Abstract: An integrated circuit package system that includes: providing a support structure including an integrated circuit and an electrical contact adjacent thereto; providing a first mold having a first cavity with a projection and a recess for collecting flash; engaging the first mold on the support structure with the first cavity over at least a portion of the integrated circuit and the projection and the recess between the at least a portion of the integrated circuit and the electrical contact; and injecting encapsulation material into the first cavity.

Abstract: A material for a light emitting device containing a compound represented by the following formula (1): wherein each A independently represents a nitrogen atom or a carbon atom, which may have a substituent, and each of the rings consisting of A and nitrogen atoms independently represents an aromatic ring or an aromatic heterocyclic ring; and L represents a divalent linking group.

Abstract: A blank and a semiconductor device are include a composite panel with semiconductor chips embedded in a plastic package molding compound. The blank includes a composite panel with semiconductor chips arranged in rows and columns in a plastic package molding compound with active upper sides of the semiconductor chips forming a coplanar surface area with the upper side of the composite panel. The blank further includes an orientation indicator impressed into the plastic package molding compound when the semiconductor chips are embedded within the molding compound.

Abstract: A sound output device of the present invention for outputting sound according to audio data fed thereto includes: a volume adjuster that is operated by a user in a predetermined manner, and that determines a ratio of volume of the sound to predetermined reference volume according to how it is operated by the user; a time detector detecting that a predetermined time has come; and a reference volume adjuster adjusting the reference volume according to a detection result of the time detector. Thus, the maximum level of the volume (which is dependent on the reference volume) can be automatically adjusted according to the current time. The volume adjuster determines the ratio of volume to reference volume according to the operation by the user. Thus, for example, the same operation performed by the user even under different levels of reference volume produces almost the same ratio of volume to reference volume.

Abstract: When letters are written with a ballpoint pen, pen pressure is greater than or equal to 10 MPa. The IC tag embedded in the paper base material is required to withstand such pen pressure. An integrated circuit including a functional circuit which transmits and receive, performs arithmetic of, and stores information is thinned, and also, when the integrated circuit and a structural body provided with an antenna or a wiring are attached, a second structural body formed of ceramics or the like is also attached to at the same time. When the second structural body formed of ceramics or the like is used, resistance to pressing pressure or bending stress applied externally can be realized. Further, a part of passive elements included in the integrated circuit can be transferred to the second structural body, which leads to reduction in area of the semiconductor device.