Patents Examined by Khanh T. Nguyen
  • Patent number: 11124415
    Abstract: A method of preparing porous nitrogen-doped carbon nanosheets by pyrolysis of Albizia procera leaves. The nitrogen-doped carbon nanosheets display enhanced electrochemical properties including large surface area and specific capacitance. Electrodes coated with the nitrogen-doped carbon nanosheets are particularly suitable for use in supercapacitors and solar cells.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: September 21, 2021
    Assignee: King Fahd University of Petroleum and Minerals
    Inventors: Md. Abdul Aziz, Amar Kamal Mohamedkhair, Zain Hassan Yamani
  • Patent number: 11110519
    Abstract: A metal three-dimensional printer, a printing method, and a three-dimensional printing material. The three-dimensional printer includes a printing head, a heating apparatus, a printing platform, and a sintering shaping chamber. The printing method includes a preliminary shaping step and a sintering step. The heating apparatus heats the three-dimensional printing material. A heating temperature of the heating apparatus is 50° C. to 300° C., and a binder bonds metal powder at 50° C. to 300° C., and the three-dimensional printing material is extruded onto the printing platform to form a preliminary cured object. In the sintering step, the preliminary cured object is sintered and cured into a shaped object.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: September 7, 2021
    Assignee: PRINT-RITE ⋅ UNICORN IMAGE PRODUCTS CO., LTD. OF ZHUHAI
    Inventors: Leungmui Ho, Kinkeung So, Yonggang He
  • Patent number: 11104065
    Abstract: The present disclosure is drawn to material sets and 3-dimensional printing systems that include a fusing agent. One example of a material set can include a fusing agent and a detailing agent. The fusing agent can include water, a carbon black pigment, and a water-soluble co-solvent in an amount from 20 wt % to 60 wt %. The detailing agent can include water and a black dye. In another example, a material set can include a fusing agent and a thermoplastic polymer powder.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: August 31, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Keshava A Prasad, Alexey S Kabalnov, Stephen G. Rudisill, Ali Emamjomeh, Michael Novick, Bernardo Gutierrez
  • Patent number: 11104051
    Abstract: Provided is a molding machine including a mold opening/closing mechanism configured to move a movable platen to be attached with a movable mold to a stationary platen to be attached with a stationary mold, and a clamping mechanism to perform a clamping process, and is intended to suppress machine cost or ensure the mold opening/closing speed. The molding machine includes the mold opening/closing mechanism configured to move the movable platen to be attached with the movable mold to the stationary platen to be attached with the stationary mold, and the clamping mechanism configured to perform a clamping process. The mold opening/closing mechanism includes at least two ball screws, at least two electric motors that respectively drive the ball screws, and a ball screw nut into which each of the ball screws is inserted.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: August 31, 2021
    Assignee: THE JAPAN STEEL WORKS, LTD.
    Inventors: Shizuo Jinno, Hisanaga Tajima, Shinji Hayashi, Hiroki Hasegawa
  • Patent number: 11100223
    Abstract: The present invention relates to core shell liquid metal encapsulates comprising multi-functional ligands, networks comprising such encapsulates and processes of making and using such encapsulates and networks. When subjected to strain, such network's conductivity is enhanced, thus allowing the network to serve as a healing agent that restores at least a portion of the conductivity in an adjacent conductor.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: August 24, 2021
    Assignee: United States of America as represented by the Secretary of the Air Force
    Inventors: Carl J. Thrasher, Christopher E. Tabor, Zachary J. Farrell, Nicholas J. Morris
  • Patent number: 11101052
    Abstract: There is provided a conductive material in which, even when a conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, even if an electrode width and an inter-electrode width are narrow, occurrence of migration can be effectively suppressed, and generation of voids can be effectively suppressed. The conductive material according to the present invention contains a plurality of conductive particles in which an outer surface portion of a conductive portion comprises solder, a thermosetting compound, an acid anhydride thermosetting agent, and an organophosphorus compound.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: August 24, 2021
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Sayaka Wakioka, Hidefumi Yasui, Shuujirou Sadanaga, Masahiro Itou, Shike Sou, Yuta Yamanaka
  • Patent number: 11101255
    Abstract: A 3D printable feedstock ink is disclosed for use in a 3D printing process where the ink is flowed through a printing nozzle. The ink may be made up of a non-conductive flowable material and a plurality of chiplets contained in the non-conductive flowable material in random orientations. The chiplets may form a plurality of percolating chiplet networks within the non-conductive flowable material as ones of the chiplets contact one another. Each one of the chiplets has a predetermined circuit characteristic which is responsive to a predetermined electrical signal, and which becomes electrically conductive when the predetermined electrical signal is applied to the ink, to thus form at least one conductive signal path through the ink.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: August 24, 2021
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Maxwell Murialdo, Yuliya Kanarska, Andrew Pascall
  • Patent number: 11097453
    Abstract: A process and assembly for producing a structural article, as well as an article produced according to any process and assembly. A mold has a base and a hinged lid, either or both of which include a cavity interior which defines a negative of the structural article to be produced. A structural insert placed within the mold, prior or subsequent to a plasticized and structural forming foam material also being placed within the mold. The foam cures and sets in encapsulating fashion around the insert so that, upon removal, the insert is coated within the formed material.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: August 24, 2021
    Assignee: Neuvotec, LLC
    Inventor: Miguel A. Linares
  • Patent number: 11102883
    Abstract: The present invention relates to substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands and processes of making and using such substrates. The core shell liquid metal particles are linked via ligands to form such network. Such networks volumetric conductivity increases under strain which maintains a substrate's resistance under strain. The constant resistance results in consistent thermal heating via resistive heating. Thus allowing a substrate that comprises such network to serve as an effective heat provider.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: August 24, 2021
    Assignee: United States of America as represented by the Secretary of the Air Force
    Inventors: Carl J. Thrasher, Christopher E. Tabor, Zachary J. Farrell, Nicholas J. Morris
  • Patent number: 11098227
    Abstract: The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: August 24, 2021
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihiko Aoyagi, Osamu Isobe, Kenji Kamino
  • Patent number: 11094890
    Abstract: The present specification relates to an organic transistor including: a source electrode; a drain electrode; a gate electrode; an insulating layer; and an organic semiconductor layer having one or more layers, in which one or more layers of the organic semiconductor layer include a compound represented by Formula 1.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: August 17, 2021
    Inventors: Bogyu Lim, Yong-Young Noh, Jiyoung Lee, Seung-Hoon Lee
  • Patent number: 11084194
    Abstract: A purge cover for injection molding machine has a cover body having a nozzle through-hole allowing a nozzle of a cylinder to pierce through, an exhaust passage extending higher than the cylinder in an upward direction, and a discharge port communicating with the exhaust passage, and a plurality of exhaust plates disposed at the discharge port of the cover body. The plurality of exhaust plates have exhaust holes for air moving in the upward direction from the cover body, and the exhaust holes are arranged so as not to planarly overlap when the plurality of exhaust plates are disposed at the discharge port of the cover body.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: August 10, 2021
    Assignee: FANUC CORPORATION
    Inventor: Mitsuhiro Ono
  • Patent number: 11078120
    Abstract: An oxide sintered body is characterized in that it comprises an oxide including an In element, a Zn element, a Sn element and a Y element and that a sintered body density is equal to or more than 100.00% of a theoretical density.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: August 3, 2021
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Kazuyoshi Inoue, Futoshi Utsuno, Shigekazu Tomai, Masatoshi Shibata, Mami Itose
  • Patent number: 11077589
    Abstract: A manufacturing method of a molded article, including a first step of arranging a primary molded article made of a soft material in a molding die such that an outer peripheral surface of an exposed section of the primary molded article which is exposed to an outside without being embedded in a secondary molded article corresponds to an inner peripheral surface of the molding die, a second step of pressing and deforming an outer peripheral portion of the primary molded article arranged in the molding die by a pressing section so as to bring the outer peripheral surface of the exposed section into close contact with the inner peripheral surface of the molding die, and a third step of molding the secondary molded article by withdrawing the pressing section from inside the molding die while injecting resin to be the secondary molded article into the molding die.
    Type: Grant
    Filed: March 9, 2019
    Date of Patent: August 3, 2021
    Assignee: CASIO COMPUTER CO., LTD.
    Inventors: Kazuyuki Tanabe, Masato Ueno
  • Patent number: 11075344
    Abstract: Disclosed are an organic device including a first electrode and a second electrode facing each other and an active layer between the first electrode and the second electrode, wherein the active layer includes compound represented by Chemical Formula 1, and an image sensor including the same. In Chemical Formula 1, L1, L2, R1, R2, Ar1, Ar2, X1, X2, m1, m2, n1, and n2 are the same as described in the detailed description.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: July 27, 2021
    Assignees: Samsung Electronics Co., Ltd., Seoul National University R&DB Foundation
    Inventors: Yeong Suk Choi, Soo Young Park, Sung Young Yun, Min-Woo Choi, Ji Eon Kwon, Hyeong-Ju Kim
  • Patent number: 11072715
    Abstract: This disclosure relates to a conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprising: (1) 65 to 95.4% by weight of fine silver particles which have average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, (3) 0.1 to 1.0% by weight of ethyl cellulose having weight average molecular weight of 10,000 to 120,000. Also provided are: a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying said fine silver particle dispersion on a substrate, and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.; and an electrical device comprising a conductive thick film made with the foregoing paste.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: July 27, 2021
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Dave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang, Takashi Hinotsu, Shingo Teragawa
  • Patent number: 11075021
    Abstract: Disclosed are conductive composites comprising a polymer, a conductor selected from metals and metal alloys, and a thickening agent.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: July 27, 2021
    Assignee: The Boeing Company
    Inventors: Ashley M. Dustin, Andrew P. Nowak, Xin N. Guan, Adam F. Gross, Richard E. Sharp
  • Patent number: 11072114
    Abstract: Additive manufacturing can involve dispensing a powdered material to form a layer of a powder bed on a support surface of a build platform. A portion of the layer of the powder bed may be selectively melted or fused to form one or more temporary walls out of the fused portion of the layer of the powder bed to contain another portion of the layer of the powder bed on the build platform.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: July 27, 2021
    Assignee: SEURAT TECHNOLOGIES, INC.
    Inventors: James A. DeMuth, Erik Toomre, Francis L. Leard, Kourosh Kamshad, Heiner Fees, Eugene Berdichevsky
  • Patent number: 11065795
    Abstract: The present disclosure provides a molding system for preparing an injection-molded plastic article. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin including a plurality of polymer chains; a processing module configured to generate an anisotropic viscosity distribution of the molding resin in the mold cavity based on a molding condition for the molding machine; wherein the anisotropic viscosity distribution of the molding resin is generated based in part on consideration of an integral effect of a volume fraction and an aspect ratio of the plurality of fibers; and a controller coupled to the processing module and configured to control the molding machine with the molding condition using the generated anisotropic viscosity distribution of the molding resin to perform an actual molding process for preparing the injection-molded plastic article.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: July 20, 2021
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 11056692
    Abstract: The present invention relates to a battery electrode. The battery electrode comprises a plurality of carbon nanotubes and a plurality of transition metal oxide nanoparticles. The plurality of transition metal oxide nanoparticles are chemically bonded to the plurality of carbon nanotubes through carbon-oxygen-metal (C—O-M) linkages, wherein the metal being a transition metal element. The present invention also relates a method for making the battery electrode and a hybrid energy storage device using the battery electrode.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: July 6, 2021
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Da-Tao Wang, Li Sun, Ke Wang, Jia-Ping Wang, Shou-Shan Fan