Abstract: A system and method for reliably welding a relatively thin tab into a relatively wide slot is provided. The system and method forms a protrusion on the tab. When the tab with the protrusion is inserted into the slot, the protrusion causes the tab to be firmly pressed against one side of the slot. With the tab pressed firmly against the side of the slot, the tab can then be welded to the slot. Because the tab is pressed firmly against the side of the slot during welding, the reliability of the welding process is improved. The present invention is applicable to all welding procedures, but is particularly applicable to laser welding used in precision manufacturing. In those applications, the protrusion causes the tab to be firmly held against the side of the slot while the laser welds the tab and slot together.

Abstract: A system and method of joining together first and second electric terminals includes providing the second terminal with an aperture extending therethrough and a notch therein. The first and second terminals are positioned in overlapping relationship with one another so the aperture overlaps the first terminal to provide access to the first terminal through the second terminal, and so the notch overlaps the first terminal. Heat is applied to the first terminal through the aperture in the second terminal to heat the first and second terminals. The end of a solder wire is positioned in engagement with the notch of the heated second terminal to locate the solder wire with respect to the terminals and to melt the solder wire to form a solder pool that contacts the first and second terminals.

Abstract: A fugitive pattern of an article to be investment cast wherein the pattern includes a plurality of locator embossments disposed in an array to provide a datum reference system by which the pattern can be held and positioned by a manipulator, such as for example a gripper device to a computer controlled robotic device, for assembly with another component of the pattern assembly. The datum embossments are located on a portion of the pattern that will be removed from the final metallic casting made to replicate the pattern. The casting includes integral cast datum embossments thereon by which the casting can be held and positioned.

Abstract: A weld shield device for facilitating end-to-end welding of two pipe segments having fiberglass liners. The weld shield device includes an insulation material applied about the outer surface of a sleeve body. The sleeve body helps establish a welding gap between the two pipe segments. The insulation material reduces the heat transfer from the welding operations to the fiberglass liners. Additionally, a method of joining two pipe segments with fiberglass liners is provided, which includes connecting a first end of a weld shield device to a first pipe segment and connecting a second pipe segment to the second end of the weld shield device with the weld shield device being partially in a cutout portion of the fiberglass liner. Then, the two pipe segments are welded together. Insulation material on the weld shield device reduces the heat transfer from the welding operations to the fiberglass liners.

Abstract: A welding gun comprising: an electrically conductive gun body having a passageway; a head tube assembly having one end inserted in the passageway of the gun body; a rotation nut that retains the head tube assembly in the inserted state when the rotation nut is threadably coupled to the gun body; and an electrically insulative ring installed between a portion of the gun body and an electrically conductive part of the head tube assembly. The electrically conductive gun body has a frusto-conical inner peripheral surface that is in contact with a frusto-conical outer peripheral surface of the electrically insulative ring. The rotation nut comprises an electrically conductive part that is threadably engaged to the electrically conductive gun body and that is in electrical contact with the electrically conductive portion of the head tube assembly.

Abstract: A method for manufacturing a wiring substrate includes the steps of applying, through printing, solder paste onto a plurality of pads exposed from the main surface of the substrate; melting the applied solder paste through reflowing, so as to form substantially hemispherical solder bumps; and flattening top portions of the substantially hemispherical solder bumps through the pressing of a flat pressing surface against the top portions, thereby forming top-flattened solder bumps. A pad is classified as a first pad when the pad is located within a region above a solid layer, and as a second pad when the pad is located outside of this region. In the solder paste application step, the amount of solder paste applied onto each first pad is smaller than that of solder paste applied onto each second pad.

Abstract: A process for producing a tube target for cathode sputtering plants, in which the tube target is formed from a metallic inner tube (target holder) made of a first material with a first melting point of Ts1≧900 K and a metallic outer tube (target) that concentrically surrounds the inner tube and that is made of a second material with a second melting point of Ts2≦800 K. The inside diameter of the outer tube and the outside diameter of the inner tube are proportioned in such a way that the two tubes fit together tightly and are mechanically firmly joined. The outer tube is formed by casting the second material in a molten state in a heated, vertical, cylindrical permanent mold, which has a heated mandrel that constitutes the inner tube.

Abstract: An apparatus for supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Abstract: A continuous controlled atmosphere brazing system includes a dry-off oven for driving off moisture from materials to be brazed, a pre-heat section for pre-heating the material and a brazing furnace for brazing the materials. Heated gas produced in the pre-heat section and the brazing furnace is conveyed along a flowpath to the chamber of the dry-off oven to provide substantially the sole source of heat for the oven. The flowpath for the heated gas is defined by a series of tubes in communication with each component of the brazing system and intermediate manifolds disposed between components. The discharge mouths of the tubes open into the oven chamber at the suction side of recirculation fans operating within the oven. The overall temperature of the oven can be regulated by controllably mixing ambient air with the heated gas in relation to the oven temperature.

Abstract: The present invention relates to a device that includes a low-ohmic test. The device includes a metallization copper pad such as metal-six, a metal first film such as Ni that is disposed above the metallization copper pad, and a metal second film such as Au that is disposed above the metal first film. The present invention also relates to a wire-bonding process, and to a method of pulling a first wire bond and making a second wire bond.

Abstract: Disclosed is a friction stir welding technique which avoids occurrence of a dent, in adjoining region, extending to a level beneath the joined surfaces. At end portions of the frame members to be joined, at the joining region, thickened parts which project toward the rotary body joining tool are provided. Two adjoining thickened parts, of adjacent members to be joined, can form a trapezoid shape. The rotary body joining tool has a small-diameter tip portion and a larger diameter portion. The rotary body joining tool is inserted in the thickened parts. In a state where the rotary body joining tool has been inserted small-diameter tip and first, to a level where the larger diameter portion of the rotary body joining tool overlaps the thickened part but does not extend below the upper surface of the non-thickened surfaces of the members joined, the rotary body is rotated and moved along the joining region. Even when a gap exists between two thickened parts, a desirable joining can be carried out.

Abstract: The invention pertains to a carrier composition comprising (a) at least 30 wt % of a synthetic cracking component, based on the total weight of the carrier composition, which comprises oxidic compounds of one or more trivalent metallic elements, tetravalent metallic elements, and divalent metallic elements, said cracking component comprising elemental clay platelets with an average diameter of 1 &mgr;m or less and an average degree of stacking of 20 platelets per stack or less, and/or comprising a cogel with a saponite content CA of less than 60%, in which the total of sodium and potassium amounts to less than 1 wt %, based on the total weight of the cogel, and (b) 1-25 wt % of a zeolite Y, based on the total weight of the carrier composition, with a unit cell size below 24.35 Å. The invention further pertains to a catalyst comprising said carrier composition and at least a hydrogenation metal, and a process for converting heavy feedstock into middle distillates using said catalyst.

Abstract: A liquefiable gas pressure cylinder and method for making the same with the cylinder including a cylindrical shell, and heads fusion welded at opposites ends of the shell. The side ends where the heads are joined to the shell are crimped radially inward to each end to form chimes. The welds are 100% radiographed and heat treated. The heads are dished to have a domed center portion which has a profile and thickness so that the domed center portions will reverse before any other part of the cylinder is stressed beyond a yield limit for such part.

Abstract: A shaped metallic component is formed by friction stirring at least a segment of a single piece of bulk metal to impart superplasticity thereto and thereby yield a single superplastic metal blank from the single piece of bulk metal. The metal blank is then deformed by a metal deformation process such as forging, rolling, drawing, bending, extruding, gas forming, punching, and stamping.

Abstract: A method of forming reflowed bumps comprising the following sequential steps. A wafer is provided. A series of spaced initial bumps is formed upon the wafer. The initial bumps having exposed side walls and top surfaces and organic residue over the initial bump side walls and/or the initial bump top surfaces. The organic residue is simultaneously removed from the initial bump side walls and top surfaces with the forming a surface oxide layer over the initial bump side walls and top surfaces. The surface oxide layer is stripped from the initial bump top surfaces and an upper portion of the initial bump side walls to form partially exposed bumps. The partially exposed bumps are heat treated to melt the partially exposed bumps to form the reflowed bumps.

Abstract: A heat exchanger, characterized in that Al or Al alloy tubes, each having a thermally Zn-sprayed layer formed on the surface of it, and having a brazing filler metal layer formed on said thermally Zn-sprayed layer using a powdery brazing filler Al alloy composed of 5 to 60 weight % of Si and the balance of Al and unavoidable impurities, are combined with and brazed to an Al or Al alloy header having a brazing filler metal layer formed using a powdery brazing filler Al alloy composed of 5 to 60 weight % of Si and the balance of Al and unavoidable impurities. The tubes and the header are strongly bonded to each other, and Zn is uniformly diffused and distributed. So, the heat exchanger shows good corrosion resistance.

Abstract: A friction stir welding tool includes a friction stir welding head having a probe and spindle rotatably mounted at a first end. A support supports the stir welding head between the first end and a second end for movement about a pitch axis. A pitch actuator includes an elongated arm coupled to the stir welding head at a point longitudinally spaced from pitch axis to overcome the relatively large forces exerted at the probe. A turntable supports the stir welding head for movement about a yaw axis. A yaw actuator includes an elongated arm coupled to the turntable laterally spaced from the yaw axis, to overcome the relatively large forces exerted at the probe. A controller maintains an angle of attack of the probe with respect to direction of travel of the probe along the work piece.

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e.

Abstract: A die bonding apparatus includes a first member having a surface to be die bonded on which solder is disposed, a base portion for mounting the first member thereon in a predetermined position, a second member disposed in an inclined manner with respect to the first member and faces the solder, and an inclination attenuating member for inclining and holding the second member with respect to the first member to attenuate an angle of inclination &thgr;1 of the second member with respect to the first member in a state where the solder is melted. In a state where the first, second members, and the solder are heated and the solder is melted, die bonding is effected while the inclination attenuating member gradually attenuates the angle of inclination &thgr;1, so that it is possible to suppress the occurrence of bubbles in the solder.

Abstract: A method of bonding a bonding element to a metal bonding pad comprises the following steps. A semiconductor structure having an exposed, recessed metal bonding pad within a layer opening is provided. The layer has an upper surface. A conductive cap having a predetermined thickness is formed over the metal bonding pad. A bonding element is bonded to the conductive cap to form an electrical connection with the metal bonding pad.