2_norm×E mod1_norm×E mod2_norm3)<50%.

Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

Abstract: The present disclosure provides a waveguide structure including an optical component. The optical component includes a plurality of grating coupler teeth over a semiconductive substrate and a plurality of grating coupler openings between adjacent grating coupler teeth, wherein the grating coupler openings are configured to receive a light wave. Each of the grating coupler teeth includes a dielectric stack and an etch stopper embedded in the dielectric stack, wherein the etch stopper has a resistance to a fluorine solution that is higher than that of the dielectric stack. A method of manufacturing a semiconductor device is also provided.