Patents Examined by Kazi S Hossain
  • Patent number: 10741321
    Abstract: A thin film type inductor includes first, second and third exposed portions exposed to a first end surface of a body and fourth, fifth and sixth exposed portions exposed to a second end surface of the body opposing the first end surface of the body among external surfaces of the body. The first, second and third exposed portions are formed to be exposed symmetrically to the fourth, fifth and sixth exposed portions opposing the first, second and third exposed portions, respectively.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: August 11, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Boum Seock Kim, Kang Wook Bong, Byeong Cheol Moon, Joung Gul Ryu
  • Patent number: 10734151
    Abstract: A transformer for switched-mode power supplies includes a magnetizable core having a winding axis, at least one primary winding, which is formed by a primary winding conductor which at least partly surrounds the winding axis of the core, and at least one secondary winding, which is formed by a secondary winding conductor. The secondary winding conductor surrounds the primary winding conductor. The secondary winding is formed in one layer, and a cross section of the secondary winding conductor is rectangular, in particular square.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: August 4, 2020
    Assignee: Schmidhauser AG
    Inventors: Dirk Schekulin, Silvia Gross-Kaeufler, Chriss Haertsch, Thomas Bisig, Alex Itten, Piere Cavin
  • Patent number: 10736214
    Abstract: A printed circuit board and a method for the production thereof. The printed circuit board can include a shaped part made of an electrically conducting material and can be used to manage the currents and heat volumes that occur in the field of power electronics.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: August 4, 2020
    Assignee: JUMATECH GMBH
    Inventor: Markus Wölfel
  • Patent number: 10726990
    Abstract: A transformer includes a substrate having an input and an output, the input being connectable to one section of a medical electrical device, the output being connectable to another section of the medical electrical device. An input ground system and an output ground system, which is electrically isolated from the input ground system, provide continuous return paths for an input signal and an output signal, respectively. The transformer includes a primary winding electrically connected to the input, a secondary winding electrically connected to the output, and a core transferring data from the primary winding to the secondary winding using magnetic field coupling. A middle portion of the primary winding and a middle portion of the secondary winding wrap around the core and are twisted together. Other portions of the primary winding are twisted with one another, while other portions of the secondary winding are twisted with one another.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: July 28, 2020
    Assignee: Karl Storz Imaging, Inc.
    Inventor: Joseph Sanandajifar
  • Patent number: 10714254
    Abstract: An electronic component includes a body, a first inductor, and a low expansion portion. The body includes a laminated body including a plurality of insulating layers laminated in a lamination direction. The insulating layers contain a first resin as a material. The first inductor includes a first inductor conductor layer that adjoins one of the insulating layers. The low expansion portion has a coefficient of linear expansion lower than a coefficient of linear expansion of the plurality of insulating layers. The low expansion portion contains a second resin as a material. At least part of the low expansion portion is embedded in the laminated body. The second resin has a coefficient of linear expansion that is lower than a coefficient of linear expansion of the first resin.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: July 14, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi Nakatsuji, Kosuke Ishida, Mizuho Katsuta
  • Patent number: 10707006
    Abstract: An electrical appliance for connection to a high-voltage grid has a housing which can be filled with insulating liquid and in which there is arranged a core with at least one winding. A cooling module for cooling the insulating liquid is connected to the housing via attachment lines. The electrical appliance is inexpensive and can be quickly transported and quickly set in operation on site, in that the novel cooling module is fastened to the housing by way of a hook connection.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: July 7, 2020
    Assignee: Siemens Aktiengesellschaf
    Inventor: Christian Ettl
  • Patent number: 10707007
    Abstract: An electrical device for connecting to a high-voltage power grid has a boiler, which is filled with an insulating fluid and in which a magnetizable core and at least one winding, which surrounds a section of the core, are arranged, and a cooling system which includes at least one radiator which is arranged outside the boiler and is connected thereto via the radiator in order to circulate the insulating fluid, wherein the radiator has at least two heat exchange elements which are connected in parallel with one another. In order to enable a cold start to be accelerated and to be carried out even at relatively low temperatures only one of the heat exchange elements has a heat-conducting connection, as a heated heat exchange element, to a heat source which generates heat when the operation of the electrical device is started.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: July 7, 2020
    Assignee: Siemens Aktiengesellschaft
    Inventor: Florian Bachinger
  • Patent number: 10699842
    Abstract: In some embodiments, an electronic device includes an electronic component that is at least partially encapsulated by an adhesive doped with soft magnetic material that functions as an EMI shield for the electronic component. In various embodiments, an electronic device includes a first magnetic component separated from a second magnetic component by a gap within which is positioned an adhesive doped with soft magnetic material. The doped adhesive is positioned in a magnetic path between the first and second magnetic components and aids in magnetically coupling the first and second magnetic components and/or guides magnetic flux between the first and second magnetic components.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: June 30, 2020
    Assignee: Apple Inc.
    Inventors: Christopher S. Graham, Karl Ruben K. Larsson, Paul J. Thompson, Eric S. Jol, John S. Mosy, Albert J. Golko, Stephen E. Yao, Makiko K. Brzezinski
  • Patent number: 10685777
    Abstract: A three-phase AC reactor according to an embodiment of the present invention includes an input and output terminal block; a peripheral iron core disposed under the input and output terminal block; and at least three iron-core coils each constituted of an iron core and a coil wound around the iron core, so as to contact an inner surface of the peripheral iron core or so as to be coupled to the inner surface. The at least three iron-core coils form gaps that can be magnetically coupled between two of the iron-core coils adjoining each other. The three-phase AC reactor includes a phase-based coil extending member unit that extends from coil end portions of the coils as base points to connection points of the input and output terminal block.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: June 16, 2020
    Assignee: FANUC CORPORATION
    Inventors: Kenichi Tsukada, Kaname Matsumoto, Makoto Takeshita, Yuuichi Yamada, Masatomo Shirouzu
  • Patent number: 10685772
    Abstract: An electrical appliance for connection to a high-voltage network has a housing that is fillable with an insulating liquid, in which housing a core with at least one winding is arranged, and a bushing plug-in socket fixed to the housing and a high-voltage bushing insertable into the bushing plug-in socket. The electrical appliance is also able to be used at higher voltages, in that the high-voltage bushing has a fixing section, with which the high-voltage bushing can be fixed to the housing and/or to the bushing plug-in socket and from which the high-voltage bushing extends with a column section in a longitudinal direction over a length L2 towards a high-voltage terminal. The length L2 is greater than three meters.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: June 16, 2020
    Assignee: Siemens Aktiengesellschaft
    Inventor: Christian Ettl
  • Patent number: 10643785
    Abstract: A thin film type coil component that includes a body having a coil embedded therein and including a composite of magnetic powder particles and a polymer, and external electrodes disposed on at least portions of external surfaces of the body. The body includes an upper body portion disposed on an upper surface of the coil, a lower body portion disposed on a lower surface of the coil, and a central body portion disposed between the upper body portion and the lower body portion and including a central portion of the coil. The upper body portion and the lower body portion include a stacked structure of a plurality of magnetic sheets, each magnetic sheet including the composite of the magnetic powder particles and the polymer.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Young Seuck Yoo, Seok Il Hong
  • Patent number: 10643781
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: May 5, 2020
    Assignee: TDK CORPORATION
    Inventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito, Yuto Shiga
  • Patent number: 10629365
    Abstract: An inductor array component includes a body including a plurality of coil portions a coil included in the coil portions, external electrodes connected to both end portions of the coil and disposed on an outer surface of the body, a first blocking layer disposed between the coil portions, and a second blocking layer disposed within the first blocking layer.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: April 21, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Chul Sim, Dong Hwan Lee, Sang Jin Park, Chan Yoon
  • Patent number: 10622137
    Abstract: A three-phase AC reactor according to an embodiment of the present invention includes three-phase coils that are not arranged in parallel, an input and output terminal block having an input and output unit having a parallel arrangement, and an external connection position change unit disposed between a coil end of each of the three-phase coils and the input and output terminal block to connect the coil end to the input and output terminal block.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: April 14, 2020
    Assignee: FANUC CORPORATION
    Inventors: Kenichi Tsukada, Kaname Matsumoto, Makoto Takeshita, Yuuichi Yamada, Masatomo Shirouzu
  • Patent number: 10614951
    Abstract: A winding unit including a case is provided. The case has a receiving space capable of housing at least one turn of a coil portion in addition to a winding portion in a radial direction. In case, a blank portion having a dimension of one turn of the coil portion in the radial direction is formed between the two coil portions next to each other in the winding portion. When manufacturing the winding unit, the blank portion can be formed in a suitable position, and the number of turns of the winding portion (the number of coil portion) does not need to change. Further, an inductance value of the winding portion can be adjusted with simply structure.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: April 7, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Takahiro Nakahara, Ngahu Antony Wambugu, You Yanagida, Masao Ishizaka
  • Patent number: 10607768
    Abstract: An AC reactor according to an embodiment of this disclosure includes a peripheral iron core, and at least three iron core coils contacting or connected to an inner surface of the peripheral iron core. Each of the iron core coils includes an iron core and a coil wound around the iron core. The AC reactor further includes a terminal base unit for covering the iron core coils.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: March 31, 2020
    Assignee: FANUC CORPORATION
    Inventors: Kenichi Tsukada, Masatomo Shirouzu
  • Patent number: 10600540
    Abstract: A laminated coil component includes an element assembly formed by laminating a plurality of insulation layers and a coil unit formed inside the element assembly by a plurality of coil conductors. The element assembly includes a coil unit arrangement layer which has the coil unit arranged therein, and at least a pair of shape retention layers which is provided to have the coil unit arrangement layer interposed therebetween to retain a shape of the coil unit arrangement layer. The shape retention layer is made from glass-ceramic containing SrO, and a softening point of the coil unit arrangement layer is lower than a softening point or a melting point of the shape retention layer.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: March 24, 2020
    Assignee: TDK CORPORATION
    Inventors: Takahiro Sato, Yuya Ishima, Shusaku Umemoto, Takashi Suzuki, Satoru Okamoto, Yoshikazu Sakaguchi
  • Patent number: 10593449
    Abstract: Embodiments are directed to a method of forming a laminated magnetic inductor and resulting structures having multiple magnetic layer thicknesses. A first magnetic stack having one or more magnetic layers alternating with one or more insulating layers is formed in a first inner region of the laminated magnetic inductor. A second magnetic stack is formed opposite a major surface of the first magnetic stack in an outer region of the laminated magnetic inductor. A third magnetic stack is formed opposite a major surface of the second magnetic stack in a second inner region of the laminated magnetic inductor. The magnetic layers are formed such that a thickness of a magnetic layer in each of the first and third magnetic stacks is less than a thickness of a magnetic layer in the second magnetic stack.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: March 17, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
  • Patent number: 10593466
    Abstract: An electronic component including: a body having a shape of a rectangular parallelepiped, the body including a first end surface and a second end surface opposed to each other and a mounting surface; and a first external electrode provided on the first end surface and the mounting surface. A first portion of the first end surface inclines from a direction normal to the mounting surface so as to come closer to the second end surface with decreasing distance from the mounting surface in the normal direction, the first portion being a portion within a predetermined distance from the mounting surface in the normal direction. A thickness of a portion of the first external electrode contacting the first portion becomes greater with decreasing distance from the mounting surface in the normal direction.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: March 17, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masaki Kitajima, Yoshiharu Sato
  • Patent number: 10593464
    Abstract: A semiconductor element includes a first coil substantially located at a first plane; a second coil substantially located at the first plane; a connecting section that connects the first coil and the second coil; a third coil substantially located at a second plane different from the first plane; and a fourth coil substantially located at the second plane. The third coil and the first coil are connected through a through structure, and the fourth coil and the second coil are connected through a through structure. The third coil and the fourth are not directly connected.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: March 17, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Cheng-Wei Luo, Yuh-Sheng Jean, Ta-Hsun Yeh