Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
Type:
Grant
Filed:
November 17, 2021
Date of Patent:
May 7, 2024
Assignee:
CISCO TECHNOLOGY, INC.
Inventors:
Mehmet Onder Cap, Manigandan Boopalan, Joel Richard Goergen, Sandeep Mehdiratta, Manjunatha Reddy Shivashankara, Damaruganath Pinjala
Inventors:
Jose Julian Rivera Franco, Johan Blond Dybvad, Martin Pasfall, Jan Baagøe, Lasse Øbro Jørgensen, Martin Starbaek, Pelle Normann Brix, Jesper Elling, Margaret Kate Godwin