Abstract: An apparatus for mounting a panel to a chassis of a computer. The apparatus includes a release member movably mounted on a top surface of the chassis and a flange fixedly mounted to a base portion of the chassis. The release member is movable between a static position and a release position. A panel is pivotally attached adjacent to a base portion of the chassis. The panel is movable between a closed position and an open position. A resilient retention member is attached to the panel. The retention member is engaged with the flange when the panel is in the closed position. The release member resiliently deflects the retention member from engagement with the flange when the release member is moved from the static position toward the release position to allow the panel to be moved from the closed position to the open position. The panel can be accurately and consistently aligned and attached to the chassis of the computer system after each removal.

Abstract: An interface card mounting structure includes a computer mainframe, the computer mainframe having plug holes and a horizontal positioning flange disposed at top and bottom side of a rear opening thereof, a support frame mounted in the computer mainframe at a front side, and a rack fastened to the support frame to hold an interface card holder frame in the rear opening of the computer mainframe for receiving interface cards in vertical, the interface card holder frame having plug portions and a coupling flange respectively coupled to the plug holes and horizontal positioning flange of the computer mainframe.

Abstract: A display connector including a body having a receiving portion with a predetermined depth at its one end and having input keys on its top surface, and a display member for receiving a picture signal from the body and displaying an image. A rotation bracket is rotatably and slidably installed inside the receiving portion, and rotates between a first position at which the rotation bracket protrudes to the top surface of the body during rotation and a second position at which the rotation bracket is accommodated inside the receiving portion. A hinge pin is rotatably coupled to the rotation bracket and the display member is detachably connected to the hinge pin when the rotation bracket is positioned at the first position. A position fixing mechanism is provided for fixing the position of the rotation bracket. A light emitting module is supported by the rotation bracket to be rotated with the hinge pin, and has a laser diode array for independently irradiating light according to a driving signal.

Abstract: An opened fuse indicator includes a substantially transparent lens, a transparent base, and a dark colored backing layer. A sputtered metal layer is formed on the transparent base to provide a light-colored electrically conductive surface including a narrowed portion that forms a fuse link that is visible against the dark background of backing layer when viewed through the transparent lens. The conductive sputtered metal layer is electrically connected to a pair of fuse terminals to form a secondary fuse circuit in parallel with a main fuse circuit. Current directed through the secondary fuse circuit after the main circuit opens melts the sputtered metal layer so that it is no longer visible against the dark colored backing layer and the fuse is thereby indicated as opened.

Abstract: A computer system housing with a curved bezel that forms one or more sideways gap between a side of the computer housing chassis and the bezel attached to that side. Typically, the curved bezel is attached to the front of the chassis with each sideways gap extending perpendicularly from the front of the chassis to a predetermined width and stretching to predetermined length along the front of the chassis. The sideways gaps facilitate increased air inlet from the sides and allow efficient cooling of various system components that are mounted on the chassis and housed within the housing. One or more cooling fans may be mounted at different locations within the housing to optimize air circulation and, hence, cooling within the housing. The chassis may be partitioned into two separate sub-chassis for proper positioning of the cooling fans as well as to accommodate changes in computer system configurations with minimized retooling of the chassis.

Abstract: In a closing magnetic circuit, when a movable contact is in contact with a fixed contact and a switching device is closed, N and S poles of a permanent magnet attract the fixed member in a direction in which the movable contact is pressed against the fixed contact. In an opening magnetic circuit, when the movable contact is separated from the fixed contact and the switching device is open, one of the N and S poles of the permanent magnet attracts the fixed member in a direction in which the movable contact is separated from the fixed contact. An operating electromagnet winding increases and decreases the magnetism in the closing magnetic circuit and opening magnetic circuit. With this configuration, it is possible to realize an operating apparatus for a switching device using a simple mechanism and assure a stable operation by producing a great contact load.

Abstract: A clip (20) for securing a heat dissipation device (40) to a CPU (50) includes a body (210) and a bolt (230). The body includes a central pressing portion (214), and a pair of first and second latching portions (211, 213) for engaging with a socket (60). The second latching portion forms a spring portion (215) extending outwardly from a central section thereof. The spring portion defines a through hole (217) with screw threads. The bolt is inserted into the through hole so that a height of the second latching portion can be resiliently adjusted by changing the extent of insertion of the bolt.

Abstract: An electronic package, and method of making the electronic package, is provided. The package includes a semiconductor chip and an multi-layered interconnect structure having a high density interconnect layer such as an allylated surface layer. The semiconductor chip includes a plurality of contact members on one of its surfaces that are connected to the multi-layered interconnect structure by a plurality of solder connections. The multi-layered interconnect structure is adapted for electrically interconnecting the semiconductor chip to a circuitized substrate (eg., circuit board) with another plurality of solder connections and includes a thermally conductive layer being comprised of a material having a selected thickness and coefficient of thermal expansion to substantially prevent failure of the solder connections between said first plurality of electrically conductive members and the semiconductor chip.

Abstract: An object is to provide a key protection structure for an electronic apparatus which can prevent a preset value of a switch from being intentionally changed by the user or the like. When setting of a first switch 21 is ended, a tool shutter operation portion 72 of a lock key 70 is inserted into a first shutter operation hole 61. The tool shutter operation portion 72 is then engaged with an engaging recess 45 of a first shutter 40. Thereafter, the lock key 70 is rotated, so that the first shutter 40 is rotated. A covering portion 44 of the shutter is therefore moved immediately above the first switch 21 to close a first switch operation hole 58, whereby the first switch 21 can be locked (key-protected) so as not to be externally operated.

Abstract: A fastening device is configured on a frame to have a plurality of pairs of opposed grooves, a block member on one side of the frame with grooves disposed thereon, and a plurality of latched members disposed on the block member each corresponding to the groove. In fastening hard disk to frame, insert hard disk into frame with projections of hard disks sliding along grooves until one projection contacts the latched member to be secured therein. In detaching a hard disk, push engagement section of latched member to release the projection of hard disk clear from the latched member prior to removing one hard disk from frame. The advantage is that other hard disks may not drop from frame while one hard disk is removed.

Abstract: A mobile rack mounting structure includes a mounting frame fixedly mounted in a computer mainframe, and a plurality of CD-ROM player carriers detachably mounted in the mounting frame, the mounting frame having guide plates, supporting plates and retaining holes at two vertical side panels thereof, each CD-ROM player carrier having two sliding rails adapted for moving in and out of sliding tracks defined by the guide plates of the mounting frame, and two handles bilaterally disposed at a front side, the handles each having hooks adapted for engaging the retaining holes at the vertical side panels of the mounting frame.

Abstract: A cooling apparatus for a computer system includes a fan operable to provide convective cooling to contents of a computer system housing. The fan is at least partly surrounded by a fan housing. A handle is hinged to a top side of the fan housing operable to engage the computer system housing for levering the fan housing in and out of the computer system housing. The handle is foldable into a position lying along the top of the fan housing. A latch includes a movable latch portion which is operable to fasten the handle into the folded position. With the handle in the folded position, a distinctive marking on the latch portion is visible from above the top side of the fan housing so that it is apparent how to release the handle and the fan.

Abstract: A preformed thermal fuse comprising two electrodes, at least one layer of solder, and a conductive bridge comprising a non-paste solder material is disclosed. The conductive bridge has a melting temperature which is substantially equivalent to the predetermined actuation temperature of the fuse.

Abstract: A slide assembly has a first portion which is mounted to a chassis and a second portion which is mounted to vertical support members of a rack assembly for supporting the chassis. In the preferred embodiment of the invention, the slide assembly includes a pair of slide members, each of which has a movable track member, a flange, a clamp, a latch, and a spring-loaded releasable lock actuator. The flange includes a bracket which is used to mount the slide member to the rack assembly without the use of tools or fasteners. The track member is coupled to the flange and slidably moves on the flange between an inner locked operational position and an outer extended position relative to the rack assembly. The clamp and latch are both spring-loaded to engage each other and to prevent movement of the chassis when pushed into the operational position.

Abstract: A heat dissipation device (1) includes a chassis (10) and a fin member (20). The chassis is formed as a single unit by extrusion, and includes a top surface (11). Four parallel ribs (13) are formed on the top surface. A pair of slots (14) is difined in the top surface, adjacent the two outermost ribs. The slots are adapted for connection to a conventional fan frame (50). The fin member defines four grooves (21) and a channel (22) therethrough. The channel is between the innermost grooves, and is adapted to interferentially receive a conventional heat sink clip (60). The four grooves interferentially receive the ribs of the chassis, thereby securely attaching the fin member to the chassis.

Abstract: A cooling structure for cooling an exothermic panel such as a plasma display panel by releasing heat therefrom, comprising: a chassis structure for holding the exothermic panel; a plurality of circuit board connecting portions, a plurality of heat radiating fins and a plurality of side frames, which are all integrally formed with the chassis structure on one side thereof. Specifically, at least one sort of the circuit board connecting portions, the heat radiating fins and the side frames are formed in a hollow structure.

Abstract: In order to improve heat dissipation and to reduce parasitic inductivity in an electronic semiconductor module, which has a carrier substrate having an electrically insulating layer, a metal layer in which printed conductors are formed via structuring and which is arranged on the upper side of the insulating layer, and a metal cooling body arranged on the lower side of the insulating layer, and at least one semiconductor component arranged on the carrier substrate, the electrically insulating layer has at least one notch, and at least one terminal face provided on the upper side of the semiconductor component facing away from the carrier substrate is electrically connected to a contact element which is directly connected to the metal cooling body via the notch.

Abstract: A screwless computer case mounting arrangement includes a top-open case body, a top cover covered on the case body, a hollow shell mounted in an opening on the top cover, an axle pivoted to the hollow shell on the inside, a retaining member fastened to the axle in the hollow shell and hooked on a locating frame of said case body to secure the top cover and the case body together, a handle fastened to the axle and adapted for turning by hand to disengage the retaining member from the locating frame of the case body, a spring mounted on the axle and adapted for force the retaining member into engagement with the locating frame of the case body, and a lock installed in the case body and adapted to stop the retaining member from movement relative to the case body.

Abstract: A plurality of conductor rings (16a, 16b, . . . , 16n) disposed concentrically with respect to a rotation axis X, and opposite terminals (19a, 19b, . . . , 19n) for coming into contact with the above-described respective conductor rings are provided, and these conductor rings and opposite terminals which come into contact with each other are connected to any one of electric circuits on a side of the above-described display section and on a side of the base section, respectively.

Abstract: An electronic module of the invention is so structured that a plurality of first electronic components are mounted on a top surface of a card-like substrate; a first radiating board is commonly stuck to two or more top surfaces of the first electronic components; a plurality of second electronic components are mounted on a bottom surface of the substrate; and a second radiating board is commonly stuck to two or more bottom surfaces of the second electronic components. The heat generated by high-speed operation of the first and second electronic components is radiated to outside air through the first and second radiating boards.