Patents Examined by Kazi S Hossain
  • Patent number: 10395811
    Abstract: An inductive sensor includes a core body, a coil wound on the core body, a cavity having a fixed volume within the core body, and an epoxy mixture filling a controlled portion of the fixed volume. The controlled portion of the fixed volume filled with the epoxy mixture controls an inductance of the sensor.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: August 27, 2019
    Assignee: Simmonds Precision Products, Inc.
    Inventor: Sean Postlewaite
  • Patent number: 10366824
    Abstract: An air core reactor for use in an electric power transmission and distribution system or in an electric power system of an electrical plant is provided. The air core reactor comprises an electrically insulated support structure, a coil of windings configured to operate at a potential and isolated to ground or other potentials by the electrically insulated support structure and an insulator mounting bracket that attaches directly to the coil. The insulator mounting bracket is configured as an interface between the coil and the electrically insulated support structure.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: July 30, 2019
    Assignee: TRENCH LIMITED
    Inventor: Kamran Khan
  • Patent number: 10361022
    Abstract: A low profile, small size and high performance electronic device for use in, e.g., electronic circuits which provides maximum creepage and/or clearance distances. In one embodiment, the device is configured for a small footprint and utilizes two or more windings that require isolation. The exemplary device includes a self-leaded header made from a unitary construction which comprises a generally a box-like support body having a cavity for mounting a circuit element with primary and secondary windings, the support body having a base and a plurality of leads extending generally horizontally outward from the support body adjacent the base, the support body having one side opening on a side with leads permitting the loading of the inductive device in the cavity, and a routing channel residing on the top of the base, so as to maximize the creepage and clearance distance of the electronic device. Shaped-core and other embodiments are also disclosed.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: July 23, 2019
    Assignee: Pulse Electronics, Inc.
    Inventor: James Douglas Lint
  • Patent number: 10355642
    Abstract: A technique for reducing series resistance of an inductor system, which may increase the quality factor of the inductor system, has been disclosed. An apparatus includes a conductive loop formed from a first conductive layer. The conductive loop comprises a first terminal and a second terminal. The first terminal includes at least one first conductive finger in the first conductive layer. The second terminal includes at least one second conductive finger in the first conductive layer. The at least one second conductive finger is interdigitated with the at least one first conductive finger without directly contacting the at least one first conductive finger. The apparatus may include a serpentine gap in the first conductive layer. The apparatus may include at least one first conductive via coupled to a second conductive layer and coupled the at least one first conductive fingers, respectively.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: July 16, 2019
    Assignee: Silicon Laboratories Inc.
    Inventor: Aaron J. Caffee
  • Patent number: 10354789
    Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 ?m.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: July 16, 2019
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Patent number: 10340072
    Abstract: An electronic component includes a body made of a material containing particles of a metallic magnetic material, and an outer electrode disposed on a surface of the body. The surface of the body has a contact portion with which the outer electrode is in contact, and the surface of the body includes particles of the metallic magnetic material which are exposed from the surface of the body.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: July 2, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masaki Kitajima, Takashi Tomohiro, Gota Shinohara, Hironori Suzuki, Noriko Shimizu
  • Patent number: 10340079
    Abstract: A current transformer includes a closed magnetic circuit and a secondary winding. A first part of the closed magnetic circuit completely surrounds a primary conductor, and a second part of the closed magnetic circuit forms the secondary winding. The second part of the closed magnetic circuit serves as a magnetic core of the secondary winding. The closed magnetic circuit forms a plurality of branch magnetic circuits at the second part, and a secondary winding is formed on each branch magnetic circuit. Each branch magnetic circuit serves as a magnetic core of a corresponding secondary winding. Each secondary winding is staggered with each other in at least one of the length, the height and the thickness.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: July 2, 2019
    Assignees: SEARI ELECTRIC TECHNOLOGY CO., LTD., ZHEJIANG CHINT ELECTRICS CO., LTD.
    Inventors: Xiangjun Wan, Beilu Su, Jun Wang, Zhengxin Chen, Jing Feng
  • Patent number: 10319514
    Abstract: A coil device comprising; a winding coil including Cu and having a winding part and an extension line part which is pulled out from said winding part, a pair of electrodes made of a conductive material having, a connecting wire part having a connecting wire face connected with the extension line part and a protective face sandwiching said extension line part with said connecting wire face, and a base part provided with a mounting base face at one of the faces of the base and connected to said connecting wire part, a magnetic part including a magnetic material and covering at least said winding part and said connecting wire part.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: June 11, 2019
    Assignee: TDK CORPORATION
    Inventors: Nobuo Takagi, Kazuteru Kakizaki, Setu Tsuchida
  • Patent number: 10319508
    Abstract: An electronic component includes a plurality of groups arrayed in a stacking direction, each including a first inductor conductor layer, a second inductor conductor layer, a connection conductor layer and a first insulator layer. In each group, the first insulator layer is provided between a first superposed portion of the first inductor conductor layer and a second superposed portion of the second inductor conductor layer. The connection conductor layer is provided at the same position as the first insulator layer in the stacking direction, and electrically connects the first non-superposed portion and the second non-superposed portion included in the same group to each other. Among two adjacent groups in the stacking direction, a second superposed portion included in a group on another side in the stacking direction and a first superposed portion included in a group on one side in the stacking direction are physically connected to each other.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: June 11, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yasushi Takeda
  • Patent number: 10312013
    Abstract: Disclosed herein is a coil component that includes a drum core having a winding core and first and second flange portions provided at opposite ends of the winding core; a wire wound around the winding core; terminal electrodes provided in the first and second flange portions, the terminal electrodes being connected to ends of the wire; and a magnetic top plate made of magnetic-powder containing resin in which soft magnetic metal powder having a flat shape is mixed in binder resin, the magnetic top plate being fixed to the first and second flange portions.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: June 4, 2019
    Assignee: TDK CORPORATION
    Inventors: Yoshihiro Kawasaki, Syun Ashizawa, Hirohumi Asou, Nobuo Takagi
  • Patent number: 10312010
    Abstract: In an embodiment, a coil component 10 has a drum core 20 housed in a through hole 32 of a ring core 30, and two types of securing parts are provided in a gap G between an outer circumference of one flange part 24 of the drum core 20 and an inner circumference of the through hole 32. Terminal electrodes 50A, 50B connecting to ends 46A, 46B pulled out from a winding wire 40 wound around the drum core 20 are assembled to the ring core 30. Second securing parts 60A, 60B are arranged to opposite to each other with respect to a center C of the flange part 24, and first securing parts 62A, 62B are provided to cover an outer side of the second securing parts 60A, 60B. A hardness of the second securing part is higher than that of the first securing part.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: June 4, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Tetsuya Oga, Kazuhiko Otsuka, Yuji Shibuya
  • Patent number: 10312014
    Abstract: An inductor includes: a body having a coil including lead out portions disposed therein, and external electrodes connected to the lead out portions, at least partially disposed in the body, and exposed to a first surface of the body, thereby miniaturizing an inductor, securing Q characteristics, and improving inductance.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: June 4, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Han Lee
  • Patent number: 10304615
    Abstract: A method of forming a power module located on a conductive substrate by providing power conversion circuitry. The method of providing the power conversion circuitry includes forming a magnetic device by placing a magnetic core proximate a conductive substrate with a surface thereof facing a conductive substrate, and placing a conductive clip proximate a surface of the magnetic core. The method of forming the magnetic device also includes electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The method of providing the power conversion circuitry also includes providing at least one switch on the conductive substrate. The method of forming the power module also includes depositing an encapsulant about the power conversion circuitry.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: May 28, 2019
    Assignee: Enpirion, Inc.
    Inventors: Ashraf W. Lotfi, Mathew A. Wilkowski, Trifon M. Liakopoulos, John D. Weld
  • Patent number: 10304604
    Abstract: A deformable inductive device includes a magnetic core formed of an elastomer material having magnetic particles dispersed in it and at least one deformable electrode. Depending on the device's configuration, the deformable element may be embedded in, attached to, or in close proximity with the magnetic core. In some embodiments, the deformable inductive device may be configured as an inductor, solenoid, or transformer and the deformable electrode is at least partially embedded in the magnetic core, for instance. In another embodiment, the deformable inductive device may be configured as part of a wireless power transfer system which includes a coil and a magnetic backplane having the magnetic core with the coil being attached to or in close proximity to the magnetic backplane.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: May 28, 2019
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Nathan S. Lazarus, Christopher D. Meyer, Iain M. Kierzewski
  • Patent number: 10290414
    Abstract: A substrate includes a first dielectric layer, a magnetic core at least partially in the first dielectric layer, where the magnetic core comprises a first non-horizontal thin film magnetic (TFM) layer. The substrate also includes a first inductor that includes a plurality of first interconnects, where the first inductor is positioned in the substrate to at least partially surround the magnetic core. The magnetic core may further include a second non-horizontal thin film magnetic (TFM) layer. The magnetic core may further include a core layer. The magnetic core may further include a third thin film magnetic (TFM) layer, and a fourth thin film magnetic (TFM) layer that is substantially parallel to the third thin film magnetic (TFM) layer.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: May 14, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Daeik Daniel Kim, David Francis Berdy, Je-Hsiung Jeffrey Lan, Jonghae Kim, Niranjan Sunil Mudakatte, Robert Paul Mikulka
  • Patent number: 10283266
    Abstract: A powder core includes: a powder of a crystalline magnetic material; and a powder of an amorphous magnetic material, in which a median diameter D50A of the powder of the amorphous magnetic material is 15 ?m or less, and satisfies the expression: 1?D50A/D50C?3.5 with respect to a median diameter D50C of the powder of the crystalline magnetic material.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: May 7, 2019
    Assignee: Alps Alpine Co., Ltd.
    Inventors: Ryo Nakabayashi, Akinori Kojima, Seiichi Abiko, Keiichiro Sato, Akira Sato, Takao Mizushima
  • Patent number: 10276293
    Abstract: Traces, vias, or other conductive paths are formed on or through printed circuit boards or other insulating substrates to function as loops of an electromagnetic coil. The substrate itself insulates one side of each loop except at the inter-loop connection point, allowing the loops to be connected directly to each other. A ratio of trace width to depth may be selected to prevent or mitigate skin-effect losses at high operating frequencies. Nested sleeves on an insulated housing lengthen the surface distance between the coil and any nearby conductor such as an interior core or winding, presenting an effective obstacle to surface flashover between the coil and the nearby conductor. Optionally, field-shaping electrodes at the ends of the coil may discourage breakdown by reducing the electric field magnitude. Trace-based electromagnetic coils used as secondary windings in high-power transformers may be smaller than traditional wire-wound secondaries meeting similar voltage hold-off requirements.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: April 30, 2019
    Assignee: The Boeing Company
    Inventors: Kelton R. Clements, Timothy M. Fleeger
  • Patent number: 10276290
    Abstract: An electronic component includes a magnetic body containing internal coil parts, wherein the magnetic body includes a magnetic metal powder; a thermosetting resin; and a color coupler.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: April 30, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Hyun Park, Ki Hyun Park, Kyu Ho Lee
  • Patent number: 10269483
    Abstract: An electrical device for connection to a high-voltage system includes a magnetizable core, at least one winding which encloses a section of the core, a tank which is filled with insulating fluid and in which the core and each winding are disposed, and at least one pressing element, which is surrounded by insulating fluid, for generating a winding pressure. The pressing element is supported on the core and the winding. In order to adjust the winding pressure from the outside in a simple and cost-effective manner, the pressing element is provided as a drivable pressing element and is connected to an actuating unit. The actuating unit is configured to set the winding pressure which is generated by the pressing element.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: April 23, 2019
    Assignee: Siemens Aktiengesellschaft
    Inventor: Gernot Neumueller
  • Patent number: 10256039
    Abstract: A coil electronic component includes: a coil part; an insulating layer covering the coil part; a magnetic body enclosing the coil part covered by the insulating layer; and an adhesive layer disposed between the insulating layer and the magnetic body to prevent chipping of the magnetic body.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: April 9, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: You Na Kim, Moon Soo Park, Min Hee Kim, Jong Ho Lee