Patents Examined by Kimberly Nguyen
  • Patent number: 8252615
    Abstract: An integrated circuit package system that includes: providing a support structure including an integrated circuit and an electrical contact adjacent thereto; providing a first mold having a first cavity with a projection and a recess for collecting flash; engaging the first mold on the support structure with the first cavity over at least a portion of the integrated circuit and the projection and the recess between the at least a portion of the integrated circuit and the electrical contact; and injecting encapsulation material into the first cavity.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: August 28, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: Ki Youn Jang, Sungmin Song, JoHyun Bae
  • Patent number: 8253130
    Abstract: A material for a light emitting device containing a compound represented by the following formula (1): wherein each A independently represents a nitrogen atom or a carbon atom, which may have a substituent, and each of the rings consisting of A and nitrogen atoms independently represents an aromatic ring or an aromatic heterocyclic ring; and L represents a divalent linking group.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: August 28, 2012
    Assignee: FUJIFILM Corporation
    Inventors: Saki Takada, Toshihiro Ise, Yosuke Yamamoto
  • Patent number: 8247897
    Abstract: A blank and a semiconductor device are include a composite panel with semiconductor chips embedded in a plastic package molding compound. The blank includes a composite panel with semiconductor chips arranged in rows and columns in a plastic package molding compound with active upper sides of the semiconductor chips forming a coplanar surface area with the upper side of the composite panel. The blank further includes an orientation indicator impressed into the plastic package molding compound when the semiconductor chips are embedded within the molding compound.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: August 21, 2012
    Assignee: Intel Mobile Communications GmbH
    Inventors: Markus Brunnbauer, Edward Fuergut
  • Patent number: 8233640
    Abstract: A sound output device of the present invention for outputting sound according to audio data fed thereto includes: a volume adjuster that is operated by a user in a predetermined manner, and that determines a ratio of volume of the sound to predetermined reference volume according to how it is operated by the user; a time detector detecting that a predetermined time has come; and a reference volume adjuster adjusting the reference volume according to a detection result of the time detector. Thus, the maximum level of the volume (which is dependent on the reference volume) can be automatically adjusted according to the current time. The volume adjuster determines the ratio of volume to reference volume according to the operation by the user. Thus, for example, the same operation performed by the user even under different levels of reference volume produces almost the same ratio of volume to reference volume.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: July 31, 2012
    Assignee: Funai Electric Co., Ltd.
    Inventor: Ryuuji Takahashi
  • Patent number: 8232621
    Abstract: When letters are written with a ballpoint pen, pen pressure is greater than or equal to 10 MPa. The IC tag embedded in the paper base material is required to withstand such pen pressure. An integrated circuit including a functional circuit which transmits and receive, performs arithmetic of, and stores information is thinned, and also, when the integrated circuit and a structural body provided with an antenna or a wiring are attached, a second structural body formed of ceramics or the like is also attached to at the same time. When the second structural body formed of ceramics or the like is used, resistance to pressing pressure or bending stress applied externally can be realized. Further, a part of passive elements included in the integrated circuit can be transferred to the second structural body, which leads to reduction in area of the semiconductor device.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: July 31, 2012
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Yasuyuki Arai
  • Patent number: 8229136
    Abstract: The present invention provides for methods and systems for digitally processing audio signals by adjusting the gain of a signal a first time, using a digital processing device located between a radio head unit and a speaker. The methods and systems may filter the adjusted signal with a first low shelf filter, compress the filtered signal with a first compressor, process the signal with a graphic equalizer, compress the processed signal with a second compressor and adjust the gain of the compressed signal a second time. The methods and systems may also filter the signal received from the first low shelf filter with a first high shelf filter prior to compressing the filtered signal with the first compressor. The signal may be filtered with a second low shelf filter prior to processing the signal with the graphic equalizer. Some embodiments filter the signal with a second high shelf filter after the signal is filtered with the second low shelf filter.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: July 24, 2012
    Inventors: Anthony Bongiovi, Phillip Fuller, Glenn Zelniker
  • Patent number: 8223992
    Abstract: A speaker array apparatus includes a speaker array that emits sounds of a plurality of channels, a beam formation calculating section that performs a calculation for controlling phases of the sounds so that the speaker array emits sound beams in directions set for the respective channels, a sound source localization applying section that performs a calculation for controlling the phases of the sounds emitted from the speaker array so as to form a plurality of virtual point sound sources, and performs a calculation of auditory sensation characteristics at a listening position on a basis of a head-related transfer function, a selecting section that selects one of the beam formation calculating section and the sound source localization applying section, and a phase controlling section that controls the phases of the sounds emitted from the speaker array on a basis of a calculation result of the beam formation calculation section which is selected by the selecting section or applies the auditory sensation charact
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: July 17, 2012
    Assignee: Yamaha Corporation
    Inventors: Koji Suzuki, Yusuke Konagai
  • Patent number: 8217483
    Abstract: A semiconductor component that includes a photosensitive doped semiconductor layer, in which electrical charge carriers are released during absorption of electromagnetic radiation is disclosed. The photosensitive semiconductor layer has a structured interface and at least one layer which generates an electric field for separating the released charge carriers disposed downstream of the structured interface. The electric field extends over the structured interface. The photosensitive semiconductor component is distinguished by a high efficiency of the charge carrier separation, in particular, for generating an electric current.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: July 10, 2012
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E. V.
    Inventors: Kevin Fuechsel, Andreas Tuennermann, Ernst-Bernhard Kley
  • Patent number: 8217423
    Abstract: While embedded silicon germanium alloy and silicon carbon alloy provide many useful applications, especially for enhancing the mobility of MOSFETs through stress engineering, formation of alloyed silicide on these surfaces degrades device performance. The present invention provides structures and methods for providing unalloyed silicide on such silicon alloy surfaces placed on semiconductor substrates. This enables the formation of low resistance contacts for both mobility enhanced PFETs with embedded SiGe and mobility enhanced NFETs with embedded Si:C on the same semiconductor substrate. Furthermore, this invention provides methods for thick epitaxial silicon alloy, especially thick epitaxial Si:C alloy, above the level of the gate dielectric to increase the stress on the channel on the transistor devices.
    Type: Grant
    Filed: January 4, 2007
    Date of Patent: July 10, 2012
    Assignee: International Business Machines Corporation
    Inventors: Yaocheng Liu, Dureseti Chidambarrao, Oleg Gluschenkov, Judson R Holt, Renee T Mo, Kern Rim
  • Patent number: 8206997
    Abstract: A probe having a sufficient height is manufactured by selectively depositing, over the main surface of a wafer, a copper film in a region in which a metal film is to be formed and a region which will be outside an adhesion ring when a probe card is fabricated; forming the metal film, polyimide film, interconnect, another polyimide film, another interconnect and a further polyimide film; and then removing the wafer and copper film. According to the present invention, when probe testing is performed using a prober (thin film probe) having the probe formed in the above-described manner while utilizing the manufacturing technology of semiconductor integrated circuit devices, it is possible to prevent breakage of the prober and a wafer to be tested.
    Type: Grant
    Filed: July 15, 2010
    Date of Patent: June 26, 2012
    Assignee: Renesas Electronics Corporation
    Inventors: Akio Hasebe, Yasuhiro Motoyama, Yasunori Narizuka, Seigo Nakamura, Kenji Kawakami
  • Patent number: 8204257
    Abstract: A method for increasing ring tone volume is provided. The method includes steps of: reading an audio file which is set as a current ring tone; determining whether the ring tone is a MP3 audio file or a musical instrument digital interface (MIDI) audio file; adjusting frequencies by using an equalizer technique to increase volume of the ring tone if the ring tone is the MP3 audio file; adjusting a volume level of the ring tone to be the highest volume level, and adjusting timbre of the ring tone to increase the ring tone volume by simulating a musical score of the ring tone by using different instruments if the ring tone is the MIDI audio file. A related system is also provided.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: June 19, 2012
    Assignee: Chi Mei Communications Systems, Inc.
    Inventor: Meng-Chun Chen
  • Patent number: 8204254
    Abstract: An amplifier is provided using digital potentiometer integrated circuits to control the tone of a vacuum tube preamplifier allowing digital control of the analog signal path of the amplifier. Using digital potentiometer integrated circuits to control the tone of a vacuum tube preamplifier results in an amplifier that preserves the unique tone quality of a vacuum tube amplifier that offers the flexibility, versatility, and user-friendly features of a digitally controlled amplifier, such as the ability to save and recall amplifier settings. The amplifier of the present invention is especially applicable for use with musical instruments such as for example, electric guitars.
    Type: Grant
    Filed: August 4, 2008
    Date of Patent: June 19, 2012
    Inventor: Donelson Arthur Shannon
  • Patent number: 8199932
    Abstract: A signal processing apparatus includes a plurality of equalizers configured to input an audio signal of a corresponding channel among audio signals of a plurality of channels and configured to perform at least gain adjustment on the basis of a set parameter, each of the equalizers being provided in such a manner as to correspond to an audio signal of one of the plurality of channels; a plurality of output sections configured to output each audio signal for each of the plurality of channels, the audio signal being processed by the equalizer; a measurement section configured to measure frequency-amplitude characteristics of the audio signal output from the output section; and a computation section configured to perform a computation process for correcting frequency-amplitude characteristics of an audio signal of each channel on the basis of the measurement result by the measurement section.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: June 12, 2012
    Assignee: Sony Corporation
    Inventor: Kenji Nakano
  • Patent number: 8198142
    Abstract: A general purpose BGA security cap includes a substrate, an integrated circuit die, and an array of bond balls. The substrate includes an anti-tamper security mesh of conductors. The bond balls include outer bond balls and inner bond balls that are fixed to the underside of the substrate. The integrated circuit drives and monitors the anti-tamper security mesh and communicates data using a serial physical interface through a subset of the inner bond balls. In one example, a user has circuitry to be protected. The user purchases the BGA security cap and fits it over the circuitry to be protected such that the integrated circuit of the security cap communicates tamper detect condition information via the serial interface to the underlying protected circuitry and causes sensitive information to be erased or a program to be halted in the event of a tamper condition.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: June 12, 2012
    Assignee: IXYS CH GmbH
    Inventor: David D. Eaton
  • Patent number: 8174014
    Abstract: An apparatus and associated method are provided. A first silicon layer having at least one of an associated passivation layer and barrier is included. Also included is a composite anti-reflection layer including a stack of layers each with a different thickness and refractive index. Such composite anti-reflection layer is disposed adjacent to the first silicon layer.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: May 8, 2012
    Assignee: California Institute of Technology
    Inventor: Bedabrata Pain
  • Patent number: 8173453
    Abstract: Patterning an organic light emitting diode (OLED) after it has been encapsulated by permanently changing the light emissivity of the diodes. The OLED includes an intervening layer between a source of laser treatment and a light emitting layer. Depending on the composition of the light emitting layer, the laser treatment will enhance or diminish brightness.
    Type: Grant
    Filed: January 7, 2008
    Date of Patent: May 8, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: Fred B. McCormick, Robert C. Fitzer, Hung T. Tran
  • Patent number: 8168537
    Abstract: A semiconductor component has a substrate and a projecting electrode on the substrate. The projecting electrode is configured suitably for electrically and mechanically connecting the semiconductor component to an external substrate. Furthermore, the projecting electrode is formed by a one-dimensional or two-dimensional array of projecting sub-electrodes, which are separated from each other by an electrically insulating fluid beginning from a substrate surface. The semiconductor component has an improved projecting-electrode. It provides the projecting electrode with a sub-structure, which achieves sufficient flexibility without introducing much constructive complexity and processing complexity during fabrication.
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: May 1, 2012
    Assignee: NXP B.V.
    Inventors: Joerg Jasper, Ute Jasper
  • Patent number: 8164157
    Abstract: This patent pertains to a new technique of increasing the amount of energy absorbed by an antenna. It accomplishes this by broadcasting a spike that attracts the signal when the fields of its oscillating charge are at their strongest.
    Type: Grant
    Filed: July 27, 2008
    Date of Patent: April 24, 2012
    Inventor: David Robert Morgan
  • Patent number: 8160274
    Abstract: The present invention provides for methods and systems for digitally processing an audio signal. Specifically, the present invention provides for a headliner speaker system that is configured to digitally process an audio signal in a manner such that studio-quality sound that can be reproduced.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: April 17, 2012
    Assignee: Bongiovi Acoustics LLC.
    Inventor: Anthony Bongiovi
  • Patent number: 8155328
    Abstract: An sound reproducing apparatus is configured such that a correction amount is calculated on the basis of a masking model, determiner for determining a correction parameter correcting input signal so as to be natural for human ears to hear on the basis of the calculated correction amount is provided, and a characteristic of correction filter is changed on the basis of a result of determiner when inputting vehicle speed information.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: April 10, 2012
    Assignee: Panasonic Corporation
    Inventors: Kazuhisa Kotegawa, Fumiyasu Konno, Shinnosuke Nagasawa, Masahide Onishi