Abstract: An apparatus for chucking a workpiece to a worktable includes a plurality of magnetically activated vacuum flow check valves, which uses a magnet within its body, to block a port through which atmosphere can flow to a vacuum source. The magnet blocking the flow can be drawn off the port seat by positioning a second (activator) magnet in a cavity of the valve body proximal the first magnet. The resulting effect is the communication of a vacuum suction force from the vacuum source to the workpiece. The second (activator) magnet is preferably affixed to a bottom surface of a puck which, when received within a complementary structure on the valve assembly, serves as a chucking mechanism for securely holding a workpiece above the surface of the machining table during the machining operating.

Abstract: Apparatus and methods of automated wafer-grinding using grinding surface position monitoring. In one embodiment, an apparatus for grinding a working surface includes a grinding surface engageable with at least a portion of the working surface, and a feed mechanism that controllably adjusts a position of the grinding surface. The apparatus further includes a position sensor that senses a position of the grinding surface along an axis approximately normal to the working surface and a controller that receives a position signal from the position sensor and transmits a control signal to the feed mechanism in response to the position signal. In alternate embodiments, the position sensor may be an acoustic sensor, an optical sensor, or another type of sensor. The grinding surface may include a grinding material suspended in a binder, the grinding material being worn during grinding.

Abstract: A work holding fixture includes a support frame having a first and a second side member. The first and second side members are connected by a connecting member. Fixed to the first side member is a fixture brake, with a shaft rotatably mounted relative to the first side member. A brake barrel assembly is mounted to one of the first and second side members. The brake barrel assembly has a barrel portion fixed to one of the first and second side members, and has a backing plate rotatably mounted to the one of the first and second members, and is in axial alignment with the fixture brake shaft. The backing plate has a feature which slidably receives a first bracket. The first bracket is configured for attachment to a work piece received by the backing plate. A tail stock assembly, with a drum portion and a bracket guide, is rigidly mounted to the other of the first and second side members. The tail stock assembly slidably receives a second bracket.

Abstract: An apparatus for attaching an object semi-automatically onto a dummy wafer comprising a stage having a loading surface on which the dummy wafer rests, a pressing device for attaching the object gradually onto the dummy wafer placed on the loading surface, and a supporting device for placing the object in a position spaced apart from the loading surface.

Abstract: A method of joining sections of polishing pad for use in the chemical mechanical planarization of a semiconductor wafer. Two sections of polishing pad are positioned so that they contact one another. The two sections are then welded together to create a robust joint. The joint is resistant to infiltration of slurry and is not susceptible to delamination that commonly occurs in a typical laminate joint.

Abstract: A retainer for retaining an abrasive pad on a lens making machine and an abrasive pad adapted to such retention comprises a retainer nestable with a lap of a lens making machine wherein when such retainer is nested, a pad placed upon the lap before nesting will be trapped in the desired position. The pad of the invention includes radially outwardly extending members beyond the working area of the pad whose purpose is to be trapped by the retainer. The invention enables automatic loading and unloading of pads on the lens making machine.

Abstract: Provided are a wafer polishing method in which, in single side polishing, covering a wafer holding surface (one side surface) with a protective film, a wafer polishing surface (the other side surface) is polished, so that the wafer holding surface can be prevented from being etched and contaminated by a polishing agent; a wafer cleaning method in which the protective film that remains behind on the wafer holding surface after polishing can be efficiently removed, and a waste cleaning solution is easily treated; and a wafer protective film that sufficiently covers the wafer holding surface in polishing but is effectively removed in cleaning.

Abstract: A workpiece securing apparatus or clamp includes a piston, a coupling or transmission mechanism, and an unlock device. In another aspect of the present invention, the unlock device is rotatable to move the coupling mechanism. Still another aspect of the present invention provides a mechanism which converts linear movement of a piston to rotary motion of a hub and workpiece interfacing arm.

Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.

Abstract: A tool is provided for clamping, spreading and jacking activity and comprises rectangular, tubular extension bar members, which are used independently or are interconnected to establish a desired tool length. The extension bar members have a plurality of spaced positioning holes located at top bottom and sides along its length to provide length adjustments. Jaw members are selectively attached to the extension bar for force transmitting engagement with a structure or device. A power head having a tubular bar is provided with spaced shoulder members which provide support for a threaded actuator rod extending between them. A head jaw is disposed in moveable guided relation with the rectangular extension bar of the power head and is moved by a drive nut type actuator member which is in threaded relation with the threaded actuator rod and has driving engagement with the head jaw.

Abstract: A workholding device for holding a workpiece securely for machining. One embodiment comprises a V fixture. Embodiments of the present invention are designed to be versatile and to provide the ability to accomplish other tasks beyond workholding, for example, enabling the punching of parts, the dressing of diamond wheels, sharpening drills of a wide range of sizes, and enabling deep hole center drilling.

Abstract: A reamer with adjustable expansion/contraction and a bore finishing machine comprising the reamer. The reamer has a rotation shaft that is externally operable and a grinding section. The grinding section is cylindrically shaped, and has a plurality of axially-extending slits in its peripheral wall and a tapered inner surface. The rotation shaft is connected via threaded sections to a sliding shaft, which is in turn connected to a diameter expansion member consisting of a tapered cone fitted into the tapered inner surface of the grinding section. When the rotation shaft is operated to rotate, the rotational motion is converted into linear motion of the slide shaft due to a guide pin and a guide hole. The linear motion moves the diameter expansion member back and forth inside the grinding section, thereby contracting/expanding the outer diameter of the grinding section mechanically and precisely. The bore finishing machine has a hollow main rotation spindle, and a rotation spindle inside the same.

Abstract: An automatic riveting apparatus includes a base (10), a feeding device (30), and a riveting device (50). The base has a U-shaped support frame (12). Two photoelectric relays (18) extend upwardly from the base. The feeding device includes two parallel sliding rails (32), a lower die plate (36) for supporting a workpiece (80), and a feed cylinder (34) driving the lower die plate to slide along the rails. The riveting device has an upper cylinder (52) and a riveting head (58). In operation, the feed cylinder is started up to drive the lower die plate together with the workpiece to a riveting position. The lower die plate touches a photoelectric point (48) to actuate the upper cylinder. A piston rod (60) of the upper cylinder drives the riveting head downwardly to rivet the workpiece. The piston rod moves back up, and the lower die plate returns to its original position.

Abstract: The present invention is a tire valve tool for use in servicing valve stems in tubeless pneumatic tire rims. The tool may be used to install a valve stem into a tire rim and may also be used to extract a valve stem from the tire rim. The tool includes a clamping jaw assembly at one end of an elongated handle. A lever arm attached to one of the clamping jaws serves to provide both a fulcrum point for accomplishing a mechanical advantage in pulling on the valve stem and as a lever for applying a closing force to the jaw assembly in order to grip the valve stem. The clamping jaw assembly is shaped so that valve stems in rims with recessed valve stem openings can be grasped below the main rim surface without causing damage to the rim surface. The tool preferably incorporates a non-marring material for the fulcrum end of the lever in order to minimize damage to the rim surface.

Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a generally linear polishing sheet having an exposed portion extending over a top surface of the platen for polishing the substrate, and a drive mechanism to incrementally advance the polishing sheet in a linear direction across a top surface of the platen. The apparatus includes a hydrophobic layer for substantially preventing aqueous liquid which penetrates under the polishing sheet from wetting a lower surface of the polishing sheet. The polishing sheet is releasably secured to the platen to rotate with the platen, and it has a width greater than a diameter of the substrate.

Abstract: A method for installing and/or removing a cable (300) in conduits (500) for the passage of cables and to an associated implementing device. According to this method, a current of water is conveyed inside the conduits (500), the cable (300) to be installed has a conduit fill rate that can attain 90%, and the conduits (500) form a winding course on a length greater than 2000 m. This method is chiefly characterized in that the cable (300) is subjected to a thrust force that drives its speed of progression (v), and in that said thrust force and the pressure of the water flowing in the conduits are regulated so as to maintain a constant water flow rate inside the conduits (500).

Abstract: A cable block particularly adapted for use in the installation of aerial cable comprises a main frame member formed at its upper end with an inverted V-shaped strand engaging hanger section, at its lower end with a U-shaped pulley support section, and with a spring-biased, clamping clutch mechanism supported on the upper hanger section. The clutch mechanism comprises a uniquely dimensioned and configured pair of clamping jaws that are spring-biased together. The jaws grip the interposed strand in such a manner that axial movement of the cable block along the strand is permitted in either direction only when an axial moving force above a predetermined level is applied in that direction to the cable block.

Abstract: A polishing apparatus (100) and method for polishing and planarizing a substrate (105) is provided that achieves a high-planarization uniformity across the substrate. In one embodiment, the polishing head (140) includes a carrier (155), a subcarrier (160) carried by the carrier and adapted to hold the substrate (105) during a polishing operation and a retaining ring (170) rotatably disposed about the subcarrier. The retaining ring (170) has a lower surface (205) that is substantially flush with the surface of the substrate (105) and is in contact with a polishing surface (125) during the polishing operation. The retaining ring (170) is capable of rotating relative to the substrate (105) held on the subcarrier (160) to inhibit non-planar polishing of the surface of the substrate. In another embodiment, the polishing head (140) further includes a backing ring (210) in a facing relationship with an upper surface (255) of the retaining ring (170) and separated from the retaining ring by a bearing (260).

Abstract: A pressing machine for joining two workpieces includes a workbench (10), a rigging (30) providing periodical vertical movement, a pair of pressing devices (42) for impacting the workpieces, and a push apparatus (70). A wedge block (40) is secured under the rigging. The wedge block has two first slopes (48). The push apparatus includes a push block (70) with a second slope. A stop screw (26) is secured in the workbench. When the rigging is moved downwardly, the pressing devices impact the workpieces and the first slopes abut against the second slope. The push block is moved toward the workpieces, thereby pushing one workpiece to move relative to the other one. When the wedge block abuts the stop screw, the push block stops pushing the workpiece. The moving workpiece is completely engaged with hooks formed in the stationary workpiece at corresponding openings defined in the moving workpiece.

Abstract: A latch for securing a wafer to a clamp plate. The latch may include a bearing that couples a wheel to a horizontal shaft. The horizontal shaft is adapted to rotate relative to the clamp ring so that the wheel secures the wafer. The bearing minimizes the amount of particles generated by the moving components of the latch that may contaminant the wafer.