Abstract: The present invention provides a method for manufacturing an electronic component of laminated ceramics such as a laminated ceramic capacitor in which, when a ceramic paste is applied on a ceramic green sheet in order to substantially eliminate steps caused by the thickness of a film of inner circuit elements such as an inner electrode, the ceramic paste is prevented from generating a gap between the paste and the film of inner circuit elements, or the thickness of the ceramic paste is prevented from being increased, by allowing the paste to overflow the film of inner circuit elements, even when the application position has been a little shifted, wherein an inclined face is formed at the periphery of an inner electrode that serves as the film of inner circuit elements, the ceramic paste being applied so as to overlap the periphery of the inner electrode, and wherein the used ceramic paste contains about 40% by weight to 85% by weight of solvents in order to facilitate smooth leveling of the applied ceramic pa

Abstract: An applicator for one of direct and indirect application of a coating medium onto a traveling fiber material web includes at least one dosing device and a coating edge delimiting device. The at least one dosing device includes a pair of lips with each lip having a free end adjacent the fiber material web and extending transverse to a direction of travel of the fiber material web. Further, the lips define a dosing slot therebetween. The dosing slot is an open-jet nozzle and has two side edges. The coating edge delimiting device includes at least two coating edge delimiting elements fitted between and in direct contact with each of the lips. The coating edge delimiting elements close off and substantially seal the dosing slot on the side edges, thereby substantially sealing the dosing slot. Each coating edge delimiting element has a wall section extending beyond the free ends of the lips in a flow direction of the coating medium through the dosing slot.

Abstract: An electrostatic coating system for dispensing multi-component waterborne coating materials from a coating material supply container having an insulated outer portion and a coating material supply line coupled to a dispenser, a metal tube disposed in the container in contact with coating material therein, a first non-conductive fitting coupling a first end portion of the tube to a first opening of the container, a second non-conductive fitting coupling a second end portion of the tube to a second opening of the container, and a cooling fluid supply device coupled to the tube.

Abstract: A cooling processing unit for cooling a wafer to a predetermined temperature is disposed between a heat processing unit and a set of a resist coating processing unit and a developing processing unit. Pre-cooling units are stacked in multi-stages on top of the cooling processing unit. Immediately after having undergone heat processing in the heat processing unit, the wafer is first transferred to the pre-cooling unit by a first transfer machine. Thereafter, the wafer is transferred to the cooling processing unit by a third transfer machine to be cooled to the predetermined temperature, and then transferred to the resist coating processing unit by a second transfer machine. Thus, over-bake of the wafer can be prevented.

Abstract: A coating apparatus is configured to coat a moving strip of material with liquid coating material. The apparatus includes a liquid coating material supply unit and a coater for dispensing liquid coating material onto the moving strip of material. A recycler is provided for returning liquid coating material dispensed from the coater to a position in the coating apparatus upstream of the coater.

Abstract: Methods of fixturing a flexible circuit substrate to a processing carrier are disclosed. In one implementation, the flexible circuit substrate and, processing carrier are attached with an adhesive film provided therebetween. The adhesive film comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface of the flexible circuit substrate is attached to the processing carrier. The flexible circuit substrate is removed from the adhesive film following processing thereof. In a preferred embodiment of the present invention, the adhesive film is monolithic. An electrical component is attached to the flexible circuit substrate and the flexible circuit substrate is encapsulated in accordance with one implementation of the present invention.

Abstract: A process for laminating an ink jet print by providing a support having an ink jet image, contacting the imaged surface with a transfer element to form a composite, the transfer element comprising a flexible, polymeric support having a porous, fusible, transferable protection layer comprising fusible, thermoplastic polymeric particles in a polymeric binder, the protection layer having a thickness between 2 and 100 &mgr;m and a particle-to-binder ratio between 95:5 and 70:30, the thermoplastic polymeric particles having a particle size less than 10 &mgr;m and a Tm or softening point greater than 50° C., and the polymeric binder having a Tg less than 20° C., applying heat and pressure to the composite to fuse the protection layer to form a substantially continuous protection layer, allowing the composite to cool, and peeling the polymeric support of the transfer element from the composite to form the laminated ink the print.

Abstract: A coating process comprises the steps of (a) holding a-substrate using a spin chuck surrounded by inner and outer cups, such that the substrate can rotate, (b) rotating the substrate by rotating the spin chuck, and applying a coating liquid onto the substrate, thereby forming a coating on the substrate, (c) discharging, from the inner and outer cups, that part of the coating liquid which is scattered from the substrate while the substrate is rotated, (d) exhausting the inner and outer cups through a plurality of exhaust ports formed in outer peripheral portions of the outer cup, and (e) reducing, from a peripheral region of the substrate, the mist of the coating liquid which has occurred during the step (b), before the substrate stops rotation.

Abstract: The system comprises a multistage spin unit having a plurality of compartments stacked vertically in a multistage, a main arm mechanism comprising a wafer holder and driving means for causing the wafer holder to advance and retreat longitudinally, moving the wafer holder up and down along a vertical shaft and turning the wafer holder around the vertical shaft, a spin chuck provided on each of the compartments for holding and spin-rotating the wafer delivered by the main arm mechanism, a cup for surrounding the spin chuck to receive and discharge a treatment solution separated from the substrate by centrifugal force, a shared nozzle for supplying the treatment solution toward the substrate held by the spin chuck in the compartment, a nozzle moving passageway provided along the multistage spin unit for communicating with each compartment to move the shared nozzle therethrough, and a nozzle moving mechanism for moving the shared nozzle.

Abstract: A process solution supplying apparatus for supplying a process solution onto a substrate to be processed, comprising a process solution supply source, a process solution supply tube having its upstream end connected to the process solution supply source and serving to discharge the process solution from the downstream end thereof onto the substrate, a fluid passageway opening-closing valve device mounted on a downstream side of the process solution supply tube for opening-closing the process solution supply tube, and a temperature adjusting solution tube, through which flows a temperature adjusting solution, arranged continuously through the fluid passageway opening-closing valve device in a downstream portion of the process solution supply tube including the fluid passageway opening-closing valve device for adjusting the temperature of the process solution within the process solution supply tube.

Abstract: A method for laminating a circuit pattern tape over a wafer, involving the steps of preparing a circuit pattern tape formed with an adhesive layer, along with a wafer, detecting at least one reference position of the prepared circuit pattern tape and at least one reference position of the prepared wafer using visual detecting means, outputting results obtained at the detecting step in the form of visual images capable of allowing a comparison of the detection results, carrying out a reference position correction involving movements of the wafer in an X-axis and/or a Y-axis direction and/or by a desired angle, thereby allowing the reference position of the circuit pattern tape and the reference position of the wafer to correspond to each other, and laminating the circuit pattern tape over the wafer when the reference positions correspond to each other.

Abstract: A sublimation heat transfer system and related method for transferring a pattern of sublimating ink from a transfer sheet to a coating on an article includes a carousel for moving the article and transfer sheet in an endless path through loading/unloading portions and through a transfer portion. A plurality of plungers and fixtures are attached to the carousel for receiving multiple articles and transfer sheets in a continuous fashion. An actuator acts to extend the plungers along the loading portion for forcing the transfer sheets firmly against the coatings of the articles throughout the transfer portion and to retract the plungers along the unloading portion for removal and separation of the printed articles and the spent transfer sheets. A driver imparts motion to the carousel. A heater in the form of an oven enclosing the carousel activates the coating on the article and the ink.

Abstract: A high magnitude potential supply comprises a first circuit for generating a first signal related to a desired output high magnitude potential across a pair of output terminals of the supply, a second circuit for generating a second signal related to an output current from the high magnitude potential supply, and a third circuit for supplying an operating potential to the high magnitude potential supply so that it can produce the high magnitude operating potential. The third circuit has a control terminal. A fourth circuit is coupled to the first and second circuits and to the control terminal. The fourth circuit receives the first and second signals from the first and second circuits and controls the operating potential supplied to the high magnitude potential supply by the third circuit. A fifth circuit is provided for disabling the supply of operating potential to the high magnitude potential supply in certain conditions so that no high magnitude operating potential can be supplied by it.

Abstract: The invention is related to the formation of three different and repeated stripes abbreviate as ABCABC-typed or A_B_C-typed at the die exit. The symbol, “_”, implies that there is no coating between two adjacent stripes. In this invention a guide shim and a guide die are inserted between two coating dies. Three different coating solutions will flow into the die assembly through different inlet positions. Two of which are introduced from the two coating dies will flow through the multiple channels provided in the guide shim and the guide die respectively and then contact with each other and with the third solution introduced from a side of the guide die in the same slot section to form the ABCABC-typed stripes. The coating solutions can also flow through the multiple channels to the same slot section but not contact each other to form the A_B_C-typed stripes at the die exit with a modification of the die assembly.

Abstract: A film forming apparatus comprising a substrate holding section for holding a substrate to be processed, a nozzle unit arranged and opposing the substrate holding section, having a discharge hole for continuously applying film-forming solution, in the form of a slender stream, to a surface of a substrate held by the substrate holding section, and a drive mechanism for driving the substrate and the nozzle unit relative to each other, thereby to coat the surface of the substrate with the solution, while the nozzle unit is applying the solution, in the form of a slender stream, to the surface of the substrate.

Abstract: A coating apparatus includes a supply unit containing liquid coating material and a reservoir receiving liquid coating material dispensed from the supply unit. A coater dispenses liquid coating material onto a moving strip of material. A liquid meter unit includes a flow passage and a flow regulator associated with the flow passage. A flow rate manager cooperates with the reservoir to determine the flow rate of liquid coating material passing through the flow passage in the liquid meter unit and operates the flow regulator to regulate the flow rate of liquid coating material discharged to the coater.

Abstract: A photo process system for semiconductor wafers prevents air from flowing across the top of a baking region to produce a stable downward laminar air flow in front of baking units disposed at several levels in the baking region. The baking region is located on one side of a housing, and a coating unit for coating a wafer with a photoresist is located on the other side of the housing. The housing has a clean air entrance and air filters at an upper portion thereof, and a clean air discharge opening at the very bottom thereof. An air flow containment dam prevents clean air entering the housing from flowing horizontally at the top of the baking region. Such a horizontal flow of air would otherwise produce turbulence severely affecting the ability of the air to flow downward across the front of the baking units and toward the discharge opening as a laminar air flow. The laminar air flow hardly passes into the baking units and thus, hardly induces temperature variations in the coated wafers that are being baked.

Abstract: A food coating apparatus has a container, cover, and dividing sieve. The container has a bottom, lower side wall extending from the bottom, a screen land extending from the lower side wall, and an upper side wall extending from the screen land. The upper side wall further includes a seal edge. The cover has a body and a seal disposed around the body. The seal of the cover is adapted for engaging the seal edge of the lower container. The dividing sieve has a screen section, sealing land disposed outwardly from the screen section, and a plurality of legs with feet extending therefrom. The dividing sieve is adapted for residing between the cover and the screen land when the seal of the cover engages the seal edge of the container.

Abstract: A device for coating food articles with a fat-containing substance has a circulating endless mesh belt having an upper belt portion for transporting the foodstuff articles in a transport direction and a lower return belt portion. A shaking device is positioned underneath the upper belt portion downstream in the transport direction of an area where the foodstuff articles are coated. The shaking device has transverse stays positioned transversely to the transport direction. The transverse stays can be reciprocated vertically with a shaking amplitude against the upper belt portion. The transverse stays are supported individually and can be reciprocated individually in a reciprocating direction.

Abstract: A method for making an aerogel film includes the steps of performing a gelation reaction of a metal alkoxide on a substrate to prepare a substrate with a wet-gel film, and converting the wet-gel film into an aerogel film by a supercritical or sub-critical drying process of the substrate with the wet-gel film, wherein the degree of gelation of the wet-gel film is controlled to be a predetermined value at the start of the supercritical or sub-critical drying process. Aerogel films having uniform qualities are produced by the supercritical or sub-critical drying process in one lot.