Abstract: A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.

Abstract: A device for counting oscillations of an oscillating temporal signal. The device comprises means for counting all the alternate crossings of a positive threshold value and of a negative threshold value by a monitored time signal.

Abstract: A method of detecting partial corona discharge in a targeted circuit of an electrical apparatus, comprises the steps of: wrapping a Rogowski coil around a leg of the targeted circuit to produce a Rogowski coil signal that represents electrical current rate of change in the leg of the targeted circuit; coupling the Rogowski coil signal to a three-dimensional display device that may represent the dimension of time, the dimension of amplitude as a function of a time, and the dimension of duration of amplitude as a function of time in successive periods of that have a preselected duration; monitoring the display device to detect deviations of the duration of amplitude as a function of time from a normal waveform in the leg of the targeted circuit; and correlating ones of the detected deviations of the duration of amplitude as a function of time from a normal waveform that exceed a preselected deviation level as indicative of partial corona discharge within the targeted circuit.

Abstract: An inductive proximity sensor and related method for sensing a presence/position of a target, with mounting effect compensation, are disclosed. In at least one embodiment, the method includes providing a proximity sensor having first and second coils that are both at least indirectly in communication with control circuitry. The method also includes receiving respective first and second signals at least indirectly indicative of respective first and second electromagnetic field components respectively experienced by the first coil as influenced both by a target and a structure supporting the sensor and the second coil as influenced by the supporting structure. The method further includes determining by way of the circuitry a third signal based at least in part upon the first signal, as modified based at least in part upon the second signal, whereby the third signal is indicative of the presence or position of the target relative to the sensor.

Abstract: The invention relates to a measuring arrangement, a semiconductor arrangement and a method for operating a reference source, wherein at least one semiconductor component and a voltage source are connected to a measuring unit and the measuring unit provides a measured value that is proportional to the number of defects.

Abstract: An angular position sensor and method that relies on a stationary circular array of Hall sensors and a rotatable circular array of magnets arranged about a common axis. A periodic and simultaneous reading of all of the Hall sensor outputs is used to determine angular velocity.

Abstract: A method of manufacturing an apparatus 200 comprising forming an integrated magnetometer package 202. Forming an integrated magnetometer package 202 includes forming a movable part 215 from a MEM magnetometer substrate 210, and attaching an integrated circuit 910 to one side 212 of the MEM magnetometer substrate. A spacer structure 410 is formed on an opposite side of the MEM magnetometer substrate such that the moveable part is exposed through an opening 420 in the spacer structure. But the moveable part cannot escape through said opening. A permanent magnet 1010 is mounted through the opening to the movable part.

Abstract: A configurable PSRO measurement circuit is used to measure the frequency dependent capacitance of a target through silicon via (TSV) or other conductive structure. Measurements of the target structure are aided by using adjustable resistors and a de-embedding structure to measure the effects of parasitic capacitance, CPAR. Current is measured to both the device under test (DUT) and the de-embedding structure. From these measurements, the frequency dependent capacitance of the DUT is calculated.

Abstract: In a side-docking type test handler, a descending mechanism lowers a horizontally postured test tray, which has been transferred into a soak chamber, down to a descent finish position and a vertical posture changing mechanism changes the posture of the test tray, which has been lowered to the descent finish position, from the horizontal state to a vertical state, to transfer the test tray into a test chamber. Further, a horizontal posture changing mechanism changes the posture of the test tray in the test chamber from the vertical state to the horizontal state while transferring the test tray to an ascent start position in a desoak chamber.

Abstract: The invention relates to a method and arrangement for the contactless determination of conductivity-influencing properties and their spatial distribution over the entire cross section of an electrically conductive substance moving in a primary magnetic field (B). The substance may be a liquid or a solid. A simultaneous measurement of a number of mechanical state parameters of the magnetic system is performed (three-dimensional components of the force and the torque), said parameters being variable by the effect of a secondary field on the magnetic system, the secondary field being produced on the basis of eddy currents induced in the substance by the primary field (B). To determine the spatial distribution of the property that is sought, the primary field is changed in intensity or form a number of times and a measurement of the state parameters is carried out for each change.

Abstract: Provided is a semiconductor integrated circuit including: a first path that includes a first logic circuit; a second path that includes a second logic circuit; and a subsequent-stage circuit that is connected to an output of the first path and is connected to an output of the second path, in which the second path further includes a first internal path that is selected as a propagation path during a normal operation period; and a second internal path that is selected as a propagation path during a test operation period and includes a delay circuit having a delay amount larger than a delay amount of the first internal path.

Abstract: An inductive position encoder is described having first and second members which are relatively moveable over a measurement path, a magnetic device mounted on the first member; a plurality of first windings mounted on the second member; and a second winding. The magnetic device is operable to interact with the windings such that upon the energization of either the second winding or the first windings, there is generated a plurality of sensor signals each being associated with a respective one of said first windings and varying with the relative position between said magnetic device and the associated first winding and hence with the relative position between said first and second members. Additionally, the plurality of first windings are arranged along said measurement path so that the sensor signals vary substantially in accordance with a predetermined Gray code.

Abstract: Systems, methods and apparatus for monitoring rub detection in a machine are provided. An alternating current voltage signal may be transmitted or communicated to at least one component of the machine. The transmitted signal may be monitored in the at least one component and at least one characteristic associated with the monitored signal may be compared to an expected value for the at least one characteristic. Based at least in part on the comparison, a rub condition or potential rub condition may be identified between the at least one component and another component of the machine.

Abstract: The present invention is a method for evaluating a silicon wafer by measuring, after fabricating a MOS capacitor by forming an insulator film and one or more electrodes sequentially on a silicon wafer, a dielectric breakdown characteristic of the insulator film by applying an electric field from the electrodes thus formed to the insulator film, the method in which the silicon wafer is evaluated at least by setting an area occupied by all the electrodes thus formed to 5% or more of an area of a front surface of the silicon wafer when the one or more electrodes are formed. This provides an evaluation method that can detect a defect by a simple method such as the TDDB method with the same high degree of precision as that of the DSOD method.

Abstract: A power delivery system wirelessly deliver electric power and a communication signal to a target device. The power delivery system includes a power transmitting unit having a power source operable to source alternating current power and a sending resonant coupling component operable to couple the alternating current power to a coil for wireless power transmission by a non-radiated magnetic field at a target resonant frequency. The power transmitting unit is capable of dynamically tuning the wireless power transmission to the target resonant frequency wherein the target resonant frequency is specified dynamically. A communication module couples to the power transmitting unit and is operable to couple the communication signal to the non-radiated magnetic field. Operations may include target device authentication, target resonant frequency information communication, billing, and device management.

Abstract: A circular top surface of a magnet is magnetized to the N-pole, and a back surface thereof is magnetized to the S-pole. A detector moves within the X-Y plane at positions located away from the top surface of the magnet. A pair of X-direction detecting elements and a pair of the Y-direction detecting elements are provided in the detector. In the X-direction detecting elements, the directions of a bias magnetic field provided to free magnetic layers are opposite to each other. When the detector moves in the Y direction, a decrease in the sensitivity of one of the X-direction detecting elements is compensated for by an improvement in the sensitivity of the other element. This also applies to the Y-direction detecting elements. Accordingly, position detection outputs of the X direction and the Y direction can be accurately obtained from the detector.

Abstract: A test and measurement instrument including a port including a plurality of connections; an impedance sense circuit configured to sense an impedance coupled to a connection of the plurality of connections; and a controller configured to setup the test and measurement instrument in response to a sensed impedance from the impedance sense circuit.

Abstract: A measuring system minimizes the parasitic affects of lumped circuit elements. The system includes two or more in-situ interfaces configured to conductively link a source to an internal load and an external load. The in-situ interfaces are linked to a shunt conductor. Two or more linear and dynamic elements conductively link the in-situ interfaces in series. The dynamic elements are configured to overwhelm the parasitic self-capacitance of an input circuit coupled to at least one of the in-situ interfaces. A shield enclosing at least one of the linear and dynamic elements has a conductive surface to fields and electromagnetic interference. The shield has attenuation ratios that substantially dampen the parasitic capacitance between the linear and dynamic elements that bridge some of the in-situ interfaces.

Abstract: A contact for an electrical test comprises a first area to be bonded to a board, a second area extending in the right-left direction from the lower end portion of the first area, a third area projecting downward from the tip end portion of the second area, and a low light reflective film having lower light reflectance than that of the first area. The third area has a probe tip to be contacted an electrode of an electronic device. The low light reflective film is formed on a surface of at least the bonding part of the first area to the board and its proximity.

Abstract: A method of enabling a circuit board analysis is disclosed. The method comprising removing a portion of the circuit board on a first side of the circuit board opposite a second side of the circuit board having an integrated circuit package; removing the circuit board from the integrated circuit package; performing a dye mapping to analyze bonds between the integrated circuit package and the circuit board; and performing an analysis of the integrated circuit package.