Patents Examined by Kazi S Hossain
  • Patent number: 11842847
    Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core in a foil structure, and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core in a foil structure, comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring.
    Type: Grant
    Filed: August 11, 2022
    Date of Patent: December 12, 2023
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Chaofeng Cai, Xiaoni Xin, Jianhong Zeng, Shouyu Hong, Rui Wu, Haoyi Ye, Yiqing Ye, Jinping Zhou, Zhiheng Fu, Min Zhou, Yu-Ching Kuo, Tong-Sheng Pan, Wen-Yu Lin
  • Patent number: 11837388
    Abstract: A coil component includes a body including magnetic metal powder particles and an insulating resin; a coil portion embedded in the body; and first and second external electrodes respectively disposed on the body to be spaced apart from each other and respectively connected to both end portions of the coil portion. A magnetic metal powder particle exposed from a surface of the body, among the magnetic metal powder particles, has a plating prevention film formed on at least a portion of a surface thereof and containing metal ions of the exposed magnetic metal powder particle.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: December 5, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Soo Kang, Ju Hwan Yang, Byeong Cheol Moon, Yoon Mi Cha, Mi Geum Kim
  • Patent number: 11830649
    Abstract: A double 8-shaped inductive device includes a first 8-shaped coil, a second 8-shaped coil, and a connection structure. The first 8-shaped coil includes a first connecting terminal. The second 8-shaped coil includes a second connecting terminal, which the first 8-shaped coil and the second 8-shaped coil are to be disposed side by side on two sides of a first imaginary line. The connection structure electrically couples to the first connecting terminal and the second connecting terminal, such that the first 8-shaped coil and the second 8-shaped coil form a connected circuit, and the first 8-shaped coil and the second 8-shaped coil include a loop respectively.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: November 28, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Ka-Un Chan
  • Patent number: 11830654
    Abstract: A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed to an external surface of the body, and a protrusion embedded in the body to be connected to the lead-out portion, and spaced apart from the external surface of the body and each of the coil portion.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Min Kim, Jae Hun Kim, Ji Hyuk Lim, Jong Yun Kim
  • Patent number: 11830651
    Abstract: Magnetic core for a balun, balun with a magnetic core and method for manufacturing a magnetic core. In particular, a magnetic core is provided comprising multiple core elements, wherein the individual core elements are concentrically arranged. Furthermore, a heat sink is arranged between two adjacent core elements. By using multiple core elements for a magnetic core, the individual core elements can be adapted to different frequency ranges. In this way, the magnetic core may be used for a balun having a broad frequency range. Furthermore, thermal energy generated in the magnetic core can be dissipated by the heat sinks between the individual core elements. In this way, the power handling capability of the magnetic core can be increased.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: November 28, 2023
    Assignee: Rohde & Schwarz GmbH & Co. KG
    Inventors: Florian Ohnimus, Karl-Martin Müssener
  • Patent number: 11830643
    Abstract: A coil electronic component includes a body including magnetic particles and an insulating resin, and a coil portion disposed within the body. The body has a multilayer structure including a core portion covering the coil portion and a cover portion covering the core portion. The magnetic particles included in the core portion have a distribution of a particle size having a D50 of 3.5 ?m or less.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Il Jin Park, Joong Won Park, Se Hyung Lee, Soon Kwang Kwon
  • Patent number: 11830648
    Abstract: Inductor device includes first and a second coils. First coil is wound into plural first circles. Second coil is wound into plural second circles. First connection member is coupled to first circle between outermost and innermost sides among first circles located at first area and first circle on outermost side among first circles located at second area. Second connection member is coupled to second circle on outermost side among second circles located at first area and second circle between outermost and innermost sides among second circles located at second area. At least two first circles of first circles are located at first area, and half of first circle of first circles is located at second area. Half of second circle of second circles is located at first area, and at least two second circles of second circles are located at second area.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: November 28, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Chieh-Pin Chang, Cheng-Wei Luo, Kai-Yi Huang, Ta-Hsun Yeh
  • Patent number: 11823834
    Abstract: A coil component according to one aspect of the present invention includes: a magnetic base body containing a plurality of metal magnetic particles and a binder binding the plurality of metal magnetic particles together; and a coil conductor provided in the magnetic base body and including a winding portion wound around a coil axis, wherein as viewed from a direction of the coil axis, the magnetic base body includes a core region enclosed by the winding portion, and a ratio of an area of the core region to a sum of an area of the winding portion and the area of the core region is 32% or larger.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: November 21, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Daiki Mimura, Tetsuyuki Suzuki
  • Patent number: 11817252
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: November 14, 2023
    Assignee: TDK CORPORATION
    Inventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
  • Patent number: 11817253
    Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: November 14, 2023
    Assignee: TDK TAIWAN CORP.
    Inventors: Feng-Lung Chien, Tsang-Feng Wu, Yuan Han, Tzu-Chieh Kao, Chien-Hung Lin, Kuang-Lun Lee, Hsiang-Hui Hsu, Shu-Yi Tsui, Kuo-Jui Lee, Kun-Ying Lee, Mao-Chun Chen, Tai-Hsien Yu, Wei-Yu Chen, Yi-Ju Li, Kuei-Yuan Chang, Wei-Chun Li, Ni-Ni Lai, Sheng-Hao Luo, Heng-Sheng Peng, Yueh-Hui Kuan, Hsiu-Chen Lin, Yan-Bing Zhou, Chris T. Burket
  • Patent number: 11810706
    Abstract: An inductor component includes a base, an inductor device disposed in the base, and an external terminal serving as a line that is disposed on the base and that is electrically coupled to the inductor device. The external terminal includes a first metal film that is in contact with the base and that is electrically conductive, a second metal film disposed on a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching, and a catalytic layer disposed between the first metal film and the second metal film. The first metal film includes a pore portion adjacent to the catalytic layer.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: November 7, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Namiko Sasajima, Hiroki Imaeda, Masami Okado, Shinji Otani, Tomohiro Sunaga, Yoshimasa Yoshioka
  • Patent number: 11804327
    Abstract: A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: October 31, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yoon Hee Lee, Bon Seok Koo, Yeon Tae Kim, Chang Hak Choi, Jung Min Kim
  • Patent number: 11804323
    Abstract: An electronic component includes a marker excellent in visibility and prevented from peeling off. That is, an electronic component is provided with an element body having a conductor inside; an insulating film and at least one marker disposed on a surface of the element body; and an external electrode disposed on the element body or the insulating film. The marker is exposed on a surface of the electronic component, and when the maximum height of the marker on the surface of the element body on which the marker is disposed is Mmax and the maximum height of the insulating film is Imax, Mmax and Imax satisfy the following expression: Mmax?Imax.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: October 31, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Minoru Gibu
  • Patent number: 11804324
    Abstract: A coil component includes a body including a coil having a top coil and a bottom coil connected to each other through a via and an external electrode disposed on an external surface of the body to be connected to the coil. A first insulating layer is disposed on a surface of the top coil, and a second insulating layer is disposed on a surface of the bottom coil. The first and second insulating layers are disposed to extend between the top coil and the bottom coil.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: October 31, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun Kim, Byeong Cheol Moon
  • Patent number: 11798725
    Abstract: A magnetic laminate having further suppressed magnetic saturation and higher DC superposition characteristics, a magnetic structure including the same, and an electronic component including the magnetic laminate or the magnetic structure. A magnetic laminate in which magnetic metal layers and non-magnetic metal layers are alternately laminated, wherein the non-magnetic metal layer is disposed between the magnetic metal layers; the magnetic metal layer contains an amorphous material; and the non-magnetic metal layer contains at least one element selected from the group consisting of Cr, Ru, Rh, Ir, Re, and Cu, and has an average thickness of 0.4 nm or more and 1.5 nm or less (i.e., from 0.4 nm to 1.5 nm).
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: October 24, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kojiro Komagaki, Kenji Sakaguchi
  • Patent number: 11791085
    Abstract: An inductor component comprising a first magnetic layer and a second magnetic layer containing a resin, a substrate of a sintered body having a first principal surface in close contact with the first magnetic layer and a second principal surface above which the second magnetic layer is disposed, and a spiral wiring disposed between the second magnetic layer and the substrate.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: October 17, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshimasa Yoshioka, Mizuho Katsuta, Kouji Yamauchi, Ryo Kudou, Naoya Noo
  • Patent number: 11791090
    Abstract: A coil component includes an element body and a coil conductor provided inside the element body, in which the element body has a substantially rectangular shape and has upper and lower surfaces facing each other in a winding axis direction of the coil conductor and first to fourth side surfaces. The element body includes a first magnetic body portion and a second magnetic body portion provided on a main surface of the first magnetic body portion. The coil conductor includes a winding portion and first and second extended portions extended to any side surface of the element body. The first magnetic body portion includes on the main surface thereof an outer convex portion and an inner convex portion provided outside and inside the winding portion, respectively. The outer convex portion is exposed only on one side surface or two adjacent side surfaces of the element body.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: October 17, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takao Kawachi, Hiroshi Okuizumi
  • Patent number: 11783986
    Abstract: A resonant coil with integrated capacitance includes at least one separation dielectric layer and a plurality of conductor layers stacked in an alternating manner. Each of the plurality of conductor layers includes a first conductor sublayer and second conductor sublayer having common orientation and a sublayer dielectric layer separating the first and second conductor sublayers, each conductor layer having multiple discontinuities.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: October 10, 2023
    Assignee: THE TRUSTEES OF DARTMOUTH COLLEGE
    Inventors: Phyo Aung Kyaw, Aaron Stein, Charles R. Sullivan
  • Patent number: 11783999
    Abstract: A multilayer coil array includes an element body including a magnetic layer; first and second built-in coils; and first to fourth outer electrodes connected to the first and second coils. A non-magnetic layer is provided between the first and second coils. The first and second coils are each formed by a plurality of coil conductors being connected to each other. At least one out of a coil conductor of the first coil that is closest to the second coil among the plurality of coil conductors of the first coil and a coil conductor of the second coil that is closest to the first coil among the plurality of coil conductors of the second coil contacts the non-magnetic layer. The length of a coil conductor layer that contacts the non-magnetic layer of the coil conductor contacting the non-magnetic layer is different from the length of the other coil conductor layers.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: October 10, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Mitsuhiro Sato, Ryohei Kawabata
  • Patent number: 11763984
    Abstract: A magnetic and electrical circuit element including magnetic-flux-conducting posts, and a multi-layer structure formed with an electrically-conductive material. The multi-layer structure includes multiple layers forming a stack of layers along a length of the posts, said multi-layer structure configured as primary and secondary windings of a transformer. The primary winding is embedded in the multi-layer structure and wound around the magnetic-flux-conducting posts in such a way that a magnetic field induced in each of the magnetic-flux-conducting posts has a magnetic field polarity opposite to a polarity of the respective magnetic field of the magnetic-flux-conducting post adjacent the respective magnetic-flux-conducting post. Around each of the magnetic-flux-conducting posts, there is a respective one of the secondary windings connected to a semiconductor device.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: September 19, 2023
    Assignee: Rompower Technology Holdings, LLC
    Inventor: Ionel Jitaru