Patents Examined by Khanh T. Nguyen
  • Patent number: 11430941
    Abstract: A piezoelectric polyvinylidene fluoride (PVDF) material, a method for manufacturing the same, and a fingerprint recognition module are provided. The polyvinylidene PVDF material includes PVDF, a first solvent, a second solvent, a fluorosurfactant, and an inducing material. Material of the inducing material is one of carbon nanotubes, carbon black, and gold nanorods. Because of the high anisotropy of the inducing material, molecular orientation of the PVDF material is induced, thereby improving piezoelectric performance of the piezoelectric PVDF material. Problems of conventional piezoelectric PVDF materials, which are used in ultrasonic fingerprint recognition modules, such as poor piezoelectric performance and high-energy loss are improved.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: August 30, 2022
    Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd.
    Inventor: Yongxiang Zhou
  • Patent number: 11420407
    Abstract: The invention relates to a die for arrangement in a press, wherein the die extends along an axial direction between two end faces and forms an inner peripheral surface between the end faces, wherein the die extends from the inner peripheral surface along a radial direction toward an outer peripheral surface and toward at least one centering surface that is disposed in the radial direction on a first diameter, wherein the die has a pressing zone that is spaced apart from the end faces and, in the vicinity of the pressing zone, the die has a greater maximum first stiffness, at least relative to zones of the die that are arranged on the end faces, compared to a pressing force acting on the inner peripheral surface in a direction of a normal vector, and wherein the maximum first stiffness is at least 10% greater than a minimum second stiffness that is present in at least one zone that is arranged on one of the end faces.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: August 23, 2022
    Assignee: GKN Sinter Metals Engineering GmbH
    Inventors: Rainer Schmitt, Tobias Müller, Thomas Schupp
  • Patent number: 11421116
    Abstract: An electroconductive paste according to the present invention contains a binder (A), a silver powder (B), crosslinked resin particles (C) having a glass transition temperature of 35° C. or lower, and an organic solvent (D).
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: August 23, 2022
    Assignees: Fujikura Kasei Co., Ltd., Fujikura Ltd.
    Inventors: Katsutomo Wakabayashi, Yuka Azakami, Yuji Abe, Akinori Naruse, Kazutoshi Koshimizu
  • Patent number: 11414573
    Abstract: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: August 16, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Tetsuyuki Shirakawa, Satoru Matsumoto, Yusuke Asakawa, Tatsuya Kumada, Takahiro Fukui
  • Patent number: 11406956
    Abstract: The present invention relates to articles comprising core shell liquid metal encapsulate networks and methods of using core shell liquid metal encapsulate networks to control AC signals and power. Such method permits the skilled artisan to control the radiation, transmission, reflection and modulation of an AC signal and power. As a result, AC system properties such as operation frequency, polarization, gain, directionality, insertion loss, return loss, and impedance can be controlled under strain.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: August 9, 2022
    Assignee: United States of America as represented by the Secretary of the Air Force
    Inventors: Christopher E. Tabor, Carl J. Thrasher, Alexander M. Watson, Nicholas J. Morris, Zachary J. Farrell
  • Patent number: 11399547
    Abstract: A stamping device serves to create one or more rows of endless dough rings. The stamping device has a stamping head with a stamping punch or a plurality of stamping punches, wherein each stamping punch is associated with a dough ring row. A dough piece support of the stamping device has a dough piece holder or a plurality of dough piece holders. Each dough piece holder of the dough piece support is associated with one of the stamping punches. An opening for the associated stamping punch is configured in a dough piece holder or in each of the dough piece holders as a die. A stamping device results in which the stamping of dough rings in particular to produce doughnuts can also be used, for example, for baking by hand.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: August 2, 2022
    Assignee: Werner & Pfleiderer Lebensmitteltechnik GmbH
    Inventors: Alexander Meier, Rudolf Fiedler
  • Patent number: 11404651
    Abstract: Disclosed in the present invention are a novel organometallic complex and an application thereof in organic electronic devices, particularly in organic phosphorescent light emitting diodes. The present invention further relates to organic electronic devices, in particular organic light emitting diodes (OLEDs), that comprise the organometallic complex according to the present invention, and an application thereof in display and illumination technologies. By means of optimizing the structure of a device and changing the concentration of the metal complex in a matrix thereof, optimal device performance may be achieved, facilitating the implementation of a high-efficiency, high-brightness and high-stability OLED devices, and providing a better material option for full-color display and illumination applications.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: August 2, 2022
    Assignee: Guangzhou Chinaray Optoelectronic Materials Ltd.
    Inventors: Chi Ming Leung, Hong Huang, Junyou Pan
  • Patent number: 11401446
    Abstract: An object of the present invention is to provide an electroconductive adhesive composition which has excellent thermal conductivity and which, even when repeatedly undergoing fluctuations in temperature, is less apt to cause adherend separation. The present invention relates to an electroconductive adhesive composition which contains: an electroconductive filler (A) containing metal particles (a1) having an average particle diameter of 0.5-10 ?m and silver particles (a2) having an average particle diameter of 10-200 nm; and particles (B) of a thermoplastic resin which is solid at 25° C.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: August 2, 2022
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Koyo Kobori, Yoshito Imai, Shintaroh Abe, Takeshi Kondo
  • Patent number: 11400623
    Abstract: A compression-molding system in which upon a start of a molding machine being stopped, a powdery-material feeding device preliminarily supplies a filling device with a predetermined amount of a powdery material while stopping a relative displacement of the filling device and a compression by an upper punch and a lower punch, and the molding machine is subsequently started to cause the relative displacement of the filling device and the compression by the upper punch and the lower punch.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: August 2, 2022
    Assignee: KIKUSUI SEISAKUSHO LTD.
    Inventors: Naoshige Kitamura, Shinsuke Fushimi, Kazutaka Okumoto, Hideyuki Nishimura
  • Patent number: 11401431
    Abstract: A thermal inkjet ink includes a water-based vehicle; a colorant; and a modified siloxane surfactant including a plurality of components. Each component has a chemical formula I: Si(1+x+z)O(1+x+z+y)C(1+1+2(x+z)+j+m+y(2+n))H(6+6+6(x+z)+o+p+y(4+q)). For each component: y ranges from 2 to 4; x and z each range from 0 to 14; x+z=from 0 to 14; j, m, and n are the number of carbon atoms, respectively, in R1, R2, and R3; o, p, and q are the number of hydrogen atoms, respectively, in R1, R2, and R3. R1 is selected from H, an alkyl, and an aryl. Each of R2 and R3 is selected from H, an alkyl, an alkyl substituted with an allylic or an epoxy group, an aryl, and an aryl substituted with an allylic or an epoxy group. For some components: x+z=from 7 to 14.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: August 2, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kai-Kong Iu, Howard Doumaux, Stone S. Ouyang
  • Patent number: 11396045
    Abstract: A build plate may include one or more thermocouples placed on an underside of the build plate. The one or more thermocouples output temperature fluctuation to assist in monitoring for build plate separation of a product located on top of the build plate.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: July 26, 2022
    Assignee: THE AEROSPACE CORPORATION
    Inventors: Shant Kenderian, Tait DeWitt McLouth, Joseph T. Case, Dhruv N. Patel
  • Patent number: 11389995
    Abstract: An injection molding method for a semifinished product includes a semifinished product emplacement step, a semifinished product pre-compression step and a forming step. First, a pair of mold with a forming space is provided. A semifinished product is put into the mold, and a first joint is performed to the mold by a press-fit jig, fixing the semifinished product in the forming space. The semifinished product is also tightly fitted with the mold. Next, a first open-die is performed and the press-fit jig is removed. After that, a second joint is performed, and a forming material is injected into the forming space. Finally, a second open-die is performed, and then a finished product is formed. By the semifinished product pre-compression step, the forming material can be prevented from resulting in spill or burr on the semifinished product, thereby improving the yield of injection molding.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: July 19, 2022
    Assignee: DRAGONSTATE TECHNOLOGY CO., LTD.
    Inventors: Kuo-Chi Lee, Chin-Hsing Lee, Lei Cheng
  • Patent number: 11390769
    Abstract: An ink jet printing method includes applying a primer ink composition containing cationic resin particles and water and an ink jet ink composition containing a dispersible anionic pigment, anionic resin particles, and water onto a printing medium such that a value Z defined by the following equation is in the range of 1.0 to 1.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: July 19, 2022
    Inventor: Masahiro Yatake
  • Patent number: 11390761
    Abstract: A polymer nanocomposite coating of an elastomeric film containing at least 30 wt % conductive nanoparticles based on combined weight of elastomer and conductive nanoparticles is provided. The conductive nanoparticles have an average particle size along each dimension of less than 500 nm for nanoparticles having an aspect ratio of less than 20:1 or have an average particle size along each dimension of less than 2000 nm for nanoparticles having an aspect ratio of 20:1 or greater. The conductive nanoparticles are formed into hierarchical micro- and nano-sized aggregates having re-entrant morphology. The coating is both superoleophobic and conductive and retains these properties even when stretched under strain to over 100%. The coatings may be produced with simple spray technology.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: July 19, 2022
    Assignee: University of Western Ohio
    Inventors: Lorenzo Ferrari, Dana K. Adkinson, Jun Yang, Binyu Yu, Maxim Paliy, Brad Kobe
  • Patent number: 11390768
    Abstract: A robust formulation of silver-organo-complex (SOC) ink and method of making same are provided. In an aspect, the complexing molecules act as reducing agents. The silver loaded ink can be printed and sintered on a wide range of substrates with uniform surface morphology and excellent adhesion.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: July 19, 2022
    Assignee: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Mohammad Vaseem, Garret McKerricher, Atif Shamim
  • Patent number: 11374175
    Abstract: The present disclosure relates to a polymer including a unit represented by Chemical Formula 1, a coating composition including the polymer, and an organic light emitting device formed using the same.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: June 28, 2022
    Inventors: Minseob Seo, Esder Kang, Jaesoon Bae, Hwakyung Kim, Keunsoo Lee, Sejin Jung, Jaechol Lee
  • Patent number: 11359773
    Abstract: Embodiments of the present disclosure provide a light emitting element and a processing apparatus therefor and relate to the technical field of light emitting devices. The light emitting element includes a light-emitting lamp bead(s), a connecting wire, and a covering member(s). The light-emitting lamp bead is welded to the connecting wire to form a welding joint. The covering member covers the light-emitting lamp bead and the welding joint. The covering member is integrally formed by injection molding. The present disclosure solves the technical problem existing in the prior art that the service life is adversely affected and the appearance is deteriorated because the welding joints are oxidized after a period of time.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: June 14, 2022
    Assignee: GANZHOU HESHENG PRECISION ELECTRONICS CO., LTD.
    Inventor: Yaowen He
  • Patent number: 11353766
    Abstract: A reverse mode light valve, the manufacture of a light control device and a method of controlling light transmittance by using of the reverse mode light valve, the reverse mode light valve containing ABX3 perovskite particles (200) suspended in a liquid suspension (300) can control light transmittance in a higher light transmittance when the power is turned off (OFF state) and lower light transmittance when the power is turned on (ON state). In the ABX3 perovskite particles (200), A is at least one of Cs+, CH3NH3+, and Rb+, B is at least one of Pb2+, Ge2+, and Sn2+, and X is at least one of Cl?, Br?, and I?.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: June 7, 2022
    Assignee: ZHEJIANG JINGYI NEW MATERIAL TECHNOLOGY CO. LTD
    Inventors: Yanan Li, Dawei Zhang, Shiyong Zhao, Shuyong Xiao, Bin Liang, Yuzhe Zhang
  • Patent number: 11351707
    Abstract: An additive injection system for use in injection molding machines to inject additive materials, such as fluids or powders, downstream of a nozzle of the injection molding machine. The additive injection unit has an additive tank to store or contain additive material and additive injectors that inject an additive material into an injection molding machine. A pump pumps the additive material from the tank through a common manifold connected to the additive injectors to be injected into the injection molding machine. A controller controls operation of the additive injection device and one or more sensors coupled to the additive injection device can provide feedback to the controller.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: June 7, 2022
    Assignee: IMFLUX INC.
    Inventors: Milko Gergov, Gene Michael Altonen, Herbert Kenneth Hanson, III, William Francis Lawless, III
  • Patent number: 11349112
    Abstract: A method for preparing a hollow structure, and more particularly, to a method for preparing a hollow structure having various stable structures by using polystyrene particles, into which a functional group is introduced, as a template for preparing the hollow structure.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: May 31, 2022
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Jongwook Jung, Se Ho Park, Minchul Jang, Gyo Hyun Hwang, Eunkyung Park, Changhun Park