Patents Examined by Kevin P. Shortsle
  • Patent number: 6355103
    Abstract: A coating mask device for a lighting device in which a mask body is divided into a plurality of sections so that the mask body can be easily handled. The coating mask device for a lighting device includes a support jig 10, on which a component part 14 of the lighting device can be placed, and a mask body 20 having an opening 22 corresponding to a coat-forming region 15 of the lighting device component part 14. The mask body 20 is divided into a partial mask 21, having the opening 22, and a main mask 23 for covering that region of the component part other than that region covered by the partial mask 21. The partial mask 21 is removable from the main mask 23. The whole of the mask body 20 does not need to be exchanged, and it is only necessary to exchange the partial mask 21 which is compact and lightweight.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: March 12, 2002
    Assignee: Koito Manufacturing Co., Ltd.
    Inventors: Keiichi Inaba, Kiyoshi Yazaki
  • Patent number: 6355105
    Abstract: The invention disclosed herein is related to a photoresist coating system that significantly prevents performance of the system being degraded by any bubble in, liquid photoresist. The proposed system comprises a pump, a series of pipelines, a reactor, a tank, a capacitor sensor, a photochopper sensor and a controller, where the capacitor sensor is coupled to the pipeline and the photochopper sensor is coupled to the pipeline. Thus, any bubble inside the pipeline is detected by the capacitor sensor or the photochopper sensor. In other words, any bubble in the photoresist is detected. The operation of the present photoresist coating system is terminated by the controller to protect any wafer inside the reactor, and a warning alarm is activated by the controller.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: March 12, 2002
    Assignee: United Microelectronics Corp.
    Inventor: Roger Tuan
  • Patent number: 6348097
    Abstract: A glue wheel for use with a glue shoe in applying a pattern of cold glue to a receiving surface such as a glue flap. The glue wheel has a rim with recessed, glue-holding, structures flanked by smooth side sections for sealing engagement with the glue shoe. There are a pair of circumferential grooves through the glue-holding structures adjacent the smooth side sections and the cold glue is metered by the glue shoe over the glue-holding structures.
    Type: Grant
    Filed: July 22, 1999
    Date of Patent: February 19, 2002
    Inventor: Jimmy R. Garrett
  • Patent number: 6344088
    Abstract: A stripe coating applicator for coating at least two stripes having a plurality of slit outlets provided at a nozzle edge and a pair of block edges forming said slit outlets. Stripe partitions partition and define the plurality of slit outlets formed at the pair of block edges. Notches are formed on at least one of said block edges toward a direction of the coating fluid to be discharged and correspond to the positions of the stripe partitions. Movable parts are formed at the at least one of said block edges where the notches are provided. The notches and thin parts form the movable parts. A slit gap adjustment means is provided for adjusting slit gaps by moving the movable parts.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: February 5, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuyuki Kamikihara, Masaru Watanabe
  • Patent number: 6322659
    Abstract: A method for bonding includes positioning a bonding strip adjacent a sole first bond head, the bonding strip having a plurality of strip units, and bonding, with only the first bond head, a first number of the plurality of strip units. The method further includes transporting the bonding strip from the first bond head and positioning the bonding strip adjacent a sole second bond head, and bonding, with only the second bond head, a remaining number of the plurality of strip units on the bonding strip. In one embodiment, the method also includes heating at least one of the plurality of strip units prior to bonding the bonding strip. In one embodiment, the method also includes clamping, with a sole clamp, the bonding strip, thereby limiting warpage of the bonding strip.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: November 27, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Randy V. Tekavec, Larry Giaudrone, Peter Sakakini