Abstract: The present invention relates to a method for mounting electrical components on leadframes. A conveyor belt is used, having a holder which is attached to the conveyor belt. A leadframe is placed on the conveyor belt and is adjusted and held in position relative to the holder. The leadframe thus maintains its position relative to the endless conveyor belt throughout the entire period for which it remains on the endless conveyor belt.

Abstract: A method and apparatus for welding together two pipes or plates. The bodies to be welded are placed mutually in line against each other while leaving clear a weld groove. The weld groove is filled with more than one welding layer by a welding torch moved in a longitudinal direction of the weld groove, and wherein two welding layers are laid in one welding pass by two welding torches placed successively at a predetermined fixed distance in the longitudinal direction of the weld groove, so that a time-saving is achieved in the welding process.

Abstract: An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward area inside the nozzle tank to form an opening of the nozzle such that a liquid tin within the stannic tank passes through the nozzle tank and produces a tin wave at the opening of the nozzle. The feature of the adjustable nozzle lies in that the rear backflow stopper is mounted at the backward area inside the nozzle tank by means of a rear combining means which adjusts the altitude of the rear backflow stopper with an altitudinal opening and fixes the rear backflow stopper by a fixing means so as to control the waveform of the tin wave produced by the nozzle of the stannic furnace.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provide for the use of either a penetrating or nonpenetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract: Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents can be sealed after soldering if closed cavities are desired. A cavity can also improve hermeticity of a solder joint by providing an additional solder fillet around the cavity in addition to the solder fillet around the perimeter of the solder joint.

Abstract: The invention is related to a zeolite membrane composite composition comprising a first zeolite or zeolite-like layer, a second independently selected catalytic, permselective, or combined catalytic-permselective layer, and a porous support, the porous support having a first surface in contact with the first zeolite layer and a second surface in contact with the second layer. In another embodiment, the invention is directed toward a zeolite membrane composite composition comprising a supported zeolite or zeolite-like layer, the support having a catalytic functionality contained thereon.

Abstract: A solder ball attaching process for attaching solder balls to a wafer is provided. First, an under-ball-metallurgy layer is formed on the active surface of the wafer. Patterned masking layers are sequentially formed over the active surface of the wafer. The masking layers together form a step opening structure that exposes the under-ball-metallic layer. A solder ball is placed on the uppermost masking layer and allowed to roll so that the solder ball drops into the step opening structure by gravity. A reflow process is conducted to join the solder ball and the under-ball-metallurgy layer together. Finally, various masking layers are removed to expose the solder ball on the bonding pad of the wafer.

Abstract: A microjoint interconnect structure comprising a dense array of metallic studs of precisely controllable height tipped with a joining metallurgy. The array is produced on a device chip that is to be attached to a carrier, or to a carrier along with other devices, some of which may be selected to have similar interconnect structures so as to form all together an assembled carrier that functions as a complete computing, communications or networking system.

Abstract: A raised portion 32 is provided on an upper face of an end portion of a plate 31 which forms one side of a frame member 30. An end portion of a plate 41 of another frame member 40 is abutted with the plate 31 of the frame member 30. The frame members 30 and 40 are aluminum alloy extruded frame members and the directions of extrusion of the two frame members are orthogonal. A welding padding is carried on an upper face of the plate 41 of the frame member 40. Under this condition, a rotary tool is inserted from above and a friction stir welding is carried out. Accordingly, the padding serves the same function on the plate 41 as the raised portion 32 on the plate 31, so that a good welding can be carried out.

Abstract: A device for producing a soldered joint between two joining partners which can be joined via a common contact surface (7), using a solder material which can be introduced between the two joining partners. At least one joining partner (1), in the region of the contact surface (7), provides at least one recess, known as a solder reservoir (3), which faces the contact surface and into which the solder material can be introduced, and the solder reservoir (3) is completely delimited and surrounded by the contact surface (7).

Abstract: A friction stir welding spindle includes a support having a center bore. A spindle shaft is adapted to support a stir welding tool and extends within the bore. A bearing assembly allows simultaneous rotational and axial displacement of spindle shaft in the bore relative to the support. A sensing device is adapted to provide an output signal indicative of at least one of a force coincident with axial displacement of the spindle shaft and an axial position of the spindle shaft.

Abstract: A method for fabricating a chip scale package is described. The method utilizes wafer level processes to obtain a chip level package. The method particularly avoids the use of mechanical grinding by the novel use of molding, extruding, and etching technology.

Abstract: A system for providing cutting and orbitally welding thin-walled tubing. The system includes a plurality of clamping blocks that hold the tubing while the tubing is trimmed and orbitally welded. The system further includes at least one tooling plate to which the clamping blocks can be mounted such that the tubing is attached to the tooling plate and properly aligned for net length trimming. The system further includes a welding cassette for retaining the clamping blocks and properly aligning the tubing during orbital welding.

Abstract: A laser machining device can be used to direct two independent laser beams onto the same machining field in a single machining process. This can be achieved by using an at least partially reflective optical element, configured such that the first laser beam is essentially transmitted and the second laser beam is essentially reflected. The beam paths of the two laser beams are varied independently of each other by two deflection units before they strike the at least partially reflective optical element. This results in a large number of advantageous possibilities for the precise and continuous machining of materials.

Abstract: The apparatus for operating on a workpiece includes a die defining first and second apertures and an interior therebetween. The first aperture and the interior of the die are structured to receive the workpiece. The interior of the die can be structured to shape the workpiece into a predetermined configuration. The apparatus includes at least one rotatable pin extending at least partially into the interior of the die. The pin is structured to at least partially stir the workpiece as the workpiece moves through the interior of the die to thereby refine the grain structure of the workpiece.

Abstract: An arrangement for machining workpieces by a laser, particularly for cutting, perforating, notching, engraving, drilling and inscribing workpieces with three-dimensional structures of different sizes. The laser beam is directed to the workpiece, which is fixed on a holding device, by means of a robot-guided articulated mirror arm and a laser scanner. The laser beam is guided by a coordinated time-controlled and position-controlled deflection of the articulated mirror arm and of the mirror elements of the laser scanner.

Abstract: A process of casting a molten metal to form a cast metal strip ingot while controlling heat flux from the cast metal. The process comprises continuously supplying molten metal to a casting cavity formed between a pair of moving continuous casting surfaces that withdraw heat from the molten metal to cause metal solidification, and continuously withdrawing a resulting cast strip ingot from the casting cavity. A gas (e.g. air) containing water vapour substantially without liquid water (i.e. a moist gas) is supplied to the inlet of the casting cavity in a region containing the meniscus formed where the molten metal first contacts the casting surfaces. The moist gas has the effect of adjusting the heat withdrawal by the casting surfaces to minimize surface defects in the cast strip ingot and to avoid undesired distortion of the casting cavity. Furthermore, in those cases where a parting agent is applied to the casting surfaces, the amount of parting agent applied to the casting surfaces may be reduced.

Abstract: The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the components, to a below its damage temperature and after heating its side which is remote from the components is thermally insulated. Then, the side which faces the components is acted on by a heating-gas stream which is concentrated onto the locations which are to be soldered by a template which has windows.

Abstract: On a main shaft 30 of a numeric control type machine tool, a rotary tool 50 is installed. The main shaft 30 is not inclined in the machine tool. A first member 70 and a second member 76 to be subjected to friction stir welding are fixed on a table 20. Relative to an axial center of the rotary tool 50, a non-linear welding portion of the first member 70 and the second member 76 is inclined by inclining the table 20. Then, by rotating the table 20 and relatively moving the portion to be welded into contact with the rotary tool 50, welding of the first member to the second member is carried out according to friction stir welding. The above-stated inclination is the inclination required for the friction stir welding. In this way, welding along a path of ring shape or circular shape (including a circular arc) using friction stir welding can be carried out easily.

Abstract: In a method and apparatus for joining at least two adjoining workpieces by friction welding, a rotatable shaft is provided at its front end with a friction welding tool which is biased toward the workpieces to plasticize an area of the workpiece into which the tool enters while the plasticized material is displaced and stored in, or around, the tool. Upon passing through the top workpiece and entering the lowermost work piece, the tool is removed and the stored plasticized material is returned to the void provided by the tool upon removal thereof from the workpieces for joining the workpieces.