Abstract: A piezoelectric polyvinylidene fluoride (PVDF) material, a method for manufacturing the same, and a fingerprint recognition module are provided. The polyvinylidene PVDF material includes PVDF, a first solvent, a second solvent, a fluorosurfactant, and an inducing material. Material of the inducing material is one of carbon nanotubes, carbon black, and gold nanorods. Because of the high anisotropy of the inducing material, molecular orientation of the PVDF material is induced, thereby improving piezoelectric performance of the piezoelectric PVDF material. Problems of conventional piezoelectric PVDF materials, which are used in ultrasonic fingerprint recognition modules, such as poor piezoelectric performance and high-energy loss are improved.
Type:
Grant
Filed:
April 25, 2019
Date of Patent:
August 30, 2022
Assignee:
Wuhan China Star Optoelectronics Technology Co., Ltd.
Abstract: The invention relates to a die for arrangement in a press, wherein the die extends along an axial direction between two end faces and forms an inner peripheral surface between the end faces, wherein the die extends from the inner peripheral surface along a radial direction toward an outer peripheral surface and toward at least one centering surface that is disposed in the radial direction on a first diameter, wherein the die has a pressing zone that is spaced apart from the end faces and, in the vicinity of the pressing zone, the die has a greater maximum first stiffness, at least relative to zones of the die that are arranged on the end faces, compared to a pressing force acting on the inner peripheral surface in a direction of a normal vector, and wherein the maximum first stiffness is at least 10% greater than a minimum second stiffness that is present in at least one zone that is arranged on one of the end faces.
Type:
Grant
Filed:
December 13, 2017
Date of Patent:
August 23, 2022
Assignee:
GKN Sinter Metals Engineering GmbH
Inventors:
Rainer Schmitt, Tobias Müller, Thomas Schupp
Abstract: An electroconductive paste according to the present invention contains a binder (A), a silver powder (B), crosslinked resin particles (C) having a glass transition temperature of 35° C. or lower, and an organic solvent (D).
Abstract: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.
Abstract: The present invention relates to articles comprising core shell liquid metal encapsulate networks and methods of using core shell liquid metal encapsulate networks to control AC signals and power. Such method permits the skilled artisan to control the radiation, transmission, reflection and modulation of an AC signal and power. As a result, AC system properties such as operation frequency, polarization, gain, directionality, insertion loss, return loss, and impedance can be controlled under strain.
Type:
Grant
Filed:
September 24, 2019
Date of Patent:
August 9, 2022
Assignee:
United States of America as represented by the Secretary of the Air Force
Inventors:
Christopher E. Tabor, Carl J. Thrasher, Alexander M. Watson, Nicholas J. Morris, Zachary J. Farrell
Abstract: A stamping device serves to create one or more rows of endless dough rings. The stamping device has a stamping head with a stamping punch or a plurality of stamping punches, wherein each stamping punch is associated with a dough ring row. A dough piece support of the stamping device has a dough piece holder or a plurality of dough piece holders. Each dough piece holder of the dough piece support is associated with one of the stamping punches. An opening for the associated stamping punch is configured in a dough piece holder or in each of the dough piece holders as a die. A stamping device results in which the stamping of dough rings in particular to produce doughnuts can also be used, for example, for baking by hand.
Type:
Grant
Filed:
November 12, 2019
Date of Patent:
August 2, 2022
Assignee:
Werner & Pfleiderer Lebensmitteltechnik GmbH
Abstract: Disclosed in the present invention are a novel organometallic complex and an application thereof in organic electronic devices, particularly in organic phosphorescent light emitting diodes. The present invention further relates to organic electronic devices, in particular organic light emitting diodes (OLEDs), that comprise the organometallic complex according to the present invention, and an application thereof in display and illumination technologies. By means of optimizing the structure of a device and changing the concentration of the metal complex in a matrix thereof, optimal device performance may be achieved, facilitating the implementation of a high-efficiency, high-brightness and high-stability OLED devices, and providing a better material option for full-color display and illumination applications.
Abstract: An object of the present invention is to provide an electroconductive adhesive composition which has excellent thermal conductivity and which, even when repeatedly undergoing fluctuations in temperature, is less apt to cause adherend separation. The present invention relates to an electroconductive adhesive composition which contains: an electroconductive filler (A) containing metal particles (a1) having an average particle diameter of 0.5-10 ?m and silver particles (a2) having an average particle diameter of 10-200 nm; and particles (B) of a thermoplastic resin which is solid at 25° C.
Abstract: A compression-molding system in which upon a start of a molding machine being stopped, a powdery-material feeding device preliminarily supplies a filling device with a predetermined amount of a powdery material while stopping a relative displacement of the filling device and a compression by an upper punch and a lower punch, and the molding machine is subsequently started to cause the relative displacement of the filling device and the compression by the upper punch and the lower punch.
Abstract: A thermal inkjet ink includes a water-based vehicle; a colorant; and a modified siloxane surfactant including a plurality of components. Each component has a chemical formula I: Si(1+x+z)O(1+x+z+y)C(1+1+2(x+z)+j+m+y(2+n))H(6+6+6(x+z)+o+p+y(4+q)). For each component: y ranges from 2 to 4; x and z each range from 0 to 14; x+z=from 0 to 14; j, m, and n are the number of carbon atoms, respectively, in R1, R2, and R3; o, p, and q are the number of hydrogen atoms, respectively, in R1, R2, and R3. R1 is selected from H, an alkyl, and an aryl. Each of R2 and R3 is selected from H, an alkyl, an alkyl substituted with an allylic or an epoxy group, an aryl, and an aryl substituted with an allylic or an epoxy group. For some components: x+z=from 7 to 14.
Type:
Grant
Filed:
October 25, 2017
Date of Patent:
August 2, 2022
Assignee:
Hewlett-Packard Development Company, L.P.
Inventors:
Kai-Kong Iu, Howard Doumaux, Stone S. Ouyang
Abstract: A build plate may include one or more thermocouples placed on an underside of the build plate. The one or more thermocouples output temperature fluctuation to assist in monitoring for build plate separation of a product located on top of the build plate.
Type:
Grant
Filed:
March 11, 2019
Date of Patent:
July 26, 2022
Assignee:
THE AEROSPACE CORPORATION
Inventors:
Shant Kenderian, Tait DeWitt McLouth, Joseph T. Case, Dhruv N. Patel
Abstract: An injection molding method for a semifinished product includes a semifinished product emplacement step, a semifinished product pre-compression step and a forming step. First, a pair of mold with a forming space is provided. A semifinished product is put into the mold, and a first joint is performed to the mold by a press-fit jig, fixing the semifinished product in the forming space. The semifinished product is also tightly fitted with the mold. Next, a first open-die is performed and the press-fit jig is removed. After that, a second joint is performed, and a forming material is injected into the forming space. Finally, a second open-die is performed, and then a finished product is formed. By the semifinished product pre-compression step, the forming material can be prevented from resulting in spill or burr on the semifinished product, thereby improving the yield of injection molding.
Abstract: An ink jet printing method includes applying a primer ink composition containing cationic resin particles and water and an ink jet ink composition containing a dispersible anionic pigment, anionic resin particles, and water onto a printing medium such that a value Z defined by the following equation is in the range of 1.0 to 1.
Abstract: A polymer nanocomposite coating of an elastomeric film containing at least 30 wt % conductive nanoparticles based on combined weight of elastomer and conductive nanoparticles is provided. The conductive nanoparticles have an average particle size along each dimension of less than 500 nm for nanoparticles having an aspect ratio of less than 20:1 or have an average particle size along each dimension of less than 2000 nm for nanoparticles having an aspect ratio of 20:1 or greater. The conductive nanoparticles are formed into hierarchical micro- and nano-sized aggregates having re-entrant morphology. The coating is both superoleophobic and conductive and retains these properties even when stretched under strain to over 100%. The coatings may be produced with simple spray technology.
Type:
Grant
Filed:
September 24, 2020
Date of Patent:
July 19, 2022
Assignee:
University of Western Ohio
Inventors:
Lorenzo Ferrari, Dana K. Adkinson, Jun Yang, Binyu Yu, Maxim Paliy, Brad Kobe
Abstract: A robust formulation of silver-organo-complex (SOC) ink and method of making same are provided. In an aspect, the complexing molecules act as reducing agents. The silver loaded ink can be printed and sintered on a wide range of substrates with uniform surface morphology and excellent adhesion.
Type:
Grant
Filed:
February 12, 2020
Date of Patent:
July 19, 2022
Assignee:
KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
Inventors:
Mohammad Vaseem, Garret McKerricher, Atif Shamim
Abstract: The present disclosure relates to a polymer including a unit represented by Chemical Formula 1, a coating composition including the polymer, and an organic light emitting device formed using the same.
Type:
Grant
Filed:
January 18, 2019
Date of Patent:
June 28, 2022
Inventors:
Minseob Seo, Esder Kang, Jaesoon Bae, Hwakyung Kim, Keunsoo Lee, Sejin Jung, Jaechol Lee
Abstract: Embodiments of the present disclosure provide a light emitting element and a processing apparatus therefor and relate to the technical field of light emitting devices. The light emitting element includes a light-emitting lamp bead(s), a connecting wire, and a covering member(s). The light-emitting lamp bead is welded to the connecting wire to form a welding joint. The covering member covers the light-emitting lamp bead and the welding joint. The covering member is integrally formed by injection molding. The present disclosure solves the technical problem existing in the prior art that the service life is adversely affected and the appearance is deteriorated because the welding joints are oxidized after a period of time.
Abstract: A reverse mode light valve, the manufacture of a light control device and a method of controlling light transmittance by using of the reverse mode light valve, the reverse mode light valve containing ABX3 perovskite particles (200) suspended in a liquid suspension (300) can control light transmittance in a higher light transmittance when the power is turned off (OFF state) and lower light transmittance when the power is turned on (ON state). In the ABX3 perovskite particles (200), A is at least one of Cs+, CH3NH3+, and Rb+, B is at least one of Pb2+, Ge2+, and Sn2+, and X is at least one of Cl?, Br?, and I?.
Type:
Grant
Filed:
July 19, 2019
Date of Patent:
June 7, 2022
Assignee:
ZHEJIANG JINGYI NEW MATERIAL TECHNOLOGY CO. LTD
Abstract: An additive injection system for use in injection molding machines to inject additive materials, such as fluids or powders, downstream of a nozzle of the injection molding machine. The additive injection unit has an additive tank to store or contain additive material and additive injectors that inject an additive material into an injection molding machine. A pump pumps the additive material from the tank through a common manifold connected to the additive injectors to be injected into the injection molding machine. A controller controls operation of the additive injection device and one or more sensors coupled to the additive injection device can provide feedback to the controller.
Type:
Grant
Filed:
April 21, 2020
Date of Patent:
June 7, 2022
Assignee:
IMFLUX INC.
Inventors:
Milko Gergov, Gene Michael Altonen, Herbert Kenneth Hanson, III, William Francis Lawless, III
Abstract: A method for preparing a hollow structure, and more particularly, to a method for preparing a hollow structure having various stable structures by using polystyrene particles, into which a functional group is introduced, as a template for preparing the hollow structure.
Type:
Grant
Filed:
August 28, 2018
Date of Patent:
May 31, 2022
Assignee:
LG ENERGY SOLUTION, LTD.
Inventors:
Jongwook Jung, Se Ho Park, Minchul Jang, Gyo Hyun Hwang, Eunkyung Park, Changhun Park